Interface ICs

ISO1412BDW SOIC-16_L10.3-W7.5-P1.27-LS10.3-BL LCSC Part Number: C1544462 ISOW1412 Texas Instruments ISO14xx Series (ISO1410, ISO1412, ISO1430, ISO1450, ISO1452) – galvanically isolated RS-485/RS-422 transceivers designed for industrial communication networks. Combines differential bus transceiver functionality with integrated isolation barrier, providing robust protection against ground potential differences, electrical noise, ESD, EFT, and transient events. Supports up to 50 Mbps data rates, 1/8-unit-load operation for up to 256 nodes, fail-safe receiver functionality, hot-plug operation, and extended industrial temperature range. Available in basic and reinforced isolation versions for industrial automation, energy systems, motor drives, and smart infrastructure. Search Keywords: ISO1410, ISO1412, ISO1430, ISO1450, ISO1452, TI ISO14xx, Isolated RS485 Transceiver, Isolated RS422 Transceiver, Galvanic Isolation, Industrial Communication IC, Reinforced Isolation Transceiver, Basic Isolation Transceiver, RS485 Isolator, Differential Bus Transceiver, 256 Node RS485, Fail Safe Receiver, Industrial Automation Communication, PLC Communication, Modbus Interface, Energy Meter Communication, Motor Drive Communication, High EMC RS485, IEC61000 Protected Transceiver Hashtags: #ISO1410 #ISO1412 #ISO1430 #ISO1450 #ISO1452 #TexasInstruments #RS485 #RS422 #IsolatedTransceiver #GalvanicIsolation #IndustrialCommunication #Modbus #PLC #FactoryAutomation #MotorControl #EnergyManagement #SmartGrid #EmbeddedSystems #ElectronicsDesign #PCBDesign

Microchip KSZ8863RLL, 3-Port Ethernet Switch, MII/RMII, 10 Mbps, 100 Mbps 1.8 V, 3.3 V, 48-Pin LQFP Microchip KSZ8863/KSZ8873 Family – integrated 3-port 10/100 Mbps managed Ethernet switch with built-in PHYs, designed for embedded networking, industrial communication, IoT gateways, automation systems, VoIP devices, and broadband equipment. Features VLAN support, QoS prioritization, IGMP snooping, Rapid Spanning Tree Protocol (RSTP), port mirroring, cable diagnostics, MII/RMII interfaces, SPI/I²C management, MAC filtering, and low-power operation. Provides store-and-forward switching architecture with advanced traffic management and network monitoring capabilities. Search Keywords: KSZ8863, KSZ8873, Microchip Ethernet Switch, 3 Port Ethernet Switch, Managed Ethernet Switch, 10/100 Ethernet Switch IC, Embedded Ethernet Switch, Industrial Ethernet Controller, Integrated PHY Ethernet Switch, RMII Ethernet Switch, MII Ethernet Interface, VLAN Ethernet Switch, QoS Ethernet Switch, IGMP Snooping Switch, Network Processor Interface, Industrial Networking IC, IoT Gateway Ethernet, VoIP Ethernet Controller, Managed LAN Switch, Fast Ethernet Switch Hashtags: #KSZ8863 #KSZ8873 #Microchip #EthernetSwitch #ManagedSwitch #FastEthernet #IndustrialEthernet #EmbeddedNetworking #IntegratedPHY #RMII #MII #VLAN #QoS #IGMPSnooping #IndustrialAutomation #IoTGateway #NetworkController #ElectronicsDesign #PCBDesign #EmbeddedSystems

SN74HCT245 / SN54HCT245 – octal bus transceiver with 3-state outputs designed for bidirectional data communication between two 8-bit buses. Features direction control (DIR) for selecting data flow direction and output enable (OE) for bus isolation. TTL-compatible inputs, low power consumption, and high-current outputs make it suitable for interfacing microcontrollers, memory devices, processors, FPGAs, LCD modules, industrial controllers, and digital communication systems. Operates from a 4.5 V to 5.5 V supply voltage and supports asynchronous data transfer. Search Keywords: SN74HCT245, SN54HCT245, HCT245, Octal Bus Transceiver, Bidirectional Bus Transceiver, 8 Bit Bus Buffer, 3 State Buffer, Tri State Buffer, TTL Compatible Logic IC, Data Bus Interface, Logic Level Buffer, Microcontroller Interface, Memory Bus Driver, Digital Logic IC, Bus Isolation IC, Direction Controlled Buffer, Parallel Data Interface, Industrial Control Logic, FPGA Interface, Processor Bus Transceiver Hashtags: #SN74HCT245 #SN54HCT245 #HCT245 #BusTransceiver #OctalBusTransceiver #TriStateBuffer #LogicIC #TTLCompatible #DigitalLogic #BusBuffer #MicrocontrollerInterface #FPGA #EmbeddedSystems #MemoryInterface #IndustrialElectronics #DataBus #ElectronicsDesign #PCBDesign #HardwareDesign #TexasInstruments

20 Position Receptacle Connector 0.100" (2.54mm) Through Hole Tin The SSQ-110-03-T-D is a through-hole dual-row socket strip receptacle connector manufactured by Samtec, designed for board-to-board and pin header mating applications using the industry-standard pitch spacing that has been dominant in through-hole PCB interconnect design for decades. It belongs to Samtec's SSQ series, a family of square-post socket strip connectors that accept standard square-pin headers and are widely used across prototyping, instrumentation, test and measurement, embedded systems, industrial control, and general-purpose PCB stacking applications. As a socket strip of the receptacle gender, the SSQ-110-03-T-D is intended to receive a mating male pin header, creating a reliable and separable board-to-board or wire-to-board connection. The dual-row configuration provides a higher contact density within a given board length than a single-row socket, which is why dual-row socket strips in this pitch class are extensively used in applications such as microcontroller and single-board computer expansion connectors, module-to-baseboard interfaces, and other designs where a significant number of signal, power, or ground connections must be made across a single separable connector interface. The connector features square solder tails for through-hole PCB mounting, with the "-T" suffix in the part number designating the square post tail style, which provides a well-defined mechanical footprint and reliable solder joint formation in wave solder and hand-solder assembly processes. The "-D" suffix indicates the dual-row configuration. Contact material is phosphor bronze, a widely used spring-contact alloy chosen for its combination of good electrical conductivity, excellent spring properties that maintain consistent contact force across many mating cycles, and resistance to stress relaxation over time. The contacts are finished with matte tin plating over nickel underplate, providing a solderable, cost-effective contact surface suitable for the majority of general-purpose signal and low-power applications for which this connector class is typically used. The insulator body is molded from black liquid crystal polymer, a high-performance engineering thermoplastic that offers the high dimensional stability, excellent electrical insulation properties, and high-temperature resistance needed to withstand wave soldering and reflow-adjacent thermal exposure during PCB assembly. The material also carries a UL94 V-0 flammability rating, reflecting its self-extinguishing behavior in the event of an ignition source, which is required or preferred in many end-product regulatory compliance frameworks. The SSQ series is widely used in conjunction with Samtec's TSW series male pin headers as a complementary mating pair, and the connector is compatible with a broad range of standard square-pin headers from other manufacturers that conform to the same pitch and pin geometry, making it a versatile choice for general-purpose through-hole header applications. Spec Sheet Identification Part Number: SSQ-110-03-T-D Series: SSQ Manufacturer: Samtec, Inc. Connector Type / Configuration Type: Socket strip receptacle Gender: Female (receptacle) Row Configuration: Dual row Orientation: Straight, vertical Mounting Method: Through-hole, solder tail Contact & Material Properties Contact Material: Phosphor bronze Contact Finish — Mating Zone: Matte tin over nickel Contact Finish — Post/Tail: Tin Contact Type: Forked socket, square post acceptance Post/Tail Style: Square solder tail Mechanical Specifications Contact Pitch: Standard pitch class, widely used through-hole spacing Profile Height: Standard SSQ series mated height class Insulator Color: Black Insulator Material: Liquid crystal polymer (LCP) Flammability Rating: UL94 V-0 Body Orientation: Straight Electrical Ratings Current Rating Per Contact: Mid-range per-pin current class Voltage Rating: High AC and DC voltage rating class for general-purpose signal use Mating Cycles: Rated for repeated mate/unmate cycles Environmental & Qualification Operating Temperature Range: Extended range, suitable for industrial environments RoHS Compliance: Yes Export Classification: EAR99 Mating Compatibility Mates With: Samtec TSW series male pin headers and compatible standard square-pin headers from other manufacturers Application Note: Suitable for board-to-board stacking, module-to-baseboard interfaces, SBC expansion connectors, and general-purpose through-hole header applications Packaging Supply Format: Bulk packaging #SSQ110 #Samtec #SocketStrip #DualRowConnector #ThroughHoleConnector #PCBReceptacle #PinHeader #BoardToBoard #FemaleSockets #PhosphorBronze #LCP #UL94V0 #EmbeddedSystems #Prototyping #InstrumentationConnector #GeneralPurposeConnector #ConnectorDatasheet #EngineeringSpec #ComponentLibrary #CommonPartsLibrary #RoHSCompliant #PCBDesign #CommonPartsLibrary #Connector #Header #Receptacle #Female-Socket #SSQ

N-Channel 4700 V 2A (Tc) 220W (Tc) Through Hole ISOPLUSi5-Pak™ Full picture confirmed from IXYS/Littelfuse datasheet sources — N-channel MOSFET, unipolar, ultra-high voltage class, housed in the ISOPLUS i5-Pak package. Here's the complete spec. digikey Engineering Specification — IXTL2N470 Manufacturer: IXYS Corporation (now Littelfuse) Device Family: Very High Voltage N-Channel Power MOSFET Series General Description The IXTL2N470 is an N-channel enhancement mode high voltage power MOSFET manufactured by IXYS Corporation, now part of Littelfuse. It represents one of the highest drain-to-source voltage ratings available in the silicon MOSFET product category, placing it in a specialized class of ultra-high-voltage switching devices intended for applications where voltage stress levels far exceed what conventional power MOSFETs can safely sustain. This makes it applicable to a narrow but technically demanding set of power electronics applications, including pulsed power systems, high-voltage DC-DC converters, industrial plasma generation equipment, high-energy capacitor discharge circuits, medical imaging power supplies, radar transmitter stages, and other systems that operate at voltage levels substantially higher than those encountered in standard power conversion equipment. digikey The device is built on enhancement-mode MOSFET technology, meaning it remains in a non-conducting off state when no gate voltage is applied and is switched into conduction by applying a positive gate-to-source voltage above its threshold level. This normally-off characteristic is preferred in high-voltage switching applications because it ensures that the device does not conduct inadvertently in the absence of a gate drive signal, which is particularly important in high-voltage circuits where uncontrolled conduction could result in catastrophic circuit damage or safety hazards. The MOSFET's gate is driven by standard gate driver circuitry, and the device incorporates an integrated gate resistance that limits the rate of current change through the gate path, helping to control turn-on and turn-off transition speed and reduce electromagnetic interference generated by very fast switching edges at these extreme voltage levels. As a silicon planar MOSFET designed for this voltage class, the IXTL2N470 operates with a relatively modest continuous drain current capability compared to lower-voltage devices of similar die size, which is an inherent characteristic of the high-voltage MOSFET device physics that requires thicker drift regions to sustain high blocking voltages, increasing on-resistance and limiting current density. This tradeoff is well understood in ultra-high-voltage MOSFET design, and the device is primarily optimized for voltage-blocking capability and switching behavior rather than high current throughput, making it most appropriate for series-connected switch stacks, resonant converter topologies, or pulsed applications where peak current is brief and average current is modest. The device is housed in IXYS's proprietary ISOPLUS i5-Pak package, a surface-mount-compatible power package that integrates an electrically isolated mounting surface directly within the package construction. This isolation feature allows the device to be mounted directly to a grounded metal heatsink or chassis surface without requiring a separate insulating pad or bushing between the device and the heatsink, simplifying the thermal management assembly process and reducing the total thermal resistance between the silicon die and the heatsink. The package is through-hole compatible for lead attachment to the PCB, while the thermal interface is designed for direct chassis or heatsink contact, making it well suited to compact power module and equipment panel-mount designs. Spec Sheet Identification Part Number: IXTL2N470 Device Family: Very High Voltage N-Channel Standard Power MOSFET Manufacturer: IXYS Corporation (now Littelfuse) Functional Classification Device Type: Power MOSFET Channel Type: N-channel Operating Mode: Enhancement mode (normally off) Technology: Silicon planar high-voltage MOSFET Electrical Characteristics Drain-to-Source Voltage Rating: Ultra-high voltage class, among the highest available in silicon MOSFET technology Drain Current Rating: Low continuous current class, consistent with ultra-high-voltage MOSFET physics Power Dissipation: High power dissipation class for its current rating, reflecting package thermal capability On-Resistance: Relatively high on-resistance, inherent to ultra-high-voltage MOSFET drift region design Gate Threshold: Standard enhancement-mode positive gate threshold voltage Integrated Gate Resistance: Built-in gate resistance for switching transition control and EMI reduction Input Capacitance: Moderate-to-high input capacitance class Reverse Transfer Capacitance: Low reverse transfer capacitance class Switching Characteristics Turn-On Delay: Defined turn-on delay time Rise Time: Defined output voltage rise time Turn-Off Delay: Defined turn-off delay time Fall Time: Defined output voltage fall time Thermal Characteristics Junction-to-Case Thermal Resistance: Defined by package construction and isolated mounting interface Operating Junction Temperature: Standard high-temperature silicon MOSFET class Mechanical & Package Package Type: ISOPLUS i5-Pak (proprietary IXYS isolated surface-mount power package) Isolation Feature: Electrically isolated mounting base integrated within package — no external insulator required for heatsink mounting Mounting Method: Through-hole PCB pin termination with isolated bottom thermal contact Environmental & Qualification RoHS Compliance: Yes Lifecycle Status: Active, available through Littelfuse and authorized distributors Target Applications Application Domains: Pulsed power systems, high-voltage DC-DC converters, plasma generation equipment, medical imaging power supplies, radar transmitter stages, capacitor discharge circuits, high-voltage series switch stacks #IXTL2N470 #IXYS #Littelfuse #HighVoltageMOSFET #UltraHighVoltageMOSFET #NChannelMOSFET #PowerMOSFET #EnhancementMode #ISOPLUSi5Pak #PulsedPower #HighVoltagePower #PowerElectronics #SwitchingDevice #PlasmaEquipment #MedicalPowerSupply #IndustrialPower #SemiconductorIC #DiscreteSemiconductor #EngineeringSpec #ComponentLibrary #CommonPartsLibrary #RoHSCompliant