Surface-Mount Ferrite Bead for EMI Noise Suppression – High-current chip ferrite bead designed for power-line filtering, DC-DC converters, automotive electronics, industrial control systems, communication equipment, IoT devices, and embedded electronic applications. The Murata BLM18KG601SN1D is part of the EMIFIL® BLM18 Series, providing 600 Ω impedance at 100 MHz in a compact 0603 (1608 Metric) package to effectively suppress high-frequency electromagnetic interference while maintaining low DC losses. It is rated for 1.3 A continuous current with a 150 mΩ maximum DC resistance, making it suitable for filtering power and signal lines in space-constrained designs. The ferrite bead is intended for surface-mount assembly and operates over a −55°C to +125°C temperature range for reliable performance in industrial and embedded applications. #Murata #BLM18KG601SN1D #EMIFIL #FerriteBead #EMIFilter #NoiseSuppression #PowerLineFilter #0603 #IndustrialElectronics #PowerManagement #EmbeddedSystems #EMC

Buck Switching Regulator IC Positive Fixed 3.3V 1 Output 2A SOT-23-6 Thin, TSOT-23-6 The AP63200/AP63201/AP63203/AP63205 is a 2A, synchronous buck converter with a wide input voltage range of 3.8V to 32V and fully integrates a 125mΩ high-side power MOSFET and a 68mΩ low-side power MOSFET to provide high-efficiency step-down DC/DC conversion. The AP63200/AP63201/AP63203/AP63205 device is easily used by minimizing the external component count due to its adoption of peak current mode control along with its integrated compensation network. The AP63200/AP63201/AP63203/AP63205 has optimized designs for Electromagnetic Interference (EMI) reduction. The converter features Frequency Spread Spectrum (FSS) with a switching frequency jitter of ±6%, which reduces EMI by not allowing emitted energy to stay in any one frequency for a significant period of time. It also has a proprietary gate driver scheme to resist switching node ringing without sacrificing MOSFET turn-on and turn-off times, which further erases highfrequency radiated EMI noise caused by MOSFET switching. The device is available in a low-profile, TSOT26 package. • VIN 3.8V to 32V • 2A Continuous Output Current • 0.8V ±1% Reference Voltage • 22µA Ultralow Quiescent Current • Switching Frequency o 500kHz: AP63200 and AP63201 o 1.1MHz: AP63203 and AP63205 • Pulse Width Modulation (PWM) Regardless of Output Load o AP63201 • Supports Pulse Frequency Modulation (PFM) o AP63200, AP63203, and AP63205 o Up to 80% Efficiency at 1mA Light Load o Up to 88% Efficiency at 5mA Light Load • Fixed Output Voltage o 3.3V: AP63203 o 5.0V: AP63205 • Proprietary Gate Driver Design for Best EMI Reduction • Frequency Spread Spectrum (FSS) to Reduce EMI • Precision Enable Threshold to Adjust UVLO • Protection Circuitry o Overvoltage Protection o Cycle-by-Cycle Peak Current Limit o Thermal Shutdown • 12V and 24V distributed power bus supplies • Flat screen TV sets and monitors • Power tools and laser printers • White goods and small home appliances • FPGA, DSP, and ASIC supplies • Home audios • Network systems • Set top boxes • Gaming consoles • Consumer electronics #commonpartslibrary #integratedcircuit #AP63203WU7 #BuckConverter #DCDCConverter #PowerManagement #VoltageRegulator #SynchronousBuck #EmbeddedSystems #IndustrialElectronics #PowerSupply #DiodesInc #3V3Power #ElectronicsDesign

15µH Shielded Drum Core, Wirewound Inductor 5.45 A 25.8mOhm Max Nonstandard The 7447798151 is a 15 µH shielded wirewound drum core inductor optimized for high current power applications. It features low DC resistance and high saturation current capability, making it suitable for compact, high-frequency power designs. Key Features Inductance: 15 µH High current rating: up to 5.45 A (RMS) Saturation current: ~4 A Low DC resistance: 25.8 mΩ max Shielded construction for low EMI / magnetic leakage High self-resonant frequency: ~19 MHz Wide operating temperature: -40°C to +150°C Compact SMD package (~10.2 mm × 10.2 mm footprint) Typical Applications DC-DC converters (buck / boost) Power supply filtering Automotive and industrial power systems Point-of-load (POL) regulators High-frequency switching circuits #WurthElektronik #WEPDF #PowerInductor #15uH #SMDInductor #ShieldedInductor #PowerElectronics #ElectronicsComponents #SMTComponents #CommonPartsLibrary #Fixed-Inductor

1.5µH Shielded Drum Core, Wirewound Inductor 1.9 A 137mOhm Max 0806 (2016 Metric) The Bourns SRP2010-1R5M is a 1.5 µH wirewound drum-core power inductor designed for high-current, low-loss power conversion applications such as buck/boost converters in compact electronics like smartphones, tablets, SSDs, and embedded systems. It uses a metal powder (iron powder) core with magnetic shielding, which helps reduce EMI (electromagnetic interference) and improves efficiency in high-frequency switching circuits. Key Features Inductance: 1.5 µH Tolerance: ±20% Current Rating (Irms): ~1.9 A Saturation Current (Isat): ~2.5 A Low DCR: ~137 mΩ max Shielded construction (reduces magnetic radiation) Wirewound drum core design Surface-mount package (0806 / 2016 metric) Operating temperature: -40°C to +125°C RoHS compliant Typical Applications DC-DC converters (buck / boost regulators) Power management circuits in mobile devices Laptops, tablets, smartphones SSD/HDD power filtering Embedded systems and IoT devices #CommonPartsLibrary #Inductor #Coil #Choke #Fixed-Inductor #SRP2010

600 Ohms @ 100 MHz 1 Ferrite Bead 0603 (1608 Metric) ferrite bead 600 ohm 0603 ferrite bead 600 ohm 100MHz 0603 ferrite bead 0603 600ohm The BLM18AG601SN1D is a surface-mount ferrite bead designed for suppression of high-frequency noise in electronic circuits. It provides high impedance at high frequencies while maintaining low DC resistance, making it suitable for power lines and signal line filtering. This component is commonly used in portable electronics, communication devices, and general digital circuits to improve EMI performance. ELECTRICAL CHARACTERISTICS Impedance: 600 Ω ±25% @ 100 MHz Rated Current: 500 mA (max) DC Resistance (DCR): 0.5 Ω (typ), 0.8 Ω (max) Insulation Resistance: 10 MΩ min PHYSICAL CHARACTERISTICS Package Size: 0603 (1608 Metric) Length: 1.6 mm Width: 0.8 mm Height: 0.8 mm (typ) Mounting Type: Surface Mount (SMD) ENVIRONMENTAL & OPERATING CONDITIONS Operating Temperature Range: -55°C to +125°C Storage Temperature Range: -55°C to +125°C APPLICATIONS Power supply line noise suppression Signal line EMI filtering Mobile devices and handheld electronics Computers and peripherals Consumer electronics FEATURES High impedance at high frequencies for effective noise suppression Low DC resistance minimizes signal/power loss Compact 0603 package suitable for high-density PCB layouts Reliable multilayer construction Lead-free and RoHS compliant PACKAGING Packaging Type: Tape and Reel Standard Reel Quantity: Typically 4000 pcs/reel #CommonPartLibrary #Filter #FerriteBead

Half-Bridge Gate Driver IC Non-Inverting Peak High-Frequency with CMOS Logic Inputs 100V 2A 16-QFN (5x5) #CommonPartsLibrary #IntegratedCircuit #PowerManagement #GateDriver #HIP2100

100V 2.5A High-Frequency Half-Bridge Gate Driver #ultralibrarian

100V 4A High-Frequency Half-Bridge Gate Driver with Lower VDD Threshold #ultralibrarian

Diode 40 V 3A Surface Mount SMB Schottky diode 3A 40V SMB The B340B-13-F is a surface-mount Schottky barrier rectifier diode designed for efficient power rectification in low-voltage, high-frequency applications. It features low forward voltage drop and fast switching capability, making it suitable for DC-DC converters, power supplies, reverse polarity protection, and freewheeling diode applications. The device is housed in a compact SMB (DO-214AA) package, enabling high current handling in space-constrained designs. ELECTRICAL CHARACTERISTICS Reverse Voltage (VRRM): 40 V Average Forward Current (IF(AV)): 3 A Forward Voltage (VF): 0.5 V (typical at IF = 3 A) Reverse Leakage Current (IR): 0.5 mA (max at VR = 40 V, 25°C) Peak Surge Current (IFSM): 80 A (8.3 ms single half sine wave) THERMAL CHARACTERISTICS Operating Junction Temperature Range: -55°C to +150°C Storage Temperature Range: -55°C to +150°C Thermal Resistance Junction-to-Ambient (RθJA): ~75 °C/W MECHANICAL CHARACTERISTICS Package Type: SMB (DO-214AA) Mounting Type: Surface Mount (SMD) Polarity: Cathode marked by band Weight: ~0.1 g FEATURES Low forward voltage drop for improved efficiency High surge current capability Fast switching speed Low power loss and high reliability Compact SMB package for space-saving PCB layout RoHS compliant and halogen-free APPLICATIONS Switch-mode power supplies (SMPS) DC-DC converters Reverse polarity protection circuits Freewheeling and clamping diodes Battery charging circuits MANUFACTURER / PART DETAILS Manufacturer: Diodes Incorporated Part Number: B340B-13-F Package Code: SMB (DO-214AA) #Diode #Rectifier #Single-Diode #SCHOTTKY #B340

I-PEX MHF4 Connector Receptacle, Male Pin 50 Ohms Surface Mount Solder The 20449-001E-03 is an ultra-miniature MHF4 RF coaxial receptacle connector from I-PEX designed for high-frequency wireless applications such as Wi-Fi, Bluetooth, LTE, GNSS, and cellular antenna connections in compact electronic devices. It is a surface-mount RF connector optimized for miniature coaxial cable assemblies and high-density PCB layouts. Key Features Ultra-small MHF4 RF coaxial receptacle Supports frequencies up to 9 GHz Characteristic impedance: 50 Ω Surface-mount (SMT) PCB mounting Snap-on mating mechanism Compact footprint for space-constrained designs Gold-plated center contact for improved conductivity and corrosion resistance Uses: MHF4 compatible RF cables and antenna assemblies High-reliability micro RF interconnect Operating temperature: −40°C to +90°C Rated voltage: 60 V Approximate mating cycle rating: 30 cycles Constructed with: Brass contacts LCP (Liquid Crystal Polymer) dielectric material RoHS compliant Typical Applications Wi-Fi modules LTE/5G modules GNSS/GPS antennas Bluetooth devices IoT devices Embedded wireless systems Compact handheld electronics RF communication modules

67 Position Female Connector M.2 (NGFF) Mini Card Gold 0.020" (0.50mm) Black # Engineering Specification ## Product Name 2199230-4 ## General Description 2199230-4 is a surface mount board-edge connector designed to support standardized M.2 module interfaces, specifically configured for Key E applications used in wireless communication, embedded computing, and high-speed peripheral expansion systems. The component provides a reliable mechanical and electrical interface between a host printed circuit board and a removable or fixed M.2 module. The connector is engineered to accept gold-finger edge contacts from an M.2 module, enabling secure signal transmission for high-speed data communication, power delivery, and control signaling. Its design supports stable mechanical retention, precise alignment, and consistent electrical contact performance under repeated mating cycles. This component is widely used in industrial computing platforms, telecommunications equipment, IoT devices, and embedded system architectures where modular expansion and standardized connectivity are required. It enables flexible system design by allowing interchangeable M.2 modules for wireless communication, storage, and specialized processing functions. The design emphasizes signal integrity, mechanical durability, and compatibility with high-density PCB layouts. It is suitable for applications requiring robust high-frequency performance and reliable long-term mechanical stability. ## Functional Requirements ### Module Interface The connector shall provide a standardized interface for M.2 Key E module insertion and electrical connection. ### Signal Transmission The connector shall support high-speed electrical signal routing between host systems and M.2 modules. ### Mechanical Retention The connector shall securely retain inserted modules under vibration and operational stress conditions. ### System Modularity The connector shall enable modular expansion and replacement of functional M.2 devices within host systems. ## Electrical Requirements ### Contact Performance The connector shall provide stable electrical contact between gold-finger module pads and host PCB terminals. ### Signal Integrity The design shall support high-frequency signal transmission with minimal loss and interference. ### Power Delivery The connector shall support regulated power distribution to installed M.2 modules. ### Low Resistance Path The electrical interface shall maintain low contact resistance for reliable long-term operation. ## Mechanical Requirements ### Board Edge Mounting The connector shall be mounted on a printed circuit board to accept edge-insertion M.2 modules. ### Alignment and Fit The design shall ensure precise alignment between module contacts and connector terminals. ### Durability The connector shall withstand repeated module insertion and removal cycles without performance degradation. ### Structural Stability The assembly shall maintain mechanical integrity under vibration and operational stress conditions. ## Environmental Requirements ### Operating Conditions The connector shall operate reliably in industrial, commercial, and embedded system environments. ### Thermal Performance The device shall maintain mechanical and electrical stability under elevated operating temperatures. ### Storage and Handling The component shall retain structural and functional integrity during storage, transportation, and assembly processes. ## Quality Requirements ### Reliability The connector shall provide consistent electrical and mechanical performance throughout its operational lifetime. ### Verification Mechanical retention, contact resistance, and signal integrity shall be validated through appropriate qualification testing. ### Compliance The product shall conform to applicable standards governing M.2 interface connectors and high-speed board-edge interconnect systems. ## Documentation Requirements Technical documentation shall include footprint layout guidance, mating interface specifications, signal routing recommendations, mechanical keep-out regions, and application guidelines for M.2 system integration. ## Classification Tags #21992304 #M2Connector #M2KeyE #EdgeCardConnector #GoldFingerInterface #HighSpeedConnector #BoardEdgeConnector #WirelessModuleConnector #PCIeInterface #NGFF #EmbeddedSystems #IoTHardware #TelecomHardware #PCBDesign #MechanicalConnector #SignalIntegrity #HighFrequencyDesign #CommonPartsLibrary #ComponentLibrary #EngineeringSpecification #SystemIntegration #HardwareDesign #TEConnectivity #ModuleInterface #BoardToModule

Diode 40 V 5A Surface Mount DO-214AB (SMC) The SSC54-E3/57T is a surface-mount Schottky barrier rectifier diode manufactured by Vishay Intertechnology . It is designed for high-efficiency power rectification applications requiring low forward voltage drop and fast switching performance. This diode is commonly used in DC-DC converters, switching power supplies, polarity protection circuits, and freewheeling applications. The device comes in a compact DO-214AB (SMC) package suitable for automated PCB assembly. Key Features Schottky barrier rectifier technology Maximum repetitive reverse voltage: 40 V Average forward current: 5 A Very low forward voltage drop (~0.49 V max) High surge current capability up to 175 A Fast switching speed with low power loss Surface-mount DO-214AB (SMC) package Operating junction temperature up to 150°C Matte tin-plated terminals, RoHS compliant Suitable for high-frequency power conversion applications #CommonPartsLibrary #Diode