Electronic Fuse Regulator High-Side 60A 26-VQFN-HR (5x4.5) The TPS259850RQPR is an integrated eFuse power protection device designed for robust power path management in low-voltage DC systems. Manufactured by Texas Instruments, this device provides advanced protection features including overvoltage protection, undervoltage protection, overcurrent limiting, short-circuit protection, reverse current blocking, and thermal shutdown. The device is optimized for applications requiring controlled inrush current, fault isolation, and system reliability in industrial, automotive, telecommunications, and embedded electronic systems. The TPS259850RQPR supports a wide operating input voltage range and integrates programmable protection thresholds to allow flexible system-level configuration. The device includes an internal MOSFET with low on-resistance for efficient power delivery while minimizing power dissipation. Fast fault response and automatic retry functionality enhance system robustness and reduce the need for external supervisory circuitry. The device is housed in a compact QFN package suitable for space-constrained PCB designs and supports high-current operation with efficient thermal performance. The integrated protection architecture simplifies power subsystem design while improving reliability and fault tolerance. Electrical Characteristics Input operating voltage range supports low-voltage DC power rails commonly used in embedded and industrial systems. Integrated low-RDS(on) MOSFET minimizes conduction losses and improves overall efficiency. Programmable current limiting enables configurable overcurrent protection. Fast short-circuit response protects downstream circuitry during fault events. Adjustable overvoltage and undervoltage thresholds allow flexible supply monitoring. Reverse current blocking prevents back-drive conditions and protects power sources. Thermal shutdown protection disables the device during excessive junction temperature conditions. Controlled output slew rate limits inrush current during startup and hot-plug events. Automatic retry and latch-off fault management modes are supported. Power-good indication output provides system power status monitoring. Protection Features Overcurrent protection with programmable current limit threshold. Short-circuit protection with rapid fault response. Input overvoltage protection. Input undervoltage lockout protection. Reverse current and reverse polarity protection support. Thermal shutdown with automatic recovery capability. Fault timer control for transient fault management. Safe hot-swap and hot-plug operation support. Mechanical Characteristics Package type is QFN with compact footprint optimized for high-density PCB layouts. Surface-mount device compatible with automated assembly processes. Thermally enhanced package construction improves heat dissipation. RoHS-compliant and suitable for lead-free manufacturing processes. Applications Industrial power distribution systems. Automotive electronic subsystems. Telecommunication and networking equipment. Server and storage platforms. Hot-swappable modules. USB Type-C and power delivery systems. Embedded computing platforms. FPGA and processor power rail protection. Battery-powered and portable electronic equipment. #commonpartslibrary #integratedcircuit #powermanagement #regulator

Accelerometer X, Y, Z Axis ±2g, 4g, 8g, 16g 0.05Hz ~ 1.6kHz 14-LGA (3x5) The ADXL345-EP is an extended performance version of the ADXL345, which is a small, thin, ultralow power, 3-axis accelerometer with high resolution (13-bit) measurement at up to ±16 g. Digital output data is formatted as 16-bit twos complement and is accessible through either a SPI (3- or 4-wire) or I2 C digital interface. The ADXL345-EP is well suited for extended temperature range industrial and aerospace equipment. It measures the static acceleration of gravity in tilt-sensing applications, as well as dynamic acceleration resulting from motion or shock. Its high resolution (3.9 mg/LSB) enables measurement of inclination changes less than 1.0°. Several special sensing functions are provided. Activity and inactivity sensing detect the presence or lack of motion by comparing the acceleration on any axis with user-set thresholds. Tap sensing detects single and double taps in any direction. Freefall sensing detects if the device is falling. These functions can be mapped individually to either of two interrupt output pins. An integrated memory management system with a 32-level first in, first out (FIFO) buffer can be used to store data to minimize host processor activity and lower overall system power consumption. Low power modes enable intelligent motion-based power management with threshold sensing and active acceleration measurement at extremely low power dissipation. The ADXL345-EP is supplied in a small, thin, 3 mm × 5 mm × 1 mm, 14-lead, enhanced plastic package. Ultralow power: as low as 23 µA in measurement mode and 0.1 µA in standby mode at VS = 2.5 V (typical) Power consumption scales automatically with bandwidth User-selectable resolution from 10 to 13 bits 4 mg/LSB scale factor in all g ranges 32-sample FIFO minimizes host processor load Single tap, double tap, and free-fall detection Activity/inactivity monitoring Supply voltage range: 2.0 V to 3.6 V I/O voltage range: 1.7 V to VS SPI (3- and 4-wire) and I2C digital interfaces Flexible interrupt modes mappable to either interrupt pin Measurement ranges selectable via serial command Bandwidth selectable via serial command 10,000 g shock survival Pb free/RoHS compliant #commonpartslibrary #integratedcircuit #accelerometer

Digital Potentiometer 10k Ohm 4 Circuit 257 Taps I2C Interface 20-TSSOP # Engineering Specification ## Product Name MCP4461-103E/ST ## General Description MCP4461-103E/ST is a non-volatile digital potentiometer integrated circuit designed to provide electronically programmable resistance adjustment for analog and mixed-signal applications. The device enables precise digital control of resistance values through a serial communication interface, eliminating the need for manual potentiometer adjustments and enhancing system automation capabilities. The component integrates multiple resistor networks, non-volatile memory, and digital control logic within a compact package, making it suitable for signal conditioning, gain adjustment, calibration, offset trimming, volume control, and configuration management applications. The design supports reliable operation in embedded systems, industrial electronics, instrumentation equipment, communication devices, and consumer products requiring programmable analog control. The device is optimized for ease of integration, low power consumption, repeatable performance, and long-term reliability. Non-volatile memory functionality allows resistance settings to be retained during power interruptions, supporting consistent system behavior and simplified startup configuration. ## Functional Requirements ### Digital Resistance Control The device shall provide programmable resistance adjustment through a digital communication interface. ### Non-Volatile Memory Operation The device shall retain programmed resistance settings when power is removed and restore stored values upon power-up. ### Multi-Channel Adjustment The device shall support independent control of multiple resistance channels for flexible system configuration. ### Analog Signal Conditioning The device shall support use in gain control, calibration, bias adjustment, offset correction, and signal tuning applications. ## Electrical Requirements ### Power Supply Compatibility The device shall operate from standard low-voltage electronic power supply rails suitable for embedded and industrial systems. ### Digital Communication The device shall support serial communication for configuration, programming, and control of internal resistance networks. ### Resistance Network Performance The device shall provide repeatable and stable resistance adjustment characteristics throughout normal operating conditions. ### Low Power Operation The device shall minimize power consumption while maintaining functional performance and memory retention capability. ### Noise and Signal Integrity The design shall support accurate analog signal processing with minimal impact on system performance. ## Mechanical Requirements ### Package Construction The component shall be supplied in a surface-mount package suitable for automated PCB assembly processes. ### Board Integration The device shall support standard printed circuit board mounting practices and electronic manufacturing workflows. ### Structural Reliability The package shall maintain electrical and mechanical integrity during handling, assembly, and operational service. ## Environmental Requirements ### Operating Environment The device shall operate reliably within environmental conditions commonly encountered in commercial and industrial electronic equipment. ### Storage Conditions The component shall maintain functional and physical integrity during storage, transportation, and inventory management activities. ### Environmental Robustness The design shall support stable operation under expected temperature and humidity variations within specified application environments. ## Quality Requirements ### Reliability The device shall provide consistent long-term performance with stable resistance characteristics and memory retention capability. ### Verification Electrical functionality, communication performance, memory operation, and resistance adjustment behavior shall be validated through applicable testing procedures. ### Compliance The product shall conform to relevant semiconductor manufacturing, quality assurance, and electronic component standards. ## Documentation Requirements Technical documentation shall include device functionality, communication interface requirements, programming guidelines, application recommendations, electrical characteristics, package information, and reliability considerations. ## Classification Tags #MCP4461 #MCP4461103EST #DigitalPotentiometer #NonVolatileMemory #IntegratedCircuit #ICComponent #AnalogElectronics #MixedSignalDesign #SignalConditioning #GainControl #CalibrationCircuit #EmbeddedSystems #ElectronicComponents #ElectricalEngineering #PCBDesign #CircuitDesign #IndustrialElectronics #Instrumentation #CommonPartsLibrary #EngineeringSpecification #ComponentLibrary #TechnicalDocumentation #SystemIntegration #HardwareDevelopment #ReliabilityEngineering

Thermal Image Sensor 32H x 24V TO-39 # MLX90640ESF-BAB-000-TU Engineering Specifications **General Description** The MLX90640ESF-BAB-000-TU is a contactless infrared thermal imaging sensor manufactured by Melexis. It incorporates a microbolometer array that detects infrared radiation emitted by objects and converts the captured thermal energy into temperature data, enabling the creation of thermal images without physical contact. The device is designed for compact and cost-effective thermal imaging applications, offering high thermal sensitivity and accurate temperature measurement capabilities. It integrates a digital signal-processing engine, calibration data memory, and a digital communication interface, allowing direct connection to microcontrollers, embedded systems, and industrial monitoring equipment. The sensor provides real-time thermal mapping across its field of view and is suitable for applications involving human presence detection, predictive maintenance, industrial automation, smart building systems, medical screening, consumer electronics, robotics, and thermal monitoring solutions. Its factory calibration ensures stable performance throughout its operating life while minimizing external calibration requirements. **Engineering Specifications** **Manufacturer:** Melexis **Manufacturer Part Number:** MLX90640ESF-BAB-000-TU **Component Type:** Infrared thermal imaging sensor **Sensor Technology:** Microbolometer thermal sensor array **Measurement Method:** Non-contact infrared temperature sensing **Output Type:** Digital thermal image data **Communication Interface:** I²C-compatible serial interface **Temperature Measurement Capability:** Object temperature monitoring and thermal imaging **Thermal Imaging Function:** Real-time thermal map generation **Integrated Processing:** On-chip signal processing and calibration management **Calibration:** Factory calibrated with stored calibration parameters **Power Supply Configuration:** Single-supply operation **Power Consumption:** Optimized for low-power embedded applications **Refresh Rate:** Programmable thermal frame refresh operation **Thermal Sensitivity:** High-sensitivity infrared detection **Field of View Variant:** Wide-angle thermal imaging configuration **Accuracy Characteristics:** High-precision temperature measurement with integrated compensation algorithms **Memory Features:** Internal EEPROM for calibration coefficients **Operating Mode:** Continuous and programmable thermal acquisition **Data Output Format:** Digital temperature and thermal pixel information **Environmental Stability:** Designed for reliable operation across varying ambient conditions **Electromagnetic Compatibility:** Suitable for embedded and industrial electronic systems **Package Type:** Surface-mount package with infrared-transparent window **Mounting Style:** Surface mount technology **Package Construction:** Reflow-solderable assembly **Lead Finish:** Lead-free finish **Environmental Compliance:** RoHS compliant and halogen-free **Reliability Features:** Factory-tested and production-calibrated thermal imaging device **Typical Applications** Thermal cameras Human presence detection systems Occupancy monitoring Industrial predictive maintenance Electrical equipment inspection Smart building automation HVAC monitoring systems Medical screening devices Consumer electronics Robotics and autonomous systems Fire detection and prevention systems Industrial process monitoring Energy management systems Automotive thermal sensing applications Security and surveillance equipment #MLX90640 #MLX90640ESF #Melexis #ThermalSensor #InfraredSensor #ThermalImaging #Microbolometer #TemperatureSensor #IndustrialAutomation #EmbeddedSystems #IoT #PredictiveMaintenance #SmartBuilding #ThermalCamera #ElectronicComponents #EngineeringSpecifications

Buck Switching Regulator IC Positive Fixed 3.3V 1 Output 2A 8-SOIC (0.154", 3.90mm Width) # L6982N33DR ## General Description The L6982N33DR is a high-efficiency synchronous step-down switching regulator manufactured by STMicroelectronics. It is designed to provide a fixed regulated output voltage from a wide input voltage range while maintaining excellent conversion efficiency and low power dissipation. The device integrates high-side and low-side power MOSFETs, control circuitry, protection features, and compensation functions within a compact package, reducing external component count and simplifying power supply design. Its robust architecture makes it suitable for industrial automation systems, distributed power architectures, telecommunications equipment, embedded systems, consumer electronics, smart devices, and battery-powered applications requiring efficient DC-to-DC voltage conversion. ## Key Features ### Power Conversion Architecture * Synchronous buck regulator topology * Fixed output voltage regulation * Integrated power MOSFETs * High-efficiency power conversion * Optimized switching performance * Reduced external component requirements ### Electrical Characteristics * Wide input voltage operating range * Stable output voltage regulation * High conversion efficiency * Low standby power consumption * Fast transient response * Low output ripple performance ### Control Features * Current-mode control architecture * Internal compensation circuitry * Soft-start functionality * Frequency synchronization capability * Stable operation under varying load conditions ### Protection Features * Overcurrent protection * Short-circuit protection * Thermal shutdown protection * Undervoltage lockout protection * Safe startup operation * Enhanced system reliability ### Power Management * Low-power operating modes * Energy-efficient design * Suitable for battery-powered systems * Optimized thermal performance * Reduced power dissipation ### Package Characteristics * Surface-mount package * Compact footprint * Automated assembly compatible * High-density PCB design support * Industrial-grade packaging ### Material Construction * Monolithic integrated power management solution * Lead-free package materials * RoHS-compliant construction * High-reliability semiconductor technology ### Environmental Characteristics * Suitable for industrial operating environments * Long operational service life * Reliable continuous operation * Robust thermal performance ### Application Areas * Industrial Automation Equipment * Embedded Systems * Microcontroller Power Supplies * FPGA and Processor Power Rails * Telecommunications Equipment * Smart Metering Systems * Consumer Electronics * Building Automation Systems * Distributed Power Architectures * Battery-Powered Devices * IoT Products * Power Management Modules ### Compliance * RoHS Compliant * Lead-Free Compatible * Industrial-Grade Power Management Solution ## Manufacturer STMicroelectronics ## Product Family L6982 Synchronous Step-Down Switching Regulator Series #L6982N33DR #STMicroelectronics #BuckConverter #DCtoDCConverter #SwitchingRegulator #PowerManagement #PowerSupplyDesign #EmbeddedSystems #IndustrialElectronics #VoltageRegulator #PowerElectronics #IoTDevices #ElectronicsEngineering #PCBDesign #SMPS

Half Bridge (2) Driver DC Motors, General Purpose NMOS, Power MOSFET 24-VQFN (4x4) The DRV8770RGER is a high-voltage brushed DC motor gate driver integrated circuit manufactured by Texas Instruments, designed to drive external N-channel power MOSFETs configured in a dual half-bridge topology for use in brushed DC motor control, stepper motor drive, solenoid actuation, and other inductive load switching applications. Rather than integrating the power stage transistors directly within the IC, the DRV8770 functions as a gate driver, providing the gate voltage and current needed to fully and rapidly switch external discrete power MOSFETs, which allows the designer to choose power devices appropriate to the specific voltage and current requirements of their motor or load without being constrained by the internal power stage of an integrated motor driver. The DRV8770 delivers two half-bridge gate drivers, each capable of driving high-side and low-side N-channel power MOSFETs. The integrated bootstrap diode and external capacitor generate the correct gate drive voltages for the high-side MOSFETs, while the GVDD rail drives the gates of the low-side MOSFETs. This bootstrap architecture eliminates the need for an external isolated gate drive power supply for the high-side switch, simplifying the overall power stage design significantly compared to approaches that require separate high-side power supply generation. This device decreases system component count, reduces PCB area, and saves cost by integrating two independent half-bridge gate drivers and bootstrap diodes. digikeyTME The high-side and low-side gate drivers can drive source and sink currents sufficient for fast, efficient switching of external power MOSFETs, with total average output current capability defined in the datasheet. The asymmetric source and sink current capability is a deliberate design choice reflecting the typical requirements of power MOSFET switching, where rapid turn-off is often more critical than turn-on speed for preventing shoot-through and managing switching losses in bridge circuits. Small propagation delay and delay matching specifications minimize the dead-time requirement, which further improves efficiency. TMEFarnell The high voltage tolerance of the gate drive pins improves system robustness. The SHx phase pins can tolerate significant negative voltage transients, while the high-side gate driver supply can support higher positive voltage transients on the BSTx and GHx pins. This enhanced transient tolerance is essential in motor drive applications where inductive switching generates voltage spikes and negative voltage excursions on the switch node that would damage less robust gate driver designs. An input deglitcher prevents high-frequency noise on the input pins from affecting the output state of the gate drivers, protecting against inadvertent switching caused by electrical noise on the control interface lines. FarnellAllDataSheet The device can drive one or two DC brush motors, one stepper motor, solenoids, or other inductive loads. This versatility makes it suitable across a broad range of actuator types within the same hardware platform, allowing a single PCB design to serve multiple product variants by simply changing the connected load and the firmware control scheme. Undervoltage protection is provided for both low-side and high-side through GVDD and BST undervoltage lockout, preventing the external power MOSFETs from operating with insufficient gate drive voltage, which would cause them to enter a linear operating region with excessive power dissipation and potential thermal damage. digikeyFarnell The DRV8770RGER is housed in a compact VQFN twenty-four-pin surface-mount package, suited to space-constrained motor drive PCB layouts, and is rated for operation across an extended industrial temperature range. Spec Sheet Identification Part Number: DRV8770RGER Device Family: DRV8770 Manufacturer: Texas Instruments Functional Classification Device Type: Dual half-bridge N-channel MOSFET gate driver IC Topology: Two independent half-bridge gate drivers Application Class: Brushed DC motor, stepper motor, solenoid, and inductive load drive Gate Drive Architecture High-Side Driver: Bootstrap-based gate drive with integrated bootstrap diode Low-Side Driver: GVDD-referenced direct gate drive Gate Drive Current — Source: High source current capability for rapid MOSFET turn-on Gate Drive Current — Sink: Higher sink current capability for rapid MOSFET turn-off Voltage Ratings Maximum Operating Voltage: High-voltage class, suited to industrial motor supply rails Phase Pin Transient Tolerance: Rated for negative voltage transients on SHx switch node pins Bootstrap Pin Transient Tolerance: Elevated absolute maximum on BSTx and GHx pins for spike immunity Timing & Switching Performance Propagation Delay: Small and tightly specified for minimal dead-time requirement Delay Matching: High-side to low-side delay matching for improved bridge efficiency Input Deglitching: Built-in input deglitch filter to suppress high-frequency noise on control inputs Protection Features GVDD Undervoltage Lockout: Protects low-side gate drive from insufficient supply BST Undervoltage Lockout: Protects high-side gate drive from insufficient bootstrap voltage Negative Transient Tolerance: Phase pins rated for switch-node negative voltage excursions Load Compatibility Supported Load Types: Brushed DC motors, stepper motors, solenoids, and general inductive loads Drive Configurations: Single or dual brushed DC motor, single stepper motor, or independent half-bridge loads Environmental & Qualification Operating Temperature Range: Extended industrial temperature range RoHS Compliance: Yes Lifecycle Status: Active production Package Package Type: VQFN — Very thin Quad Flat No-Lead, twenty-four-pin Package Suffix: RGER designation Mounting Method: Surface mount technology (SMT) Package Pitch: Fine pitch, compact footprint Packaging Format Supply Format: Tape-and-reel, cut-tape, and custom reel options available #DRV8770 #DRV8770RGER #TexasInstruments #GateDriver #HalfBridgeDriver #BrushedDCMotor #MotorDriver #StepperMotorDriver #SolenoidDriver #NChannelMOSFET #BootstrapDriver #HighVoltageDriver #PowerElectronics #MotorControl #InductiveLoad #VQFN #SurfaceMount #SemiconductorIC #EngineeringSpec #ComponentLibrary #CommonPartsLibrary #RoHSCompliant #IndustrialMotorDrive

MIPS32® M-Class PIC® 32MZ Microcontroller IC 32-Bit 200MHz 2MB (2M x 8) FLASH 100-TQFP (12x12) The PIC32MZ2048EFM100-I/PT is built around a MIPS32® M-Class core operating at up to 200 MHz, delivering high computational performance suitable for real-time control, signal processing, and communication-intensive systems. It integrates large on-chip memory, multiple communication interfaces, and rich peripheral support in a compact package. Key Features Core Architecture: 32-bit MIPS32® M-Class CPU Clock Speed: Up to 200 MHz Program Memory: 2 MB Flash RAM: 512 KB Package: 100-pin TQFP (12×12 mm), surface-mount Operating Voltage: 2.1 V to 3.6 V I/O Pins: Up to 78 programmable I/O Integrated Peripherals & Interfaces Communication Interfaces: CAN, Ethernet, USB OTG I²C, SPI, SQI, UART/USART Parallel Master Port (PMP) Analog Features: 40-channel, 12-bit ADC System Peripherals: DMA controller PWM modules Watchdog timer (WDT) Brown-out reset and power-on reset Advanced Features: Floating Point Unit (FPU) for fast math operations Hardware crypto engine (AES, SHA, etc., depending on variant) High-speed USB and Ethernet connectivity #CommonPartsLibrary #IntegratedCircuit #Microcontroller #PIC® 32MZ

WiFi 802.11b/g/n Transceiver Module 2.412GHz ~ 2.484GHz Integrated, Chip Surface Mount #commonpartslibrary #integratedcircuit #rf #transceiver

USB Type C PMIC 40-TQFN (6x6) The MAX25432 combines an automotive-grade buckboost controller capable of full-range 3.3V to 21V programmable power supply (PPS) at up to 6.35A, USB Power Delivery (USB PD) analog front-end (AFE), legacy USB charging support, and USB Type-C® protection switches for automotive USB host or downstream-facing (DFP) applications. The USB TypeC protection switches provide automotive system-level ESD protection and 24V short-circuit protection for D+, D-, CC1, CC2, and VCONN. The device can optionally support legacy charging modes for older passenger phones including BC1.2, Apple® Charge, Apple CarPlay®, Apple MFi, and USB On-The-Go (OTG). The MAX25432B integrates a USB PD AFE, which supports the USB-IF Type-C Port Controller Interface (TCPCI) specification and can interface with any I2C controller in the application. The MAX25432A provides configuration channel (CC) signal pass-through protection for an external USB PD controller. P-suffix and G-suffix devices include intelligent detection and protection to avoid high short-circuit currents flowing from the car battery through the cable shield to ground during fault events, thus preventing car module damage. The MAX25432 is available in a small, 6mm x 6mm, 40- pin TQFN-EP package and requires very few external components. The MAX25432 evaluation (EV) kit and collateral provide a convenient platform to the design engineer for rapid evaluation with reduced test and firmware development time. Integrated I2C Buck-Boost Controller with PPS 4.5V to 36V Input Operating Range 3.3V to 21V Constant Voltage, 10mV LSB 1A to 6.35A Current Limit, 25mA LSB 220kHz, 300kHz, and 400kHz SwitchingFrequency VBUS Cable Compensation up to 516mΩ External Frequency Synchronization and SpreadSpectrum for Reduced EMI USB PD 3.1 Type-C Port Controller USB-IF Compliant - TID 9154 Up to 800mV Ground Offset Pairs with ADI TCPM for Turn-Key Solution MAX25432BATLP Enables: ADI TCPM Alternate Mode and Dual-Role Port Improved CC Detection Advanced Monitoring Algorithms (V, T) Dynamic Loop Control Highest Performance, Safest, and Lowest Cost Passenger Cable-Shield Short-to-Battery Protection Minimizes Short-Circuit Currents with a Small,Single-FET Solution Integrated Current-Sense Amplifiers, ADC and DAC Integrated 3.3V to 5.0V, 1.5W, Smart, Reliable VCONN Switches and Protection, 50mA to 500mA OCP Integrated 24V DC Protection on Protected HVD+, HVD-, HVCC1, HVCC2 Outputs Integrated Legacy USB 2.0 Charging Support Including BC1.2, Apple CarPlay, OTG, and Apple MFi Rev 3x Integrated ±15kV Air-Gap/±8kV Contact Discharge ISO 10605 and IEC 61000-4-2 ESD Protection -40°C to +125°C Operating Temperature Range 40-Pin, 6mm x 6mm, TQFN Package with EP AEC-Q100 and AEC-Q006 Qualified #CommonPartsLibrary #IntegratedCircuit #PowerManagement

USB-C (USB TYPE-C) Receptacle Connector 24 Position Panel Mount, Through Hole, Right Angle The MUSBRM1C1M0 is a ruggedized USB Type-C receptacle connector designed for high-reliability data and power connectivity in industrial, embedded, transportation, and harsh-environment applications. The connector features a reversible USB Type-C interface that supports modern high-speed communication protocols while providing robust mechanical durability and secure board-level attachment. Its reinforced construction helps withstand vibration, shock, and repeated mating cycles, making it suitable for demanding applications where reliability and long service life are critical. The device is commonly used in industrial controllers, communication equipment, medical devices, consumer electronics, and next-generation embedded systems requiring compact and versatile connectivity. Engineering Specifications Manufacturer: Amphenol Communications Solutions Part Number: MUSBRM1C1M0 Connector Type: USB Type-C Receptacle Interface Standard: Universal Serial Bus Type-C Connector Gender: Receptacle Mounting Style: Surface Mount Orientation: Right Angle Contact Configuration: USB Type-C Multi-Function Interface Data Support: High-Speed Data Transmission Power Delivery Support: Compatible with USB Power Delivery Architectures Shielding: Integrated EMI Shielding Contact Material: Copper Alloy Contact Finish: Gold-Plated Contact Interface Housing Material: High-Strength Metal Shield Construction Durability: High Mating Cycle Life Environmental Performance: Designed for Industrial Applications Operating Temperature Range: Industrial Grade RoHS Compliant: Yes Applications: Embedded Systems, Industrial Automation, Consumer Electronics, Communication Equipment, Medical Devices, IoT Products, Portable Electronics, Data Acquisition Systems Key Features Reversible USB Type-C connection interface Ruggedized mechanical construction High-speed data communication capability Secure PCB mounting design Enhanced resistance to vibration and mechanical stress Integrated shielding for improved electromagnetic compatibility Compact footprint for space-constrained designs Supports modern USB power and data architectures Long operational lifespan with high insertion cycle durability Suitable for industrial and commercial electronic systems #MUSBRM1C1M0 #Amphenol #USBTypeC #USBConnector #TypeCReceptacle #HighSpeedConnectivity #PowerDelivery #IndustrialElectronics #EmbeddedSystems #CommunicationEquipment #IoTDevices #ConsumerElectronics #PCBDesign #ElectronicComponents #SurfaceMount #DataTransmission #USBPD #IndustrialAutomation #MedicalElectronics #ConnectorTechnology

Multiprotocol LPWAN 32-bit Arm Cortex-M4 MCUs, LoRa, (G)FSK, (G)MSK, BPSK, up to 256KB flash, 64KB SRAM IC RF TxRx + MCU 802.15.4 LoRa™ 150MHz ~ 960MHz 73-UFBGA The STM32WLE5JCI6 is an ultra-low-power wireless System-on-Chip (SoC) from STMicroelectronics that combines a 32-bit Arm Cortex-M4 microcontroller with an integrated sub-GHz radio transceiver. It is designed for long-range, low-power IoT and LPWAN applications such as smart metering, smart cities, industrial sensors, and remote monitoring systems. It supports multiple modulation schemes including LoRa®, (G)FSK, (G)MSK, and BPSK, making it flexible for both proprietary and standardized wireless protocols like LoRaWAN®. The device integrates RF, analog, digital, and security features into a single chip to reduce external components and PCB size. Key Features Core & Performance 32-bit Arm® Cortex®-M4 core up to 48 MHz DSP instructions and MPU support Up to 256 KB Flash and 64 KB SRAM Wireless Radio Sub-GHz frequency range: 150 MHz – 960 MHz Supports LoRa®, (G)FSK, (G)MSK, BPSK High receiver sensitivity up to –148 dBm (LoRa mode) Output power up to +22 dBm Ultra-Low Power Operation Supply voltage: 1.8 V – 3.6 V Very low sleep currents (nA–µA range) Optimized for battery-powered and energy-harvesting devices Peripherals Up to 43 GPIOs ADC (12-bit), DAC, comparators Multiple timers (16-bit and 32-bit) Interfaces: SPI, I2C, UART/USART, LPUART, I2S Security Features Hardware AES-256 encryption True Random Number Generator (TRNG) Secure memory protection and unique device ID System Integration Integrated RF + MCU (highly reduced BOM) OTA firmware update capability Industrial temperature range (typically –40°C to +85°C / +105°C depending variant) Summary The STM32WLE5JCI6 is a highly integrated LoRa-capable MCU + RF transceiver SoC, optimized for long-range wireless communication with extremely low power consumption, making it ideal for IoT devices that must run for years on battery power. #CommonPartsLibrary #IntegratedCircuit #STM32WLE5JCI6 #STM32WL #LoRa #IoT #LowPowerMCU #ArmCortexM4 #SubGHzRF #WirelessMCU #LPWAN #STMicroelectronics

16 Bit Digital to Analog Converter 1 40-VQFN (6x6) The DAC81416RHAT is a precision, low-power, multi-channel digital-to-analog converter designed for high-accuracy industrial and instrumentation applications. It integrates sixteen independently programmable voltage-output DAC channels with internal precision reference support, output buffering, and flexible serial communication capability. The device is optimized for systems requiring deterministic analog signal generation, high linearity, low drift, and stable long-term performance. Typical applications include automated test equipment, process control, programmable logic controllers, data acquisition systems, and closed-loop control platforms. The device supports high-resolution output generation with monotonic behavior and excellent channel-to-channel matching. Integrated diagnostic and protection features improve system reliability in harsh operating environments. The architecture is intended for dense analog output designs where low power consumption, compact footprint, and precision accuracy are critical. Engineering Specification Manufacturer: Texas Instruments Device Type: Multi-Channel Precision Voltage Output Digital-to-Analog Converter Package Type: VQFN Mounting Type: Surface Mount Channel Configuration: Sixteen independent DAC output channels DAC Resolution: High-resolution precision architecture suitable for industrial control and instrumentation systems Output Type: Buffered voltage output Interface Type: SPI-compatible serial interface Reference Support: Internal reference with external reference capability Power Supply Operation: Single-supply analog and digital operation Output Characteristics: Rail-to-rail capable buffered analog outputs with low glitch energy and fast settling behavior Linearity Performance: High integral and differential linearity with monotonic output behavior across full operating range Noise Performance: Low output noise and low temperature drift for precision signal generation Update Capability: Simultaneous and asynchronous channel update support Calibration Features: Integrated gain and offset correction support Diagnostic Features: Communication integrity monitoring and fault detection capability Industrial Features: Designed for precision automation, process control, programmable instrumentation, and multi-channel analog control systems Temperature Range: Industrial operating temperature range Protection Features: Robust serial interface handling and stable output drive architecture for industrial environments Applications: Industrial automation, programmable power control, automated test equipment, data acquisition systems, instrumentation, and closed-loop analog control platforms #commonpartslibrary #integratedcircuit #analog #digital #converter

2 Line Common Mode Choke Surface Mount 100mA DCR 3Ohm (Typ) , -55C ~ 125C The ECMF2-40A100N6 and ECMF4-40A100N10 are highly integrated common mode filters designed to suppress EMI/RFI common mode noise on high speed differential serial buses like HDMI 2.1, HDMI 2.0, HDMI1.4, USB4, USB 3.2 Gen 2, USB 2.0, ethernet, MIPI, Display Port and other high speed serial interfaces. They have a very large differential bandwidth to comply with these standards and can also protect and filter one or two differential lanes. 10.7 GHz differential bandwidth to comply with HDMI 2.1, HDMI 2.0, HDMI 1.4, USB4, USB 3.2 Gen2, USB 2.0, MIPI, Display port 2.0, etc. • High common mode attenuation on WLAN frequencies: – -15 dB at 2.4 GHz – -21 dB at 5.0 GHz – -17 dB at 6.0 GHz • Low serial resistance: 3.0 Ω • Very low PCB space consumption • Thin package: 0.5 mm max. • High reduction of parasitic elements through integration • Lead free and RoHS package • Exceeds IEC 61000-4-2 level 4 standard: – Contact discharge: ◦ ±9 kV (contact discharge, ECMF2-40A100N6) ◦ ±10 kV (contact discharge, ECMF4-40A100N10) – Air discharge: ◦ ±20 kV (air discharge, ECMF2-40A100N6) ◦ ±25 kV (air discharge, ECMF4-40A100N10)

ADC, Audio 32 b 7.35k ~ 768k I2C, I2S, TDM 20-WQFN (3x3) The TLV320ADC3120IRTER is a low-power, high-performance stereo audio analog-to-digital converter designed for voice, audio capture, and digital signal processing applications. The device integrates programmable microphone bias generation, low-noise input amplifiers, digital filtering, automatic gain control, and high-resolution audio conversion into a compact package. It supports a wide range of analog microphone and line-level input configurations while delivering excellent audio fidelity and power efficiency. The converter is optimized for portable electronics, smart devices, industrial audio systems, communication equipment, and embedded voice-processing applications requiring high-quality audio digitization. Engineering Specifications Manufacturer: Texas Instruments Part Number: TLV320ADC3120IRTER Device Type: Stereo Audio Analog-to-Digital Converter Audio Channels: Stereo Input Architecture Converter Type: Sigma-Delta Analog-to-Digital Converter Resolution: High-Resolution Audio Conversion Input Configuration: Differential and Single-Ended Inputs Microphone Support: Integrated Microphone Bias Generation Programmable Gain: Integrated Low-Noise Programmable Gain Amplifiers Digital Processing: Integrated Digital Filters Automatic Gain Control: Supported Audio Interface: Digital Audio Serial Interface Power Consumption: Low Power Operation Clocking Support: Flexible Audio Clock Configuration Noise Performance: Low Noise Audio Acquisition Dynamic Range: High Dynamic Range Package Type: WQFN Package Mounting Style: Surface Mount Operating Temperature Range: Industrial Grade RoHS Compliant: Yes Applications: Voice Capture Systems, Smart Speakers, Audio Recording Equipment, Industrial Audio Devices, Communication Systems, Embedded Audio Platforms, Human Machine Interfaces, Portable Electronics Key Features High-performance stereo audio conversion Integrated microphone bias circuitry Low-noise programmable gain amplifiers Automatic gain control functionality Flexible digital audio interface support Optimized for voice and audio capture applications Low power consumption for portable devices Integrated digital signal processing features High audio fidelity and dynamic range Compact surface-mount package for space-constrained designs #TLV320ADC3120IRTER #TexasInstruments #AudioADC #AudioConverter #StereoADC #DigitalAudio #VoiceCapture #AudioProcessing #EmbeddedAudio #MicrophoneInterface #AudioElectronics #DSP #IndustrialElectronics #SmartDevices #PortableElectronics #SignalProcessing #SurfaceMount #ElectronicComponents #PCBDesign #AudioSystemDesign

Bluetooth Bluetooth v5.2 Transceiver Module 2.4GHz ~ 2.4835GHz Integrated, Chip Surface Mount #commonpartslibrary #integratedcircuit #rf #transceiver

IC RF TxRx + MCU 802.15.4, Bluetooth Bluetooth v5.4, Matter, Thread, Zigbee® 47-XFBGA, WLCSP # NRF54L15-CAAA-R7 ## General Description The NRF54L15-CAAA-R7 is an ultra-low-power wireless System-on-Chip (SoC) developed by [Nordic Semiconductor](https://www.nordicsemi.com?utm_source=chatgpt.com) for advanced Internet of Things (IoT), industrial, medical, smart home, and wireless sensing applications. The device integrates a high-performance Arm Cortex-M33 processor, a dedicated RISC-V coprocessor, large embedded memory resources, and a multiprotocol 2.4 GHz radio subsystem into a compact package. It is designed to provide exceptional energy efficiency, robust wireless connectivity, and enhanced security while supporting modern wireless standards including Bluetooth® Low Energy, Matter, Thread, Zigbee®, Bluetooth Mesh, Amazon Sidewalk, and proprietary 2.4 GHz protocols. The device is optimized for battery-powered applications requiring extended operating life, high processing capability, and scalable connectivity solutions. ## Key Features ### Processing Architecture * 128 MHz Arm® Cortex®-M33 application processor * Integrated 128 MHz RISC-V coprocessor * TrustZone® security architecture ### Memory Resources * 1.5 MB Non-Volatile Memory (NVM) * 256 KB RAM ### Wireless Connectivity * Multiprotocol 2.4 GHz RF transceiver * Bluetooth® Low Energy support * Matter support * Thread support * Zigbee® support * Bluetooth Mesh support * Amazon Sidewalk support * Proprietary 2.4 GHz protocol support * Bluetooth Channel Sounding capability * Compatible with Wi-Fi companion devices ### RF Performance * Data rates up to 4 Mbps * Output power up to +8 dBm * High receiver sensitivity for extended wireless range ### Security Features * Hardware cryptographic engine * Side-channel attack protection * Tamper detection mechanisms * Secure boot and secure firmware update support ### Peripheral Interfaces * SPI * I²C (TWI) * UART * I²S * GPIO * ADC * PWM * PDM * NFC * QDEC ### Power Characteristics * Ultra-low-power operation * Optimized sleep modes * Battery-powered application support * Operating supply voltage from 1.7 V to 3.6 V ### Package Information * WLCSP package * Surface-mount technology * Industrial operating temperature support ## Applications * Smart Home Devices * Industrial IoT Systems * Wearable Electronics * Medical and Healthcare Devices * Asset Tracking Solutions * Wireless Sensors * Building Automation Systems * Smart Lighting Controls * Consumer Electronics * Connected Peripheral Devices #NordicSemiconductor #nRF54L15 #NRF54L15CAAAR7 #BluetoothLE #Matter #Thread #Zigbee #IoT #WirelessSoC #EmbeddedSystems #IndustrialIoT #SmartHome #LowPowerDesign #CortexM33 #RISCV

Bluetooth Bluetooth v5.0 Transceiver Module 2.4GHz Integrated, Chip Surface Mount #RF #Module #RF-Transceiver #BL652-SA-01

Buck Regulator Positive Output Step-Down DC-DC Controller IC 24-VQFN (3.5x5.5) The LM5148RGYR specification defines the engineering requirements for a synchronous buck controller integrated circuit designed for high-efficiency DC-DC power conversion applications. This specification establishes the functional, electrical, mechanical, thermal, environmental, and quality requirements necessary to ensure reliable voltage regulation, efficient power management, and long-term operational stability in industrial, automotive, telecommunications, and embedded electronic systems. The device is intended for use in high-performance power supply designs requiring wide input voltage capability, precise output voltage regulation, and high-current conversion efficiency. It controls external power MOSFETs to implement synchronous buck converter topologies suitable for distributed power architectures, industrial automation equipment, networking infrastructure, battery-powered systems, and embedded control applications. Engineering Requirements The controller shall be manufactured using qualified semiconductor fabrication processes and high-quality materials to ensure stable switching performance, low power consumption, and reliable long-term operation. The device shall maintain consistent functionality under specified operating voltage, temperature, and environmental conditions. Electrical characteristics shall provide accurate pulse-width modulation control, stable output voltage regulation, fast transient response, and reliable gate drive capability for external synchronous power MOSFETs. The controller shall maintain predictable switching performance during startup, shutdown, overload, and dynamic load conditions while supporting efficient power conversion. The integrated control architecture shall provide robust regulation, protection features, and compensation capability to ensure stable converter operation across varying input voltages and output load conditions. The device shall maintain operational integrity during power sequencing and fault recovery without compromising system reliability. Thermal performance shall support continuous operation within the specified junction temperature range while maintaining electrical performance and reliability. The package shall be suitable for automated surface-mount assembly and compatible with standard solder reflow manufacturing processes. Mechanical construction shall withstand thermal cycling, vibration, mechanical handling, and environmental exposure without degradation of functionality. Workmanship shall be free from defects including contamination, package cracking, bond failures, lead deformation, or structural inconsistencies that could adversely affect electrical or mechanical performance. Inspection, validation, and testing shall be performed using calibrated equipment and controlled quality procedures to verify compliance with engineering and manufacturing requirements. Any deviation from this specification shall require formal engineering evaluation, documented technical justification, and approval through the established engineering change control process before implementation. Documentation Supporting documentation shall include engineering drawings, electrical performance specifications, application guidelines, thermal characterization reports, qualification records, inspection reports, material declarations, reliability data, and revision-controlled manufacturing documentation. All documentation shall be maintained under formal configuration management and quality assurance systems to ensure complete product traceability. Revision Control Any modification to this specification shall be managed through the formal engineering change management process. All revisions shall undergo technical review, validation, and approval before release to ensure continued compliance with design intent and applicable engineering standards. #EngineeringSpecification #BuckController #DCDCConverter #PowerManagement #SynchronousBuck #PowerElectronics #EmbeddedSystems #IndustrialElectronics #QualityAssurance #EngineeringDocumentation

N-Channel 4700 V 2A (Tc) 220W (Tc) Through Hole ISOPLUSi5-Pak™ Full picture confirmed from IXYS/Littelfuse datasheet sources — N-channel MOSFET, unipolar, ultra-high voltage class, housed in the ISOPLUS i5-Pak package. Here's the complete spec. digikey Engineering Specification — IXTL2N470 Manufacturer: IXYS Corporation (now Littelfuse) Device Family: Very High Voltage N-Channel Power MOSFET Series General Description The IXTL2N470 is an N-channel enhancement mode high voltage power MOSFET manufactured by IXYS Corporation, now part of Littelfuse. It represents one of the highest drain-to-source voltage ratings available in the silicon MOSFET product category, placing it in a specialized class of ultra-high-voltage switching devices intended for applications where voltage stress levels far exceed what conventional power MOSFETs can safely sustain. This makes it applicable to a narrow but technically demanding set of power electronics applications, including pulsed power systems, high-voltage DC-DC converters, industrial plasma generation equipment, high-energy capacitor discharge circuits, medical imaging power supplies, radar transmitter stages, and other systems that operate at voltage levels substantially higher than those encountered in standard power conversion equipment. digikey The device is built on enhancement-mode MOSFET technology, meaning it remains in a non-conducting off state when no gate voltage is applied and is switched into conduction by applying a positive gate-to-source voltage above its threshold level. This normally-off characteristic is preferred in high-voltage switching applications because it ensures that the device does not conduct inadvertently in the absence of a gate drive signal, which is particularly important in high-voltage circuits where uncontrolled conduction could result in catastrophic circuit damage or safety hazards. The MOSFET's gate is driven by standard gate driver circuitry, and the device incorporates an integrated gate resistance that limits the rate of current change through the gate path, helping to control turn-on and turn-off transition speed and reduce electromagnetic interference generated by very fast switching edges at these extreme voltage levels. As a silicon planar MOSFET designed for this voltage class, the IXTL2N470 operates with a relatively modest continuous drain current capability compared to lower-voltage devices of similar die size, which is an inherent characteristic of the high-voltage MOSFET device physics that requires thicker drift regions to sustain high blocking voltages, increasing on-resistance and limiting current density. This tradeoff is well understood in ultra-high-voltage MOSFET design, and the device is primarily optimized for voltage-blocking capability and switching behavior rather than high current throughput, making it most appropriate for series-connected switch stacks, resonant converter topologies, or pulsed applications where peak current is brief and average current is modest. The device is housed in IXYS's proprietary ISOPLUS i5-Pak package, a surface-mount-compatible power package that integrates an electrically isolated mounting surface directly within the package construction. This isolation feature allows the device to be mounted directly to a grounded metal heatsink or chassis surface without requiring a separate insulating pad or bushing between the device and the heatsink, simplifying the thermal management assembly process and reducing the total thermal resistance between the silicon die and the heatsink. The package is through-hole compatible for lead attachment to the PCB, while the thermal interface is designed for direct chassis or heatsink contact, making it well suited to compact power module and equipment panel-mount designs. Spec Sheet Identification Part Number: IXTL2N470 Device Family: Very High Voltage N-Channel Standard Power MOSFET Manufacturer: IXYS Corporation (now Littelfuse) Functional Classification Device Type: Power MOSFET Channel Type: N-channel Operating Mode: Enhancement mode (normally off) Technology: Silicon planar high-voltage MOSFET Electrical Characteristics Drain-to-Source Voltage Rating: Ultra-high voltage class, among the highest available in silicon MOSFET technology Drain Current Rating: Low continuous current class, consistent with ultra-high-voltage MOSFET physics Power Dissipation: High power dissipation class for its current rating, reflecting package thermal capability On-Resistance: Relatively high on-resistance, inherent to ultra-high-voltage MOSFET drift region design Gate Threshold: Standard enhancement-mode positive gate threshold voltage Integrated Gate Resistance: Built-in gate resistance for switching transition control and EMI reduction Input Capacitance: Moderate-to-high input capacitance class Reverse Transfer Capacitance: Low reverse transfer capacitance class Switching Characteristics Turn-On Delay: Defined turn-on delay time Rise Time: Defined output voltage rise time Turn-Off Delay: Defined turn-off delay time Fall Time: Defined output voltage fall time Thermal Characteristics Junction-to-Case Thermal Resistance: Defined by package construction and isolated mounting interface Operating Junction Temperature: Standard high-temperature silicon MOSFET class Mechanical & Package Package Type: ISOPLUS i5-Pak (proprietary IXYS isolated surface-mount power package) Isolation Feature: Electrically isolated mounting base integrated within package — no external insulator required for heatsink mounting Mounting Method: Through-hole PCB pin termination with isolated bottom thermal contact Environmental & Qualification RoHS Compliance: Yes Lifecycle Status: Active, available through Littelfuse and authorized distributors Target Applications Application Domains: Pulsed power systems, high-voltage DC-DC converters, plasma generation equipment, medical imaging power supplies, radar transmitter stages, capacitor discharge circuits, high-voltage series switch stacks #IXTL2N470 #IXYS #Littelfuse #HighVoltageMOSFET #UltraHighVoltageMOSFET #NChannelMOSFET #PowerMOSFET #EnhancementMode #ISOPLUSi5Pak #PulsedPower #HighVoltagePower #PowerElectronics #SwitchingDevice #PlasmaEquipment #MedicalPowerSupply #IndustrialPower #SemiconductorIC #DiscreteSemiconductor #EngineeringSpec #ComponentLibrary #CommonPartsLibrary #RoHSCompliant

Phase Lock Loop (PLL) IC 2.4MHz 1 16-DIP (0.300", 7.62mm) CD4046BE is a CMOS Micropower Phase-Locked Loop (PLL) integrated circuit that combines a linear Voltage-Controlled Oscillator (VCO), two phase comparators, a source follower, and a Zener diode in a single package. It is designed for frequency synthesis, frequency detection, FM demodulation, clock recovery, motor speed control, and other synchronization applications. The device operates over a wide supply voltage range and offers low power consumption, high noise immunity, and excellent VCO linearity. Key Features Wide operating supply voltage range: 3 V to 18 V Integrated Voltage-Controlled Oscillator (VCO) Two selectable phase comparators for flexible PLL design Operating frequency range up to approximately 1.4 MHz Very low power consumption High VCO linearity (typically <1%) Low frequency drift with temperature VCO inhibit control for ON/OFF keying applications Built-in source follower output for demodulation applications High noise immunity characteristic of CMOS technology Available in 16-pin PDIP (CD4046BE) package Typical Applications Frequency synthesis and multiplication FM modulation and demodulation Frequency discrimination Clock recovery and data synchronization Tone decoding Voltage-to-frequency conversion FSK modulation/demodulation Motor speed control systems Signal tracking and phase synchronization circuits Hashtags #CD4046BE #PLL #PhaseLockedLoop #VCO #ClockRecovery #FrequencySynthesizer #FMDemodulator #FSKModulation #CMOS #TexasInstruments #AnalogIC #TimingIC #SignalProcessing #EmbeddedSystems #ElectronicsDesign

ADC, Audio 32 b 8k ~ 192k I2S 20-WQFN (3x3) The PCM1822 is a high-performance, Burr-Brown™ audio analog-to-digital converter (ADC) that supports simultaneous sampling of up to two analog channels. The device supports single-ended and differential line and microphone inputs with a 1-VRMS full-scale signal. The device integrates a phase-locked loop (PLL), a DC removal high-pass filter (HPF), and supports sample rates up to 192 kHz. The device supports time-division multiplexing (TDM) or I2S audio formats, selectable with the hardware pin level. Additionally, the PCM1822 supports master and slave mode selection for the audio bus interface operation. These integrated high-performance features, along with the ability to be powered from a single supply of 3.3 V, make the device an excellent choice for costsensitive, space-constrained audio systems in far-field microphone recording applications. The PCM1822 is specified from –40°C to +125°C, and is offered in a 20-pin WQFN package. Features • Stereo high-performance ADC: – 2-channel analog microphones or line-in • ADC line and microphone differential and singleended input performance: – PCM1822 dynamic range: • 117-dB, dynamic range enhancer enabled • 111-dB, dynamic range enhancer disabled – THD+N: –95 dB • 1-VRMS full-scale input • ADC sample rate (fS) = 8 kHz to 192 kHz • Hardware pin control configurations • Linear-phase or low-latency filter selection • Flexible audio serial data interface: – Master or slave interface selection – 32-bits, 2-channel TDM – 32-bits, 2-channel I2S • Automatic power-down upon loss of audio clocks • Integrated high-performance audio PLL • Single-supply operation: 3.3 V • I/O-supply operation: 3.3 V or 1.8 V • Power consumption for 3.3-V AVDD supply: – 19.6 mW/channel at 16-kHz sample rate – 21.3 mW/channel at 48-kHz sample rate #CommonPartsLibrary #IntegratedCircuit #PCM1822IRTER #TexasInstruments #AudioADC #StereoADC #BurrBrown #I2S #TDM #AudioElectronics #EmbeddedAudio #SmartSpeaker #AVReceiver #HighResolutionAudio #PCBDesign #ElectronicsDesign #SignalProcessing

ARM® Cortex®-M0+ MSPM0 C Microcontroller IC 32-Bit 24MHz 16KB (16K x 8) FLASH 8-DSBGA (0.86x1.6) MSPM0C110x microcontrollers (MCUs) are part of the MSP highly-integrated ultra-low-power 32-bit MCU family based on the enhanced Arm® Cortex®-M0+ core platform operating at up to 24MHz frequency. These costoptimized MCUs offer high-performance analog peripheral integration, support extended temperature ranges from -40°C to 125°C, and operate with supply voltages from 1.62V to 3.6V. The MSPM0C110x devices provide up to 16KB embedded flash program memory with 1KB SRAM. These MCUs incorporate a high-speed on-chip oscillator with an accuracy from -2% to +1.2%, eliminating the need for an external crystal. Additional features include a 1-channel DMA, CRC-16 accelerator, and a variety of highperformance analog peripherals such as one 12-bit 1.5Msps ADC with VDD as the voltage reference, and an on-chip temperature sensor. These devices also offer intelligent digital peripherals such as one 16-bit advanced timer, two 16-bit general purpose timer, one windowed watchdog timer, and a variety of communication peripherals including one UART, one SPI, and one I2C. These communication peripherals offer protocol support for LIN, IrDA, DALI, Manchester, smart card, SMBus, and PMBus. The TI MSPM0 family of low-power MCUs consists of devices with varying degrees of analog and digital integration let customers find the MCU that meets their project needs. The architecture combined with extensive low-power modes is optimized to achieve extended battery life in portable measurement applications. MSPM0C110x MCUs are supported by an extensive hardware and software ecosystem with reference designs and code examples to get the design started quickly. Development kits include a LaunchPad™ kit available for purchase and design files for a target-socket board. TI also provides a free MSP Software Development Kit (SDK), which is available as a component of Code Composer Studio™ IDE desktop and cloud version within the TI Resource Explorer. MSPM0 MCUs are also supported by extensive online collateral, training with MSP Academy, and online support through the TI E2E™ support forums. Features • Core – Arm® 32-bit Cortex®-M0+ CPU, frequency up to 24MHz • Operating characteristics – Extended temperature: –40°C to 125°C – Wide supply voltage range: 1.62V to 3.6V • Memories – Up to 16KB of flash – 1KB of SRAM • High-performance analog peripherals – One analog-to-digital converter (ADC) with up to 10 total external channels, 1.7Msps at 10 bit or 1.5Msps at 12 bit with VDD as the voltage reference – Configurable 1.4V or 2.5V internal ADC voltage reference (VREF) – Integrated temperature sensor – Integrated supply monitor • Optimized low-power modes – RUN: 87µA/MHz – STOP: 609µA at 4MHz, 311µA at 32kHz – STANDBY: 5µA with SRAM retention – SHUTDOWN: 200nA • Intelligent digital peripherals – 1-channel DMA controller dedicated for ADC – Three timers supporting up to 14 PWM channels • One 16-bit advanced timers with deadband support up to 8 PWM channels • One 16-bit general purpose timer with 4 capture/compares • One 16-bit general purpose timer with 2 capture/compares – Windowed watchdog timer – BEEPER generating 1kHz, 2kHz, 4kHz, or 8kHz square wave to drive the external beeper • Enhanced communication interfaces – One UART interface supporting LIN, IrDA, DALI, smart card, Manchester and low-power operation in STANDBY mode – One I2C interface supporting FM+ (1Mbps), SMBus, PMBus, and wakeup from STOP mode – One SPI supporting up to 12Mbps • Clock system – Internal 24MHz oscillator with an accuracy from -2% to +1.2% (SYSOSC) – Internal 32kHz low-frequency oscillator (LFOSC) • Data integrity – Cyclic redundancy checker (CRC-16) • Flexible I/O features – Up to 18 GPIOs – Two 5V-tolerant open-drain IOs • Development support – 2-pin serial wire debug (SWD) • Package options – 20-pin TSSOP (PW) – 20-pin VSSOP (DGS) – 20-pin WQFN (RUK) – 16-pin SOT (DYY) – 8-pin SOT (DDF) – 8-pin WSON (DSG) – 8-pin DSBGA (YCJ) • Family members (also see Device Comparison) – MSPS003F4: 16KB of flash, 1KB of RAM – MSPS003F3: 8KB of flash, 1KB of RAM – MSPM0C1104: 16KB of flash, 1KB of RAM – MSPM0C1103: 8KB of flash, 1KB of RAM • Development kits and software (also see Tools and Software) – LP-MSPM0C1104 LaunchPad™ development kit – MSP Software Development Kit (SDK) 2 Applications • Battery charging and management • Power supplies and power delivery • Personal electronics • Building security and fire safety • Connected peripherals and printers • Grid infrastructure • Smart metering • Communication modules • Medical and healthcare • Lighting #MSPM0C1104S8YCJR #MSPM0C1104 #TexasInstruments #CortexM0Plus #Microcontroller #EmbeddedSystems #LowPowerMCU #IoT #WearableDevices #IndustrialControl #ConsumerElectronics #ADC #UART #SPI #I2C #PWM #TI #ElectronicsDesign #PCBDesign #EmbeddedDevelopment

Battery Multi-Function Controller IC Lithium Ion/Polymer 32-VFQFPN (5x5) L9961 is part of a complete battery pack monitoring, balancing, and protecting system for Li-Ion and Li-Polymer cells in 3, 4 or 5 series configurations. The L9961 uses a high precision ADC to provide cell voltage, stack voltage and temperature conversion via external NTC. Voltage monitoring functions are cyclically performed with a programmable loop time. Stack current is also monitored via a high accuracy CSA, continuously running and performing also Coulomb counting. Cell balancing is available and can be simultaneously activated on all cells. IC configuration and information exchange for SOC/SOH estimation are performed via I2C peripheral. The IC also integrates a dual pre-driver programmable in both HS/LS configurations for driving pack relays. L9961 also implements battery pack fuse protection to prevent fire and explosion hazards. A 3.3 V regulator with a high current capability is available for supplying pack controller and other external circuitry in both standby and normal operation modes. The IC protects the battery pack against over/under voltage conditions and monitors for over/ under temperature. It also features protection against overcurrent (both directions) and short-circuit in discharge events. Safety-relevant configurations can be stored in the internal NVM to avoid re-programming the device at each wake-up. Features • 2 μA shipment - DEEP SLEEP mode current and 5 μA standby consumption (with VREG LDO active) standby consumption (with VREG LDO active) • Integrated 3.3 V VREG LDO for supplying MCU and LEDs • Measures cell voltage (3 to 5 cells), with over/undervoltage detection and balance undervoltage protection • 12-bit voltage measurement with maximum error of ±15 mV in the [1.5 – 4.5] V range, for -40 °C < TJ < 105 °C • Measures stack voltage, with over/under voltage detection and plausibility check vs. sum of cells • Measures pack temperature via NTC, with over/undertemperature detection • Ratiometric temperature measurement with ±0.8% max. gain error in the [0.2 – VREG] V range, for -40 °C < TJ < 105 °C • Measures battery current, with Coulomb counting, overcurrent (both directions) and short-circuit in discharge protection. • 16-bit signed current measurement with 0.1% full scale error at room temperature • I 2C peripheral for device programming and data transfers over I2C bus • Cell balancing supporting up to 70 mA per cell • Dual configurable HS/LS predriver for pack relay management • Pack fuse management • Embedded NVM for configuration parameters storage • High hotplug robustness Applications • Cordless power tools • Backup energy storage systems and UPS • Light electric vehicles (e-bikes, scooters, etc.) • Portable and semi-portable equipment • Medical equipment #L9961TR #BatteryManagement #BMS #LiIonBattery #LiPoBattery #STMicroelectronics #BatteryProtection #CellBalancing #CoulombCounting #PowerManagement #EmbeddedSystems #EnergyStorage #EBike #PowerTools #ElectronicsDesign

Audio D/A Converter ICs 2VRMS DirectPath Aud io Stereo DAC 20-TSSOP The PCM5102AQPWRQ1 specification defines the engineering requirements for an automotive-grade digital-to-analog audio converter integrated circuit intended for high-performance digital audio applications. The specification establishes the functional, electrical, mechanical, thermal, and quality requirements necessary to ensure reliable conversion of digital audio signals into high-fidelity analog outputs. It serves as the governing technical reference for component selection, system integration, manufacturing, verification, and quality assurance throughout the product lifecycle. The device is designed to provide high-resolution audio performance with low distortion, low noise, and stable operation under automotive environmental conditions. It is suitable for use in infotainment systems, digital audio processing equipment, communication systems, and other embedded electronic applications requiring reliable digital-to-analog signal conversion. Engineering Requirements The component shall be manufactured using qualified semiconductor fabrication processes and approved materials to ensure consistent electrical performance, mechanical integrity, and long-term reliability. The device shall comply with applicable automotive qualification requirements and maintain stable operation within its specified voltage, temperature, and environmental operating ranges. Electrical performance shall meet the specified requirements for signal integrity, dynamic range, total harmonic distortion, noise performance, and output accuracy. The package shall be compatible with standard surface-mount assembly processes and shall withstand soldering and handling conditions without degradation. Workmanship shall be free from physical defects, contamination, package damage, or manufacturing irregularities that could affect functionality or reliability. Inspection, testing, and validation shall be performed using calibrated equipment and controlled procedures to verify compliance with all applicable engineering and quality requirements. Any deviation from this specification shall require formal engineering evaluation, documented technical justification, and approved change authorization prior to implementation. Documentation Supporting documentation shall include engineering drawings, electrical specifications, qualification reports, material declarations, inspection records, manufacturing documentation, and revision-controlled technical files. All documentation shall be maintained in accordance with established engineering configuration management and quality control procedures. Revision Control Changes to this specification shall be managed through the formal engineering change control process. All revisions shall undergo technical review, validation, and approval to ensure continued compliance with design intent, automotive quality standards, and applicable regulatory requirements. #EngineeringSpecification #AutomotiveElectronics #DigitalToAnalogConverter #AudioEngineering #EmbeddedSystems #QualityAssurance #Semiconductor #EngineeringDocumentation #Compliance #CommonPartsLibrary #IntegratedCircuit #Data-Acquisition #ADCs #DACs #PCM5102

ARM® Cortex®-M0+ STM32U0 Microcontroller IC 32-Bit 56MHz 256KB (256K x 8) FLASH 48-LQFP (7x7) # STM32U083CCT6 ## General Description The STM32U083CCT6 is an ultra-low-power microcontroller from STMicroelectronics based on the Arm Cortex-M0+ core. It is specifically designed for energy-efficient embedded applications requiring long battery life, advanced peripheral integration, secure operation, and reliable real-time performance. The device combines low-power processing, embedded Flash memory, SRAM, analog peripherals, communication interfaces, and hardware security features within a compact package. Its architecture makes it ideal for smart sensors, industrial monitoring systems, medical devices, wearable electronics, smart metering, home automation products, and Internet of Things applications where power efficiency is a primary design requirement. ## Key Features ### Processing Architecture * Arm Cortex-M0+ processor core * Optimized low-power computing architecture * Efficient real-time processing capability * Interrupt-driven operation support * Embedded system control functionality ### Memory Resources * Embedded Flash memory * Integrated SRAM * Non-volatile data storage support * High-reliability memory architecture * Efficient code execution capability ### Low-Power Features * Ultra-low-power operating modes * Multiple sleep and standby modes * Fast wake-up capability * Battery-powered application optimization * Energy-efficient peripheral operation * Extended product operating life in portable systems ### Security Features * Hardware security mechanisms * Memory protection functionality * Secure firmware execution support * Data integrity protection * Secure embedded application development support ### Communication Interfaces * USART communication interfaces * UART communication support * SPI serial communication interfaces * I²C communication interfaces * Low-power communication capability * Flexible external device connectivity ### Analog Features * Analog-to-digital conversion capability * Precision signal acquisition support * Integrated analog peripherals * Sensor interface compatibility * Low-power analog operation ### Timer and Control Functions * General-purpose timers * PWM signal generation * Real-time clock functionality * Event-driven control capability * Timing and scheduling support ### Package Characteristics * Surface-mount package * Compact footprint design * Automated assembly compatibility * Suitable for space-constrained applications * Industrial-grade packaging ### Material Construction * Advanced low-power semiconductor technology * RoHS-compliant materials * Lead-free package construction * High-reliability integrated circuit design ### Environmental Characteristics * Suitable for industrial and commercial environments * Long operational service life * Stable performance under continuous operation * Robust low-power architecture ### Application Areas * Internet of Things Devices * Smart Sensors * Wearable Electronics * Medical Monitoring Equipment * Home Automation Systems * Smart Metering Applications * Battery-Powered Products * Environmental Monitoring Systems * Industrial Data Acquisition Equipment * Consumer Electronics * Portable Embedded Systems * Wireless Sensor Nodes ### Compliance * RoHS Compliant * Lead-Free Compatible * Industrial-Grade Embedded Microcontroller Solution ## Manufacturer STMicroelectronics ## Product Family STM32U0 Ultra-Low-Power Microcontroller Series #STM32U083CCT6 #STM32U0 #STMicroelectronics #Microcontroller #UltraLowPowerMCU #CortexM0Plus #EmbeddedSystems #IoT #SmartSensors #WearableElectronics #BatteryPoweredDevices #IndustrialElectronics #EmbeddedDesign #FirmwareDevelopment #ElectronicsEngineering