The OSD6254-1G-IPM is a high-performance System-in-Package (SiP) from Octavo Systems that integrates the Texas Instruments AM6254 processor, 1 GB DDR4 memory, power management circuitry, and essential passive components into a compact 9 × 14 mm BGA package. Featuring a quad-core Arm Cortex-A53 processor with an integrated Cortex-M4F real-time core, it provides a highly integrated solution for industrial automation, IoT gateways, edge AI, HMI, and embedded Linux applications while significantly reducing PCB design complexity and time-to-market. Key Features: Quad-core Arm Cortex-A53 processor (up to 1.4 GHz) Integrated Arm Cortex-M4F real-time co-processor (up to 400 MHz) 1 GB DDR4 memory integrated within the SiP Integrated PMIC and required passive components Rich peripheral interfaces including Ethernet, USB, PCIe, CAN, UART, SPI, I²C, I²S, and SD/MMC Industrial operating temperature range: −40°C to +85°C Compact 9 × 14 mm, 500-ball BGA package Reduces PCB complexity, BOM count, and development time Optimized for embedded Linux, industrial control, HMI, IoT gateway, and edge AI applications #OctavoSystems #OSD6254 #AM6254 #ArmCortexA53 #CortexM4F #SystemInPackage #EmbeddedProcessor #IndustrialAutomation #EdgeAI #IoT #EmbeddedLinux #BGA

ARM® Cortex®-A53 Microprocessor IC i.MX8ML 2 Core, 64-Bit 1.8GHz 548-LFBGA (15x15) Application Processor for embedded multimedia and industrial systems, integrating dual Arm® Cortex®-A53 cores operating up to 1.8 GHz and a Cortex®-M4 real-time core up to 400 MHz. It supports LPDDR4/DDR4/DDR3L memory, Gigabit Ethernet, PCIe, USB 2.0, MIPI-CSI/DSI, SAI audio interfaces, and 1080p video encode/decode, and is housed in a 0.8 mm pitch 486-ball FCBGA package. #ApplicationProcessor #NXP #iMX8MMini #ARMCortexA53 #CortexM4 #EmbeddedProcessor #MultimediaProcessor #FCBGA486 #LPDDR4 #DDR4 #PCIe #USB2 #GigabitEthernet #MIPI #SAI #EmbeddedSystems