The Trenz Electronic TE0745-03-71I31-AK are industrial-grade SoC modules integrating a AMD/Xilinx Zynq™ 7030, 1 GByte DDR3L SDRAM, 64 MByte QSPI Flash memory for configuration and operation and powerful switch-mode power supplies for all on-board voltages. A large number of configurable I/O's is provided via rugged high-speed stacking strips. This module is identical with TE0745-03-71I31-A except the mounted heat spreader. All this on a tiny footprint of 5.2 x 7.6 cm at the most competitive price. These high-density integrated modules are smaller than a credit card and available in several variants. All parts are at least industrial temperature range of -40°C to +85°C. The module operating temperature range depends on customer design and cooling solution. Please contact us for options. #Module #part
5 Uses
1 Star
The CH32X035/X033 series, developed by WCH, encompasses industrial-grade microcontrollers based on the QingKe RISC-V core. These microcontrollers, including models such as the CH32X035R8T6, CH32X035C8T6, CH32X035G8U6, CH32X035G8R6, CH32X035F8U6, CH32X035F7P6, and CH32X033F8P6, are equipped with integrated USB and PD PHY, supporting USB Host and Device functionalities, as well as PDUSB and Type-C fast charging capabilities. The series features a programmable protocol I/O controller, two groups of operational amplifiers (OPA), three groups of comparators (CMP), four USARTs, I2C, SPI, multiple timers, a 12-bit ADC, and 14-channel capacitive touch-key interfaces, among other peripherals. These microcontrollers offer a comprehensive suite of features, including a 32-bit QingKe RISC-V4C core with support for the RV32IMAC instruction set, fast interrupt handling, and low-power modes, making them suitable for a wide range of embedded applications. With a robust memory architecture comprising 20KB SRAM and 62KB CodeFlash, alongside various power management and security features, the CH32X035/X033 series is designed to deliver high performance and flexibility for industrial applications.
3 Uses
1 Star