Interface ICs

802.15.4, Bluetooth, WiFi 802.11a/b/g/n/ac/ax, Bluetooth v5.3, Zigbee® Transceiver Module 2.4GHz, 5GHz Antenna Not Included, U.FL/MHF, PCB Trace Surface Mount The LBES5PL2EL-923 is a compact, low-power Bluetooth® Low Energy (BLE) module developed by Murata. It integrates a Nordic Semiconductor SoC (nRF52 series) with an onboard antenna, providing a complete RF solution for wireless connectivity in embedded systems. The module is designed for IoT, wearable, and low-power wireless applications, offering reliable communication, small footprint, and minimal external component requirements. Key Features Integrated Bluetooth® Low Energy (BLE) 5.x compliant module Based on Nordic Semiconductor nRF52 series SoC Built-in chip antenna (no external antenna required) Ultra-low power consumption suitable for battery-powered devices Integrated RF matching and shielding Supports multiple BLE roles (Central, Peripheral, Broadcaster, Observer) Compact surface-mount package Pre-certified RF module (reduces certification effort) Electrical Characteristics Supply Voltage Operating Voltage: 1.7 V to 3.6 V Current Consumption TX Mode: ~5–10 mA (depending on output power) RX Mode: ~5 mA Sleep Mode: < 2 µA RF Characteristics Frequency Band: 2.4 GHz ISM (2400–2483.5 MHz) Output Power: up to +4 dBm Sensitivity: approx. -96 dBm Interfaces UART SPI I²C (TWI) GPIO (multiplexed) ADC inputs PWM Mechanical Specifications Package Type: Surface Mount Module (SMD) Dimensions: ~10 mm × 7 mm × 1.4 mm (approx.) Integrated antenna and shielding Environmental Ratings Operating Temperature: -40°C to +85°C Storage Temperature: -40°C to +125°C Compliance & Certifications Bluetooth SIG qualified FCC / IC / CE (module-level certification, varies by variant) RoHS compliant Applications IoT devices Wearables Smart home products Wireless sensors Industrial monitoring systems Pin Configuration (Summary) Power: VDD, GND Communication: UART, SPI, I²C GPIOs: Configurable digital I/O RF: Integrated antenna (no RF pin required) Design Considerations Follow recommended PCB layout for antenna clearance Avoid copper under antenna region Provide stable power supply with proper decoupling capacitors Ensure proper grounding for RF performance #commonpartslibrary #integratedcircuit #transceiver #wireless #rf

Connector Header Through Hole 6 position 0.100" (2.54mm) The PEC06SAAN is a compact, low-cost incremental rotary encoder manufactured by Bourns. It is designed for user interface applications requiring precise rotational input, such as volume controls, menu navigation, and position sensing. This encoder provides reliable quadrature output signals and is suitable for through-hole PCB mounting. Its robust mechanical design ensures long operational life and consistent performance in consumer and industrial electronics. Key Features Incremental (relative) rotary encoder Compact, space-saving design Through-hole mounting configuration Quadrature output (A and B channels) Optional integrated push switch (depending on variant) Detent and non-detent options available High reliability with long rotational life RoHS compliant Electrical Characteristics Supply voltage: Typically 5 VDC (logic-level output) Output type: Digital quadrature (A/B signals) Contact resistance: ≤ 100 mΩ Insulation resistance: ≥ 100 MΩ @ 250 VDC Dielectric strength: 300 VAC for 1 minute Mechanical Characteristics Rotation type: Incremental Number of pulses per revolution (PPR): Typically 6 to 24 (variant dependent) Detent positions: Variant dependent Rotational torque: 10 to 70 gf·cm (typical range) Shaft length: Varies by suffix (e.g., 15 mm typical) Shaft type: Knurled or D-cut (variant dependent) Mounting type: Through-hole PCB Terminal type: PC pins Environmental Specifications Operating temperature range: −30°C to +70°C Storage temperature range: −40°C to +85°C Humidity: Up to 85% RH (non-condensing) Mechanical Life Rotational life: Up to 30,000 cycles (typical) Physical Dimensions Body size: Approximately 12 mm × 11 mm × 5 mm (excluding shaft) Shaft diameter: Typically 6 mm Pin pitch: Standard 2.54 mm Applications Consumer electronics (audio controls, appliances) Industrial control panels Embedded systems and microcontroller interfaces Automotive user interfaces Instrumentation and test equipment #commonpartslibrary #connector #header

Digital Potentiometer 100k Ohm 1 Circuit 256 Taps SPI Interface 10-MSOP

2 Line Common Mode Choke Surface Mount 100mA DCR 3Ohm (Typ) , -55C ~ 125C The ECMF2-40A100N6 and ECMF4-40A100N10 are highly integrated common mode filters designed to suppress EMI/RFI common mode noise on high speed differential serial buses like HDMI 2.1, HDMI 2.0, HDMI1.4, USB4, USB 3.2 Gen 2, USB 2.0, ethernet, MIPI, Display Port and other high speed serial interfaces. They have a very large differential bandwidth to comply with these standards and can also protect and filter one or two differential lanes. 10.7 GHz differential bandwidth to comply with HDMI 2.1, HDMI 2.0, HDMI 1.4, USB4, USB 3.2 Gen2, USB 2.0, MIPI, Display port 2.0, etc. • High common mode attenuation on WLAN frequencies: – -15 dB at 2.4 GHz – -21 dB at 5.0 GHz – -17 dB at 6.0 GHz • Low serial resistance: 3.0 Ω • Very low PCB space consumption • Thin package: 0.5 mm max. • High reduction of parasitic elements through integration • Lead free and RoHS package • Exceeds IEC 61000-4-2 level 4 standard: – Contact discharge: ◦ ±9 kV (contact discharge, ECMF2-40A100N6) ◦ ±10 kV (contact discharge, ECMF4-40A100N10) – Air discharge: ◦ ±20 kV (air discharge, ECMF2-40A100N6) ◦ ±25 kV (air discharge, ECMF4-40A100N10)

9V LED blinker with added USB Type-C interface and STM32 microcontroller for future USB communication/programming

100 Position Connector Receptacle, Center Strip Contacts Surface Mount Gold It is a 100-pin surface-mount receptacle connector used to connect two PCBs in a stacked configuration. The DF40HC series is known for ultra-fine pitch and high-speed signal capability, making it suitable for modern embedded and communication systems. Connector type: Board-to-board (mezzanine), receptacle Number of contacts: 100 positions (2-row layout) Pitch: 0.4 mm (very fine pitch for high-density routing) Stacking height: 3.0 mm (fixed mated height) Mounting: Surface-mount (SMT) Orientation: Straight Contact plating: Gold (for reliable conductivity and corrosion resistance) Rated current: 0.3 A per contact Rated voltage: 50 V AC/DC Contact resistance: ≤ 90 mΩ Withstanding voltage: 150 V max High-speed capability: up to 20 Gbps, supports interfaces like: USB 3.1 / USB 3.0 PCIe SATA MIPI Connector size: Length: ~22.6 mm Width: ~3.38 mm Height: ~2.9 mm Mating durability: ~30 cycles Operating temperature: -55°C to +85°C #CommonPartsLibrary #Connector #Mezzanine-connector #DF40

Pressure Sensor -0.07PSI ~ 0.07PSI (-0.5kPa ~ 0.5kPa) Differential Male - 0.08" (2.00mm) Tube, Dual 16b 16-SMD Module, Dual Top Ports The SDP31-500PA belongs to the SDP3x series and uses Sensirion’s CMOSens® technology to deliver accurate and stable pressure measurements. It is optimized for applications where small size, fast response, and high accuracy are critical. This sensor measures bidirectional differential pressure up to ±500 Pa, making it suitable for airflow and gas flow monitoring systems. It provides a fully calibrated, temperature-compensated digital output via I²C, simplifying integration with microcontrollers. Pressure type: Differential (±500 Pa range) High accuracy: حوالي ±3% of measured value Digital output: I²C interface with 16-bit resolution Fast response time: suitable for real-time measurements No zero-point drift: ensures long-term stability Compact size: ~8.5 × 5.5 × 5.15 mm Low voltage operation: typically 3.0–3.6 V Temperature compensated: reliable from −40°C to +85°C #CommonPartsLibrary #Sensor #SDP3x

70 Position Connector Receptacle, Center Strip Contacts Surface Mount Gold It is a 70-position, surface-mount receptacle connector with a 0.4 mm pitch, intended for stacking two PCBs with a 3.0 mm mated height. The connector belongs to the DF40 series, which is optimized for miniaturized, high-speed, and reliable interconnections in space-constrained applications. Connector type: Receptacle (female), board-to-board / mezzanine Number of contacts: 70 pins (2 rows) Pitch: 0.4 mm (fine pitch, high density) Mounting: Surface Mount Technology (SMT) Stacking height: 3.0 mm Contact plating: Gold (ensures reliable conductivity and durability) Rated current: ~0.3 A per contact Rated voltage: up to 50 V AC/DC Operating temperature: approx. –55 °C to +85 °C Durability: ~30 mating cycles Compact, low-profile design for thin devices High-speed signal capability (supports interfaces like USB, MIPI, PCIe) Self-alignment feature to improve mating accuracy Strong contact force with wipe action for stable electrical connection Shock absorption and solder wicking prevention for reliability #CommonPartsLibrary #Connector #DF40

7.2VA Power Transformer 3.3V Primary 6V Secondary Chassis Mount The DA2304-ALD is a compact surface-mount isolation power transformer manufactured by Coilcraft. It is designed primarily for low-voltage DC/DC converter applications, especially in circuits that require galvanic isolation. It is commonly used together with ICs like isolated power drivers (e.g., SN6501) to generate isolated power rails. Type: Isolation / power transformer Mounting: Surface-mount (SMT) Primary Voltage: 3.3 V Secondary Voltage: 6 V (typical) Power Rating: ~7.2 W Turns Ratio: 1 : 2.2 Isolation Voltage: up to 2500 Vrms Windings: Dual primary and dual secondary Core Material: Ferrite Operating Temp: −40°C to +125°C Isolated DC/DC converters Industrial communication interfaces (RS-485, CAN, etc.) Medical or safety-isolated systems Powering isolated gate drivers or transceivers Small footprint (~10 × 8 mm, low profile ~6 mm) #Transformer

System On Chip (SOC) IC It integrates multiple processing units including CPUs, DSPs, AI accelerators, and GPU into a single chip to handle vision processing, deep learning, sensor fusion, and real-time control in automotive and industrial systems. • C7x floating point, vector DSP, up to 1.0GHz, 80 GFLOPS, 256 GOPS • Deep-learning matrix multiply accelerator (MMA), up to 8 TOPS (8b) at 1.0GHz • Vision Processing Accelerators (VPAC) with Image Signal Processor (ISP) and multiple vision assist accelerators • Depth and Motion Processing Accelerators (DMPAC) • Dual 64-bit Arm® Cortex®-A72 microprocessor subsystem at up to 2.0GHz – 1MB shared L2 cache per dual-core Cortex®- A72 cluster – 32KB L1 DCache and 48KB L1 ICache per Cortex®-A72 core • Six Arm® Cortex®-R5F MCUs at up to 1.0GHz – 16K I-Cache, 16K D-Cache, 64K L2 TCM – Two Arm® Cortex®-R5F MCUs in isolated MCU subsystem – Four Arm® Cortex®-R5F MCUs in general compute partition • Two C66x floating point DSP, up to 1.35GHz, 40GFLOPS, 160GOPS • 3D GPU PowerVR® Rogue 8XE GE8430, up to 750MHz, 96GFLOPS, 6Gpix/sec • Custom-designed interconnect fabric supporting near max processing entitlement Memory subsystem: • Up to 8MB of on-chip L3 RAM with ECC and coherency – ECC error protection – Shared coherent cache – Supports internal DMA engine • External Memory Interface (EMIF) module with ECC – Supports LPDDR4 memory types – Supports speeds up to 4266MT/s – 32-bit data bus with inline ECC • General-Purpose Memory Controller (GPMC) • 512KB on-chip SRAM in MAIN domain, protected by ECC #CommonPartsLibrary #IntegratedCircuit