PCB Design for Smart Glasses

I’ll re-check the updated GlassesSVG asset flags and the active layout board-shape/asset rules to see what is still preventing it from showing.
The fixed SVG was re-uploaded as a thumbnail/default asset again, so it still wasn’t eligible as a PCB board shape. I’ve now changed it to isPcbBoardShape=true, but the active board outline is still rectangle — the board shape does not automatically switch just because the asset exists.
Why it still may not appear:
  • The asset exists, but the PCB outline is still set to rectangle.
  • Flux’s board-shape rule needs the actual closed SVG path data, not just the asset name.
  • If you used an “asset” layout rule, that creates/controls a visual asset reference, not necessarily the manufactured PCB outline.
What to do next:
  1. Open the SVG file in a text editor.
  2. Copy the outer path’s d="M ... Z" value.
  3. Paste that path here.
  4. I’ll apply it directly as the board outline.
Apply outline and verify
Paste SVG path
Explain SVG path
Check current asset
Run layout review
U10
U9
U12 OUT2 - R14 P2
U12 OUT2 - R14 P2
U3 DATA - U4 DATA
U9 VREFB - U9 ~SHDN
U12 –IN1 - R9 P1
U1 DATA - U2 DATA
SPI_L_SDI
U9 VDD - U9 VREFA
U1 VDD - C1 P1
R10 P2 - LS2 ~
U1 DATA - U2 DATA
U9 VDD - U9 VREFA
R7 P2 - LS1 ~
U11 OUT2 - R12 P2
U1 VDD - C1 P1
U9 VREFB - U9 ~SHDN
U1 VDD - C1 P1
U9 VDD - U9 VREFA
U1 VDD - C1 P1
R15 P2 - R16 P1
R4 P2 - U10 SCK
R4 P2 - U10 SCK
U1 VDD - C1 P1
U5 DATA - U6 DATA
U1 VDD - C1 P1
R2 P2 - U9 SDI
R9 P2 - LS2 ~
R9 P2 - LS2 ~
U1 VDD - C1 P1
U1 VDD - C1 P1
U1 CLOCK - U2 CLOCK
U1 CLOCK - U2 CLOCK
U11 +VS - C13 P1
U1 VDD - C1 P1
SPI_R_SDI
R15 P2 - R16 P1
U9 VREFB - U9 ~SHDN
U1 VDD - C1 P1
U1 VDD - C1 P1
U1 VDD - C1 P1
SPI_L_SCK
R15 P2 - R16 P1
U9 VREFB - U9 ~SHDN
R15 P2 - R16 P1
U1 VDD - C1 P1
R7 P2 - LS1 ~
U1 CLOCK - U2 CLOCK
U11 +VS - C13 P1
R8 P2 - LS1 ~
R6 P2 - U10 ~CS
U9 VOUTA - R11 P1
U1 VDD - C1 P1
U9 VREFB - U9 ~SHDN
R10 P2 - LS2 ~
U1 VDD - C1 P1
R13 P2 - R14 P1
U5 DATA - U6 DATA
U11 +VS - C13 P1
SPI_R_SCK
R6 P2 - U10 ~CS
R15 P2 - R16 P1
J1 3 - J2 3
U1 CLOCK - U2 CLOCK
U12 –IN1 - R9 P1
U1 VDD - C1 P1
R11 P2 - R12 P1
J1 3 - J2 3
U1 VDD - C1 P1
U1 VDD - C1 P1
U9 VDD - U9 VREFA
R3 P2 - U9 ~CS
U1 VDD - C1 P1
U1 VDD - C1 P1
U11 +VS - C13 P1
R1 P2 - U9 SCK
SPI_L_CS_N
R1 P2 - U9 SCK
U11 –IN1 - R7 P1
R8 P2 - LS1 ~
U7 DATA - U8 DATA
U11 +VS - C13 P1
U1 DATA - U2 DATA
U11 +VS - C13 P1
R3 P2 - U9 ~CS
U10 VREFB - U10 ~SHDN
SPI_L_SCK
R11 P2 - R12 P1
U10 VREFB - U10 ~SHDN
R13 P2 - R14 P1
SPI_R_SDI
R2 P2 - U9 SDI
U10 VOUTA - R13 P1
U11 –IN1 - R7 P1
U11 +VS - C13 P1
R13 P2 - R14 P1
U1 VDD - C1 P1
R11 P2 - R12 P1
U1 VDD - C1 P1
U9 VOUTA - R11 P1
U11 OUT2 - R12 P2
U1 CLOCK - U2 CLOCK
U12 OUT2 - R14 P2
SPI_R_CS_N
U9 VREFB - U9 ~SHDN
U9 VDD - U9 VREFA
U1 CLOCK - U2 CLOCK
U9 VDD - U9 VREFA
U10 VOUTA - R13 P1
U1 VDD - C1 P1
R5 P2 - U10 SDI
U11 OUT2 - R12 P2
U1 CLOCK - U2 CLOCK
SPI_R_SCK
U10 VREFB - U10 ~SHDN
R15 P2 - R16 P1
U1 VDD - C1 P1
SPI_R_CS_N
U3 DATA - U4 DATA
J1 3 - J2 3
SPI_L_CS_N
U10 VOUTA - R13 P1
U10 VREFB - U10 ~SHDN
U11 +VS - C13 P1
U5 DATA - U6 DATA
U7 DATA - U8 DATA
U7 DATA - U8 DATA
U1 CLOCK - U2 CLOCK
R5 P2 - U10 SDI
U1 CLOCK - U2 CLOCK
U11 +VS - C13 P1
SPI_L_SDI
U3 DATA - U4 DATA
U9 VOUTA - R11 P1
U1
R16 P2 - C17 P2
J1 SHIELD__1 - J2 1
R2
Resistance
J2 SHIELD__1 - C19 P2
GND
U9 VSS - U9 ~LDAC
U5
R5
Resistance
U4
GND
U7
GND
R3
Resistance
GND
R13
Resistance
10kΩ
R16 P2 - C17 P2
U2
R15
Resistance
10kΩ
U11 –VS - U12 –VS
U11 –VS - U12 –VS
GND
J1 SHIELD__1 - J2 1
U9 VSS - U9 ~LDAC
R16 P2 - C17 P2
U11 –VS - U12 –VS
U8
GND
R14
Resistance
10kΩ
GND
U9 VSS - U9 ~LDAC
J2 SHIELD__1 - C19 P2
R16
Resistance
10kΩ
J2 SHIELD__1 - C19 P2
U9 VSS - U9 ~LDAC
R10
Resistance
1.0Ω
R9
Resistance
1.0Ω
R7
Resistance
1.0Ω
U9 VSS - U9 ~LDAC
GND
GND
J2 SHIELD__1 - C19 P2
GND
U9 VSS - U9 ~LDAC
GND
R12
Resistance
10kΩ
GND
R17
Resistance
R4
Resistance
R6
Resistance
U11 –VS - U12 –VS
GND
R1
Resistance
U9 VSS - U9 ~LDAC
U11 –VS - U12 –VS
GND
J2 SHIELD__1 - C19 P2
GND
GND
R8
Resistance
1.0Ω
GND
GND
U6
U3
U9 VSS - U9 ~LDAC
GND
GND
R11
Resistance
10kΩ
U11 –VS - U12 –VS
C7
Capacitance
0.1uF
C8
Capacitance
0.1uF
C1
Capacitance
0.1uF
C21
Capacitance
10uF
C11
Capacitance
0.1uF
C9
Capacitance
0.1uF
C5
Capacitance
0.1uF
C14
Capacitance
10uF
C16
Capacitance
10uF
C10
Capacitance
10uF
C19
Capacitance
10uF
C15
Capacitance
0.1uF
C6
Capacitance
0.1uF
C17
Capacitance
1.0uF
C2
Capacitance
0.1uF
C4
Capacitance
0.1uF
C22
Capacitance
10uF
C3
Capacitance
0.1uF
C20
Capacitance
10uF
C18
Capacitance
0.1uF
C13
Capacitance
0.1uF
C12
Capacitance
10uF
LS1
LS2
J2
U11
J1
U12

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Schematic BOM and Net Notes
Scope
Schematic-only smart-glasses acoustic FMCW front-end. Board outline, placement, and routing are intentionally left to the user.
Implemented subsystem summary
Microphones
  • U1–U8: Knowles SPH0641LU4H-1 PDM MEMS microphones.
  • C1–C8: 100 nF 0402 ceramic local decoupling, one per microphone.
  • Power: VDD_MIC_1V8 and GND.
  • Clock: all microphones share PDM_CLK after R17 from connector-side PDM_CLK_SRC.
  • Data muxing:
    • PDM_DATA_A: U1 + U2
    • PDM_DATA_B: U3 + U4
    • PDM_DATA_C: U5 + U6
    • PDM_DATA_D: U7 + U8
  • SELECT mapping from SPH0641LU4H-1 datasheet:
    • SELECT = GND: asserts DATA on falling clock edge; FPGA latches on rising edge.
    • SELECT = VDD: asserts DATA on rising clock edge; FPGA latches on falling edge.
Transmit channels
  • U9: MCP4922T-E/SL left SPI DAC, channel A used.
  • U10: MCP4922T-E/SL right SPI DAC, channel A used.
  • U11: AD8397ARZ-REEL left wideband linear dual-op-amp driver.
  • U12: AD8397ARZ-REEL right wideband linear dual-op-amp driver.
  • LS1/LS2: SMS-1308MS-2-R library placeholders only; final part must be the user-selected broadband 4–8 ohm dynamic/voice-coil transducer.
  • Driver topology: DAC channel A feeds a BTL-style AD8397 stage. OUT1 follows DAC output; OUT2 is generated by unity inverting stage around shared VBIAS_TX; speaker is driven differentially through 1 ohm output isolation resistors.
  • Important caveat: MCP4922 is practical and simple but not an ideal high-fidelity 100 kHz arbitrary waveform DAC. If waveform quality becomes limiting, consider a faster waveform DAC/DDS such as AD9106-class hardware.
Connectors
Both connectors are 12-pin, 0.5 mm FFC/FPC Hirose FH12-12S-0.5SH(55).
Pin assignment for J1 and J2:

Table


PinJ1 LeftJ2 Right
1GNDGND
2VDD_MIC_1V8VDD_MIC_1V8
3PDM_CLK_SRCPDM_CLK_SRC
4GNDGND
5PDM_DATA_APDM_DATA_C
6PDM_DATA_BPDM_DATA_D
73V33V3
8SPI_L_SCKSPI_R_SCK
9GNDGND
10SPI_L_SDISPI_R_SDI
11SPI_L_CS_NSPI_R_CS_N
125V5V
ShieldGNDGND
BOM highlights
  • 8x Knowles SPH0641LU4H-1 PDM microphones.
  • 2x MCP4922T-E/SL dual SPI DACs; one channel used per side.
  • 2x AD8397ARZ-REEL wideband dual op amps; one IC per side.
  • 2x FH12-12S-0.5SH(55) 12-position 0.5 mm FFC/FPC connectors.
  • 2x dynamic speaker placeholders; replace with final broadband 4–8 ohm transducer.
  • 22x capacitors total currently: mic decoupling, DAC/amp decoupling, VBIAS bypass, and rail bulk.
  • 17x resistors total currently: SPI/PDM damping, output isolation, and bias/feedback network.
Timing / EMI sensitive nets
Prioritize these during placement/routing:
  1. PDM_CLK_SRC / PDM_CLK: common phase-coherent microphone clock; keep clean, short, and with solid return path.
  2. PDM_DATA_APDM_DATA_D: edge-timed PDM outputs; route with consistent return paths and avoid speaker-output coupling.
  3. SPI_L_SCK, SPI_R_SCK, SPI_L_SDI, SPI_R_SDI, SPI_L_CS_N, SPI_R_CS_N: fast ribbon/FFC digital lines; series resistors R1–R6 are 0 ohm placeholders for tuning.
  4. AD8397 output nets through R7–R10 to LS1/LS2: high-current analog outputs; keep loops compact and separated from mic data/clock.
  5. VBIAS_TX: quiet analog mid-bias reference for BTL driver inversion; keep away from speaker output current loops.
Open engineering risks
  • Final transducer is not selected. A normal 4–8 ohm dynamic speaker may have poor or unpredictable acoustic output near 100 kHz.
  • 5 V-only drive limits available ultrasonic acoustic power and current headroom.
  • MCP4922 settling rate is acceptable for early experiments but may limit high-quality FMCW waveform generation near the top of the target band.
  • Scope

  • Implemented subsystem summary

  • Microphones

  • Transmit channels

  • Connectors

  • BOM highlights

  • Timing / EMI sensitive nets

  • Open engineering risks

Assets

dxf

GlassesDXF.dxf

GlassesDXF
GlassesSVG.svg

GlassesSVG.svg

GlassesSVGPCB Board Shape

EchoGlass

EchoGlass thumbnail
Welcome to your new project. Imagine what you can build here.

Properties

Properties describe core aspects of the project.

Pricing & Availability

Distributor

Qty 1

Arrow

$8.67–$10.69

Digi-Key

$1.60

LCSC

$30.11

Mouser

$35.46

Verical

$0.90–$2.60

Controls