17 Position FFC, FPC Connector Contacts, Bottom 0.020" (0.50mm) Surface Mount, Right Angle
The F300-1B7H1-11017-E100 is a board-to-board / mezzanine connector designed for high-density interconnections in compact electronic assemblies. It is typically used in applications requiring reliable signal transmission between stacked PCBs, offering precise alignment, robust mechanical retention, and consistent electrical performance. This type of connector is commonly found in industrial electronics, embedded systems, communication devices, and compact consumer electronics where space-saving and high pin-count connectivity are critical.
Key Features
High-density board-to-board connection
Compact form factor for space-constrained designs
Reliable contact system for stable signal integrity
Precision alignment for accurate mating
Durable construction for repeated mating cycles
Suitable for high-speed and low-power signal transmission
Electrical Characteristics
Rated Voltage: Typically 30–100 V (application dependent)
Current Rating: Typically 0.3–1.0 A per contact
Contact Resistance: Low (typically < 50 mΩ)
Insulation Resistance: High (≥ 100 MΩ)
Dielectric Withstanding Voltage: ~250–500 VAC
Mechanical Characteristics
Mounting Type: Surface Mount (SMT)
Mating Type: Board-to-board / mezzanine
Contact Configuration: High pin-count array
Pitch: Typically fine pitch (e.g., 0.3 mm – 0.8 mm range)
Mating Cycles: 30–100 cycles (typical)
Housing Material: High-temperature thermoplastic
Contact Material: Copper alloy with gold plating
Environmental Characteristics
Operating Temperature Range: -40°C to +85°C (typical)
RoHS Compliant: Yes
Moisture Sensitivity Level: Standard SMT classification
Applications
Embedded systems
Industrial control electronics
Communication devices
Portable and compact consumer electronics
PCB stacking architectures
Packaging
Supplied in tape and reel for automated SMT assembly
Notes
Exact electrical and mechanical values may vary depending on manufacturer specifications and variant configuration
Recommended to verify mating connector compatibility and stack height before design implementation
Follow manufacturer PCB footprint guidelines for optimal performance
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