Memory
A memory IC, or integrated circuit, is a type of electronic device that stores and retrieves data. It is used in a wide range of electronic devices, including computers, smartphones, and other electronic devices. Memory ICs come in a variety of types, including DRAM, SRAM, and Flash memory, and are used for different purposes depending on the device and application. One of the primary use cases for memory ICs is in computer systems, where they are used to store data and instructions that are accessed by the processor. Memory ICs are also used in a variety of other electronic devices, such as digital cameras, MP3 players, and mobile phones, to store data and enable various functions. Flux.ai has the world's largest community-driven public library of memory ICs, with a wide variety of footprints, symbols, datasheets, and simulation models available. This extensive library allows users to easily access and use memory ICs in their projects, making it an invaluable resource for engineers and developers.
ESP32-S3-WROOM-2-N32R16V
Bluetooth, WiFi 802.11b/g/n, Bluetooth v5.0 Transceiver Module 2.4GHz PCB Trace Surface Mount The ESP32-S3-WROOM-2-N32R16V is a powerful dual-core microcontroller module that integrates wireless connectivity, large memory, and hardware acceleration for AI and signal processing tasks. It is particularly suited for applications requiring edge AI, voice recognition, and high-speed data processing, while still maintaining low power consumption. Dual-core Xtensa LX7 CPU Up to 240 MHz Includes vector instructions for AI and DSP workloads Wi-Fi 2.4 GHz (802.11 b/g/n) Bluetooth 5 (LE) N32 → 32 MB external Flash R16 → 16 MB PSRAM Built for memory-intensive applications #commonpartslibrary #transceiver #wireless #rf
145 Uses1 StarsSoM with AMD Zynq™ 7030-1I incl. Heat Spreader
The Trenz Electronic TE0745-03-71I31-AK are industrial-grade SoC modules integrating a AMD/Xilinx Zynq™ 7030, 1 GByte DDR3L SDRAM, 64 MByte QSPI Flash memory for configuration and operation and powerful switch-mode power supplies for all on-board voltages. A large number of configurable I/O's is provided via rugged high-speed stacking strips. This module is identical with TE0745-03-71I31-A except the mounted heat spreader. All this on a tiny footprint of 5.2 x 7.6 cm at the most competitive price. These high-density integrated modules are smaller than a credit card and available in several variants. All parts are at least industrial temperature range of -40°C to +85°C. The module operating temperature range depends on customer design and cooling solution. Please contact us for options. #Module #part
11 Uses1 Stars
