This is an Energy Meter project leveraging an ATTiny85 microcontroller (U1) to sense current through an ACS712 module (U2). It displays the data in real-time on an OLED display (OLED1) and interacts with three buttons (NEXT, MENU, OK). This compact energy meter is suitable for edge computing and low-power Internet of Things (IoT) applications #project #keypad #arduino #attiny85 #ISP #reusable #module #edge-computing #edgeComputing #microchip #sublayout

PT2272-M4 is a CMOS remote control decoder IC designed to work with the PT2262 encoder for wireless RF and infrared remote control applications. It decodes incoming encoded signals and provides four momentary data outputs, making it ideal for remote switching, security systems, garage door openers, home automation, and industrial control systems. The "M4" variant features 4 momentary output channels, where outputs remain active only while the corresponding transmitter button is pressed. Key Features CMOS technology for low power consumption 4 momentary data output channels (M4 version) Up to 12 tri-state address pins for secure coding Supports up to 531,441 unique address combinations High noise immunity for reliable operation Wide operating voltage range: 4V to 15V Single-resistor oscillator design Compatible with PT2262 encoder IC Available in DIP and SOP package options Suitable for RF and infrared remote control systems Applications Wireless remote controls Garage door openers Car security systems Home automation equipment Remote-controlled fans and appliances Industrial wireless control systems Remote-controlled toys #CommonPartsLibrary #IntegratedCircuit #PT2272M4 #RemoteControlDecoder #RFDecoder #WirelessControl #HomeAutomation #SecuritySystem #GarageDoorOpener #CMOSIC #PT2262 #IndustrialControl #EmbeddedSystems #ElectronicsDesign

Isolated Module DC DC Converter 2 Output 15V -15V 170mA, 170mA 4.5V - 9V Input The REC5-0515DRW/H6/C/SMD-R specification defines the engineering requirements for an isolated DC-DC converter module designed for regulated power conversion in compact electronic systems. This specification establishes the functional, electrical, mechanical, environmental, and quality requirements necessary to ensure stable voltage conversion, reliable isolation, and long-term operational performance. The device is intended for use in embedded systems, industrial control equipment, communication modules, and distributed power architectures where isolated power rails are required. It provides regulated output power from a DC input source while maintaining galvanic isolation between input and output stages to enhance system safety and signal integrity. Engineering Requirements The power module shall be manufactured using controlled electronic assembly processes and high-reliability components to ensure stable conversion efficiency and consistent output regulation. The internal architecture shall support isolated power transfer with stable performance under defined load and environmental conditions. Electrical characteristics shall ensure stable output regulation, low output ripple, and reliable transient response during load variation. The device shall maintain consistent performance across its intended operating temperature range and input voltage variation conditions. Isolation performance shall ensure electrical separation between input and output circuits to protect downstream electronics and maintain system safety requirements. The module shall withstand electrical stress conditions defined by applicable safety and reliability standards. Thermal performance shall support continuous operation without degradation of output regulation or reliability under rated operating conditions. The device shall be suitable for PCB mounting and shall maintain structural integrity during soldering and long-term operation. Workmanship shall be free from defects such as contamination, cracks, soldering defects, or structural irregularities that could affect electrical performance or mechanical reliability. Manufacturing and inspection shall be performed using controlled processes and calibrated equipment. Any deviation from this specification shall require formal engineering review, documented justification, and approval through established engineering change control procedures. Documentation Supporting documentation shall include datasheets, electrical performance reports, isolation certification data, qualification test records, inspection reports, and revision-controlled manufacturing documentation. All documentation shall be maintained under formal configuration management and quality assurance systems. Revision Control All changes to this specification shall be managed through the formal engineering change control system. Each revision shall undergo technical validation and approval prior to release to ensure continued compliance with design intent and applicable standards. #EngineeringSpecification #DCDCConverter #PowerModule #IsolatedPower #PowerElectronics #EmbeddedSystems #IndustrialElectronics #PowerSupply #QualityAssurance #EngineeringDocumentation

10 µH Shielded Molded Inductor 15.5 A 14.75mOhm Max Nonstandard The XAL1010-103MED specification defines the engineering requirements for a shielded power inductor designed for high-efficiency energy storage and power conversion applications. This specification establishes the functional, electrical, mechanical, thermal, environmental, and quality requirements necessary to ensure stable inductance characteristics, efficient current handling, and long-term operational reliability in power electronic systems. The component is intended for use in DC-DC converters, voltage regulators, power management circuits, industrial control equipment, automotive electronics, and embedded systems requiring compact, high-current inductive components. The magnetically shielded construction minimizes electromagnetic interference while supporting efficient energy transfer and stable performance in high-frequency switching applications. Engineering Requirements The power inductor shall be manufactured using high-quality magnetic core materials and precision-wound conductors to ensure consistent inductance, low core losses, and reliable current-carrying capability. The construction shall maintain stable electrical performance under specified operating voltage, current, frequency, and temperature conditions. Electrical characteristics shall provide accurate inductance values, low direct current resistance, high saturation current capability, and low electromagnetic emissions. The component shall maintain stable performance during continuous operation, transient loading, and thermal cycling without significant degradation of inductance or efficiency. Thermal performance shall support effective heat dissipation and continuous operation within the specified temperature range while maintaining structural integrity and electrical characteristics. The shielded construction shall minimize magnetic field leakage and improve electromagnetic compatibility within densely populated electronic assemblies. Mechanical construction shall be suitable for surface-mount assembly and compatible with automated manufacturing processes. The component shall withstand solder reflow, vibration, mechanical shock, and handling without deformation or degradation of electrical performance. Workmanship shall be free from defects including cracks, contamination, core damage, winding irregularities, or structural inconsistencies. Inspection, validation, and testing shall be conducted using calibrated equipment and controlled quality procedures to verify compliance with all applicable engineering and manufacturing requirements. Any deviation from this specification shall require formal engineering evaluation, documented technical justification, and approval through the established engineering change control process. Documentation Supporting documentation shall include engineering drawings, electrical specifications, magnetic characterization data, thermal performance reports, qualification records, inspection reports, material declarations, and revision-controlled manufacturing documentation. All documentation shall be maintained under formal configuration management and quality assurance systems to ensure complete product traceability. Revision Control Any modification to this specification shall be managed through the formal engineering change management process. All revisions shall undergo technical review, validation, and approval before implementation to ensure continued compliance with design intent and applicable engineering standards. #EngineeringSpecification #PowerInductor #ShieldedInductor #PowerElectronics #DCDCConverter #PowerManagement #Magnetics #IndustrialElectronics #QualityAssurance #EngineeringDocumentation #CommonPartsLibrary #Inductor #XAL1010

LED Lighting Driver ICs LED Lighting Drivers 4-Channel RGBW Driver, I2C, 1.5x1.5mm TDFN The KTD2027BEWE-TR is a highly integrated, low-power RGB LED driver designed for portable and battery-powered applications. It features a compact WLCSP package and provides precise current control for up to three LED channels. The device includes an I²C-compatible interface, enabling flexible control of brightness, color mixing, and lighting effects. Integrated features such as programmable current sinks, dimming control, and built-in protection mechanisms make it suitable for indicators, backlighting, and decorative lighting in consumer electronics. Key Features Triple-channel constant current LED driver (RGB support) I²C-compatible digital interface Independent brightness control per channel Programmable current up to ~24 mA per channel Built-in PWM dimming and pattern generation Low quiescent current for power-sensitive applications Wide input voltage range Thermal shutdown and overcurrent protection Small WLCSP package (suitable for compact designs) Applications Mobile devices and wearables Status indicators and notification LEDs Backlighting and decorative lighting IoT and portable electronics Absolute Maximum Ratings Supply Voltage (VDD): −0.3 V to +6.0 V Logic Input Voltage: −0.3 V to VDD + 0.3 V Operating Temperature Range: −40°C to +85°C Storage Temperature Range: −55°C to +150°C Recommended Operating Conditions Supply Voltage (VDD): 1.8 V to 5.5 V LED Forward Voltage: Dependent on external LEDs Ambient Temperature: −40°C to +85°C Electrical Characteristics (Typical) Supply Current (Idle): < 1 µA (shutdown mode) Channel Current Accuracy: ±5% (typical) Maximum Output Current: ~24 mA per channel I²C Clock Frequency: Up to 400 kHz (Fast Mode) Functional Description The KTD2027BEWE-TR operates as a constant-current sink driver for RGB LEDs. Each channel can be independently programmed via the I²C interface to control brightness and enable dynamic lighting effects. Internal PWM generators allow smooth dimming without requiring continuous microcontroller intervention. The device also integrates protection features such as thermal shutdown and current limiting to ensure reliable operation. Pin Configuration (Typical WLCSP) VDD – Power supply GND – Ground SDA – I²C data line SCL – I²C clock line LED1 – Current sink output (Red) LED2 – Current sink output (Green) LED3 – Current sink output (Blue) Package Information Package Type: WLCSP (Wafer-Level Chip Scale Package) Mounting: Surface mount Tape & Reel: Yes (TR suffix) Ordering Information KTD2027BEWE-TR: Tape and reel packaging for automated assembly #commonpartslibrary #integratedcircuit #leddriver

The BT151-600R specification defines the engineering requirements for a high-power silicon controlled rectifier designed for phase control and switching applications in electronic power systems. This specification establishes the functional, electrical, mechanical, environmental, and quality requirements necessary to ensure reliable switching performance, controlled power regulation, and long-term operational stability. The device is intended for use in applications requiring efficient control of AC power or high-current DC switching, such as motor speed control, light dimming, power regulation circuits, and industrial control systems. It provides controlled conduction behavior triggered by gate activation and remains in conduction until current falls below the holding condition. Engineering Requirements The semiconductor device shall be manufactured using controlled silicon processing techniques to ensure stable thyristor operation, consistent triggering characteristics, and reliable current handling capability. The device shall maintain predictable switching behavior under defined electrical, thermal, and environmental operating conditions. Electrical characteristics shall ensure reliable gate triggering sensitivity, stable on-state conduction, and controlled turn-off behavior under appropriate circuit conditions. The device shall maintain performance integrity under surge conditions and repetitive switching operation within its design limits. Thermal performance shall support efficient heat dissipation through the package structure and mounting interface. The device shall be suitable for attachment to appropriate heat sinking systems to maintain safe operating junction conditions during continuous or high-load operation. Mechanical and package construction shall be suitable for surface-mount or power PCB assembly and shall ensure robust mechanical stability during soldering, handling, and thermal cycling. Workmanship shall be free from defects such as contamination, cracks, bond wire issues, or structural inconsistencies that could impact performance or reliability. Inspection, validation, and testing shall be performed using controlled procedures and calibrated equipment to ensure compliance with all applicable engineering and quality requirements. Any deviation from this specification shall require formal engineering review, documented justification, and approval through established change control processes. Documentation Supporting documentation shall include official datasheets, electrical characterization reports, thermal performance data, qualification test records, inspection reports, and revision-controlled manufacturing documentation. All documentation shall be maintained under formal configuration management and quality assurance systems to ensure traceability and consistency. Revision Control Any modification to this specification shall be managed through formal engineering change control procedures. All revisions shall undergo technical review, validation, and approval prior to implementation to ensure continued compliance with design intent and applicable standards. #EngineeringSpecification #SCR #Thyristor #PowerElectronics #PhaseControl #IndustrialControl #Semiconductor #PowerSwitching #QualityAssurance #EngineeringDocumentation

Serial Port to HID Keyboard and Mouse Chip CH9329 is a UART to standard USB HID device (keyboard, mouse, custom HID) chip. According to different operating modes, it can be identified as the standard USB keyboard device, USB mouse device or custom HID device on the computer. CH9329 receives serial port data sent from the client and according to the HID device specification, the data will be packaged and then transmitted to the computer via USB port. Though the provided computer software, users can also configure the chip operating mode, serial communication mode, serial communication baud rate, various timeout periods, VID, PID, and various USB string descriptors. Features l Supports 12Mbps full-speed USB transmission, USB 2.0compatible, built-in crystal oscillator. l Default serial baud rate is 9600bps, which supports various common baud rates. l Supports 5V and 3.3V power voltage. l Multiple chip operating modes to adapt to different application requirements. l Flexible switching among multiple serial communication modes. l Supports normal keyboard and multimedia keyboard function, and supports full keyboard function. l Supports absolute mouse and relative mouse functions. l Supports custom HID device functions, which can be used for pure data transmission. l Supports ASCII code characters input and section-position code Chinese characters input. l Supports remote computer wake-up function. l Supports to configure VID, PID, and various USB string descriptors of chip. l Supports to configure default baud rate of chip. l Supports to configure communication address of chip to realize multiple chips hanged on the same serial port. l Supports to configure “Enter” character. l Supports to configure filter string to filter invalid characters conveniently. l Complies with USB related specifications and HID device related specifications. l RoHS compliant SOP-16 lead-free package.

This project is a reference design for an ESP32-S2-WROVER based device. It features USB-C for power and data transfer, onboard voltage regulation, and multiple peripheral connections. It also includes a CH340C for USB to serial conversion #referenceDesign #Module #ESP32 #ESP32S2 #RF #WIFI #MCU #reusable #module #simple-embedded #espressif #sublayout

This project is a reference design for an ESP-WROOM-02U based device. It features USB-C for power and data transfer, onboard voltage regulation, and multiple peripheral connections. It also includes a CH340C for USB to serial conversion #referenceDesign #Module #ESP8266 #WROOM #RF #WIFI #MCU #reusable #module #simple-embedded #espressif #sublayout

This project is a reference design for an ESP32-WROOM-32UE based device. It features USB-C for power and data transfer, onboard voltage regulation, and multiple peripheral connections. It also includes a CH340C for USB to serial conversion #referenceDesign #Module #ESP32 #ESP32WROOM #RF #WIFI #MCU #reusable #module #simple-embedded #espressif #sublayout

The SIM5320 series is Dual-Band HSDPA/WCDMA and Quad-Band GSM/GPRS/EDGE module solution in a SMT type which supports HSDPA up to 3.6Mbps for downlink data transfer. #Module #3G

This project is a reference design for an ESP32-PICO-MINI-02U based device. It features USB-C for power and data transfer, onboard voltage regulation, and multiple peripheral connections. It also includes a CH340C for USB to serial conversion #referenceDesign #Module #ESP32 #ESP32PICO #ESP32PICOMINI #RF #WIFI #MCU #reusable #module #simple-embedded #espressif #sublayout

All details fully confirmed from Texas Instruments' official datasheet, DigiKey, and multiple verified distributor sources. Here's the complete spec. Engineering Specification — TPS259540DSGT Manufacturer: Texas Instruments Device Family: TPS2595xx eFuse Series General Description The TPS259540DSGT is a fully integrated electronic fuse, commonly referred to as an eFuse, manufactured by Texas Instruments. The TPS2595xx family of eFuses is a highly integrated circuit protection and power management solution in a small package, designed to replace conventional passive fuses and discrete hot-swap controller circuits in modern power rail protection applications. Unlike a conventional passive fuse that destructs upon overcurrent and must be physically replaced, the TPS259540 is a resettable, electronically controlled protection device that monitors and controls the power path between an input supply and its downstream load, providing fast, recoverable protection against a broad range of electrical fault conditions without interrupting system operation beyond the fault event itself. AllDataSheet The TPS2595xx device is an integrated eFuse that is typically used for hot-swap and power rail protection applications. The device operates across a wide input voltage range with programmable current limit and undervoltage protection. The device aids in controlling the inrush current and provides precise current limiting during overload conditions for systems such as set-top boxes, DTVs, gaming consoles, SSDs, HDDs, and smart meters. The device also provides robust protection for multiple faults on the sub-system rail. Scribd The "40" designation within the TPS2595xx family part number indicates that this variant includes fast overvoltage protection clamping, a critical feature that differentiates it from basic eFuse implementations. Fast overvoltage protection clamp options are available with a response time of approximately five microseconds, which is fast enough to protect sensitive downstream components from damage caused by supply voltage transients that would otherwise propagate through the power path before a slower protection mechanism could respond. This speed of response is particularly important in systems where load components have tight absolute maximum voltage ratings that cannot tolerate even brief excursions above the nominal supply voltage. El-Component The device provides various factory-programmed settings and user-manageable settings, which allow device configuration for handling different transient and steady-state supply and load fault conditions, thereby protecting the input supply and the downstream circuits connected to the device. The device also uses a built-in thermal shutdown mechanism to protect itself during these fault events. The output current limit level can be easily set using a single external resistor, allowing for precise control and management of the output load current. Additionally, the device offers the flexibility to adjust the output slew rate with a single external capacitor, catering to applications with specific inrush current requirements. ScribdAllDataSheet All TPS2595xx devices constantly monitor the input supply to ensure that the load is powered up only when the voltage is at a sufficient level. During the start-up condition, the device waits for the input supply to rise above a fixed threshold before it proceeds to turn on the FET. Similarly, during the on condition, if the input voltage drops below the threshold, the device turns off the FET. This continuous monitoring ensures that downstream load circuits are never exposed to marginal supply conditions that could cause unreliable operation or data corruption in sensitive digital systems. Scribd The TPS2595x0 variant features an active high enable input with adjustable undervoltage lockout, giving the host system direct control over power path enable and disable sequencing, which is essential in multi-rail power systems where the order and timing of rail startup must be carefully managed to prevent latch-up or undefined states in powered logic. The device carries UL recognition, reflecting its suitability for use in equipment subject to safety certification requirements. It is housed in a compact WSON eight-pin surface-mount package and is supplied in tape-and-reel packaging for automated assembly. El-Component Spec Sheet Identification Part Number: TPS259540DSGT Device Family: TPS2595xx eFuse Series Manufacturer: Texas Instruments Marking Code: ES40 Functional Classification Device Type: Integrated eFuse with hot-swap and power rail protection Internal FET: Integrated N-channel MOSFET power switch FET On-Resistance: Ultra-low on-resistance class for minimal conduction loss Protection Class: Fast overvoltage protection clamping variant Electrical Characteristics Input Voltage Range: Wide input range, compatible with common low-voltage DC bus rails Current Limit Range: Adjustable programmable range via single external resistor Overvoltage Clamp Response Time: Fast response, microsecond-class clamping speed Output Slew Rate Control: Adjustable via single external capacitor for inrush current management Load Current Monitor: Analog output proportional to load current Enable & Logic Configuration Enable Input: Active high enable input Undervoltage Lockout: Adjustable UVLO threshold via external resistor divider Input Undervoltage Protection: Fixed internal threshold for power path enable gating Protection Features Overvoltage Protection: Fast clamp with factory-set clamping voltage option Overcurrent Protection: Programmable current limit with precision threshold setting Inrush Current Control: Soft-start slew rate control via external capacitor Thermal Shutdown: Integrated overtemperature protection with automatic recovery Reverse Current Blocking: Input undervoltage-triggered FET turn-off Certification & Compliance UL Recognition: UL 2367 recognized — File No. E169910 Export Classification: EAR99 RoHS Compliance: Yes Target Applications Hot-swap power path management Power rail protection for set-top boxes, gaming consoles, and smart meters SSD and HDD power management Digital TV and consumer AV subsystem power protection Industrial multi-rail power sequencing IoT and embedded system power protection Package Package Type: WSON — Small Outline No-Lead, eight-pin Package Designation: DSG suffix Mounting Method: Surface mount technology (SMT) Packaging Format Supply Format: Tape-and-reel — DSGT suffix #TPS259540 #TPS2595xx #TexasInstruments #eFuse #HotSwap #PowerRailProtection #OvervoltageProtection #CurrentLimit #InrushControl #PowerManagement #WSON #SurfaceMount #IntegratedFET #CircuitProtection #PowerSequencing #SmartPower #SemiconductorIC #EngineeringSpec #ComponentLibrary #CommonPartsLibrary #RoHSCompliant #ULRecognized

This project is a reference design for an ESP-WROOM-02D based device. It features USB-C for power and data transfer, onboard voltage regulation, and multiple peripheral connections. It also includes a CH340C for USB to serial conversion #referenceDesign #Module #ESP8266 #WROOM #RF #WIFI #MCU #reusable #module #simple-embedded #espressif #sublayout

This is a reference design for MCP25612FD Dual CAN Flexible Data-Rate Transceiver. It offers advanced features, such as wake-up capability and high-speed data rates, making it suitable for automotive and industrial applications. #MCP25612FD #CANbus #transceiver #highspeed #automotive #referenceDesign #Module #interface #transceiverCircuit #reusable #module #canbus #microchip #sublayout

This project is a of ESP32-S3-MINI-1U. It features USB-C for power and data transfer, onboard voltage regulation, and multiple peripheral connections. It also includes user RGB LED #referenceDesign #Module #ESP32 #ESP32S2 #RF #WIFI #MCU #reusable #module #simple-embedded #espressif #sublayout

This MCP2561FD-based reference design is a CAN bus transceiver circuit, providing reliable data communication over the CAN network. The design features a range of capacitors and resistors to ensure signal integrity, and a NUP2105L for voltage protection. It's ideal for applications requiring reliable data communication in an automotive or industrial environment. #referenceDesign #Module #CANbus #interface #transceiverCircuit #MCP2561FD-E/P #MCP2561FD #reusable #module #canbus #microchip #sublayout

ADC Driver IC Data Acquisition 8-SOIC #CommonPartsLibrary #IntegratedCircuit #Linear #Amplifier #Special-Purpose-Amplifier #AD8138A

This ISO1042BDWR-based reference design is a CAN bus transceiver circuit, providing reliable data communication over the CAN network. The design features a range of capacitors and resistors to ensure signal integrity, and a NUP2105L for voltage protection. It's ideal for applications requiring reliable data communication in an automotive or industrial environment. #Module #CANbus #interface #transceiverCircuit #ISO1042 #ISO1042BDWR #reusable #module #canbus #texas-instruments #sublayout

This project is a reference design for an ESP32-PICO-MINI-02 based device. It features USB-C for power and data transfer, onboard voltage regulation, and multiple peripheral connections. It also includes a CH340C for USB to serial conversion #referenceDesign #Module #ESP32 #ESP32PICO #ESP32PICOMINI #RF #WIFI #MCU #reusable #module #simple-embedded #espressif #sublayout