Stackup Templates
Jumpstart your PCB projects with stackup project templates from leading manufacturers like JLCPCB, AISLER, OSHPARK, and Seeed Studio. These templates are ideal for all skill levels, offering detailed stackups, material specifications, and layer configurations customized to each manufacturer's process. Significantly, these templates integrate manufacturers' constraints as global rules, streamlining the design to align with efficient production workflows. Whether you're working on high-speed digital, RF designs, or standard multi-layer boards, these templates lay a solid groundwork. Stay ahead in PCB design with Flux.ai community-driven library, constantly updated with the latest technology and industry standards. Leverage these top manufacturers' stackup project templates for sophisticated and reliable PCB design
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To optimize your 4-layer board manufacturing process with Seeed Studio Fusion, utilize this comprehensive template. It incorporates a majority of the essential manufacturing constraints as global rules, ensuring a smoother and more efficient production workflow. #project-template #template #manufacturer-design-rules This project is a vessel monitoring system built using Seeed Studio Xiao Sense, Xiao Expansion Board with OLED, a UART WiFi module, a normally open float switch, and a UART SIM800L cellular module. The system displays a 30-second countdown on the OLED screen, calibrates the IMU sensor, converts to Euler angles, and stores these values for comparison with future readings. It also sets up the WiFi module as an access point to configure the vessel's name, contact numbers, and angle thresholds for list and trim notifications. Reports are sent at specified times via the cellular module.
0 Uses0 Stars[4-layer] OSHPARK Constraints ayg8
Use this template if you're planning to get your board manufactured in OSHPARK. It has the via min/max and trace width constraints already baked as global rules. #project-template #template #manufacturer-design-rules OSHpark 4-layer stackup specs: Top overlay or silkscreen: 1 mil thick Top solder mask or solder resist: 1 mil thick Top copper: 1.7 mil thick on 1 oz copper Dielectric: 7.96 mil thick FR408HG 2113 Mid layer 1: 0.68 mil thick on 0.5 oz copper Dielectric core: 39 mil thick FR408HR Mid layer 2: 0.68 mil thick on 0.5 oz copper Dielectric: 7.96 mil thick FR408HG 2113 Bottom copper: 1.7 mil thick on 1 oz copper Bottom solder mask or solder resist: 1 mil thick Bottom overlay or silkscreen: 1 mil thick
0 Uses0 Stars[4-layer] OSHPARK Constraints
Use this template if you're planning to get your board manufactured in OSHPARK. It has the via min/max and trace width constraints already baked as global rules. #project-template #template #manufacturer-design-rules OSHpark 4-layer stackup specs: Top overlay or silkscreen: 1 mil thick Top solder mask or solder resist: 1 mil thick Top copper: 1.7 mil thick on 1 oz copper Dielectric: 7.96 mil thick FR408HG 2113 Mid layer 1: 0.68 mil thick on 0.5 oz copper Dielectric core: 39 mil thick FR408HR Mid layer 2: 0.68 mil thick on 0.5 oz copper Dielectric: 7.96 mil thick FR408HG 2113 Bottom copper: 1.7 mil thick on 1 oz copper Bottom solder mask or solder resist: 1 mil thick Bottom overlay or silkscreen: 1 mil thick
0 Uses0 Stars