Board-to-Board Mezzanine Connector – 40-position board-to-board mezzanine connector for compact embedded systems, industrial electronics, consumer devices, communication modules, and high-density PCB interconnect applications. Features a 0.4 mm pitch, 2-row, vertical (180°) surface-mount configuration, and supports 300 mA maximum current per contact with a 60 V voltage rating. Constructed with gold-plated phosphor bronze contacts for excellent conductivity and long-term reliability, the connector is designed for high-density PCB stacking in space-constrained applications. Specified for operation over a −55°C to +85°C temperature range and supplied in an SMT package. #TXGA #FBB04004F40S1003K6M #BoardToBoardConnector #MezzanineConnector #40PinConnector #040mmPitch #SMTConnector #PCBInterconnect #HighDensityConnector #EmbeddedSystems #IndustrialElectronics #ConsumerElectronics

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