Female Headers CONN SOCKET 40POS 2.54mm DUAL ROW TH This connector consists of 40 pins total (2 rows × 20 pins) spaced at 2.54 mm pitch. It is widely used in PCB interconnections, embedded systems, Raspberry Pi-style GPIO headers, Arduino expansion boards, and general prototyping applications. It mates with standard female headers or jumper wires. Key Features Pin configuration: 2×20 (40 pins total) Pitch: 2.54 mm (0.1 inch standard) Mounting type: Through-hole (THT) Orientation options: Vertical or right-angle variants Contact material: Typically brass or phosphor bronze Plating: Tin or gold-plated options for improved conductivity Current rating: Commonly 1A–3A per pin (depends on manufacturer) Voltage rating: Typically up to 250V AC/DC (application-dependent) Compatibility: Standard 2.54 mm female headers and jumper cables Use cases: Development boards, GPIO expansion, debugging interfaces, mezzanine connections #CommonPartsLibrary #Connector

WLR Board with USB integration. Ready for development SUBLAYOUT

Pin Header 2 2.54mm 6mm 16P -55℃~+105℃ 3mm 2.54mm 3A 2.54mm 2x8P Through Hole,P=2.54mm Headers, Male Pins RoHS The 2.54-2×8P pin header is a dual-row connector with 16 pins arranged in a 2×8 configuration and a standard 2.54 mm (0.1 inch) pitch. It is commonly used in PCB interconnections, development boards, modules, and general-purpose electronic circuits for signal routing and board-to-board or wire-to-board connections. Key Features Standard pitch: 2.54 mm (0.1 inch), widely compatible with breadboards and jumper wires Pin configuration: 2 rows × 8 pins (total 16 pins) Mounting type: Typically through-hole for strong mechanical stability Easy connectivity: Supports jumper wires, female sockets, and IDC connectors Versatile use: Common in development boards, microcontroller systems, and expansion interfaces Cost-effective: Simple and widely available connector solution Durable contact: Designed for repeated plugging and unplugging in prototyping environments #CommonPartsLibrary #Connector

The ESP32-CAM Ai-Thinker is a compact, low-cost Wi-Fi and Bluetooth-enabled camera development module based on the ESP32-S dual-core microcontroller. It integrates an OV2640 2MP camera sensor, onboard Flash memory, PSRAM, and a MicroSD card slot, making it suitable for IoT vision applications, wireless surveillance, image capture, video streaming, face recognition, and smart home projects. The module combines wireless connectivity and image processing capabilities in a small form factor while maintaining low power consumption. Key Features ESP32-S Dual-Core Processor Tensilica Xtensa LX6 dual-core 32-bit CPU Operating frequency up to 240 MHz Computing performance up to 600 DMIPS Integrated Camera Equipped with OV2640 CMOS image sensor Maximum image resolution: 1600 × 1200 (UXGA, 2MP) Supports JPEG image compression and video streaming Memory 4 MB Flash memory External PSRAM for frame buffering and image processing 520 KB internal SRAM Wireless Connectivity 2.4 GHz Wi-Fi (802.11 b/g/n) Bluetooth 4.2 BR/EDR and BLE support Storage Built-in MicroSD/TF card slot Supports local storage of images, videos, and data logs Peripheral Interfaces UART SPI I²C PWM ADC DAC GPIO expansion pins Power Supply Operating voltage: 5 V Low-power operation with deep-sleep capability for battery-powered applications Compact Design Module size approximately 27 mm × 40.5 mm PCB antenna onboard Optional external antenna connection on some variants

The TYPE-C-16M-0243MD is a USB Type-C receptacle connector designed for high-reliability power and data interface applications in compact electronic systems. This surface-mount connector supports reversible plug insertion and is commonly used in embedded hardware, portable electronics, communication devices, industrial systems, and USB-powered equipment requiring modern USB Type-C connectivity. The connector is engineered to provide durable mechanical retention, reliable electrical contact performance, and compact PCB integration for high-density electronic designs. It supports USB power delivery and high-speed signal routing depending on the system implementation. The device is optimized for automated SMT assembly and is widely used in charging interfaces, data communication ports, development boards, consumer electronics, and IoT hardware platforms. Its reinforced shell structure and multiple grounding points improve mechanical robustness and EMI performance, making it suitable for repeated mating cycles and long-term operational reliability. Engineering Specification Device Type USB Type-C receptacle connector Connector Standard USB Type-C interface Mounting Style Surface mount technology Contact Configuration Multi-pin reversible connector interface Orientation Reversible plug insertion support Mechanical Structure Reinforced shell with PCB retention support Electrical Characteristics Designed for USB power and data transmission applications Signal Support Compatible with high-speed differential signal routing Power Capability Supports USB power delivery and charging architectures Shielding Characteristics Integrated grounding and EMI reduction structure Durability Features High mating cycle reliability for repeated insertion applications Package Type SMT mid-mount or hybrid mounting connector structure Assembly Compatibility Optimized for automated PCB manufacturing processes Applications Portable electronics Embedded systems USB charging devices Communication hardware Industrial electronics IoT devices Development boards Consumer electronics Power delivery interfaces Data communication systems Manufacturer Commonly associated with generic and OEM USB connector manufacturers #commonpartslibrary #usbtypec #usbconnector #typecconnector #embeddedhardware #electronicsdesign #communicationinterfaces #surfaceountcomponents #consumerelectronics #iothardware #pcbdesign #powermanagement #datainterface #industrialelectronics #usbpowerdelivery

Tiny, Low-Cost, PCM Class D Amplifier with Class AB Performance The MAX98357AETE+T is a highly integrated digital input Class-D audio amplifier designed to convert digital audio streams directly into high-efficiency speaker output signals. It features an integrated digital-to-analog conversion stage and Class-D output driver, eliminating the need for an external DAC and significantly simplifying audio system design. The device accepts digital audio data through a standard I²S interface and delivers high-quality audio output suitable for portable electronics, smart speakers, embedded systems, Internet of Things devices, multimedia products, and consumer audio equipment. Its high-efficiency architecture minimizes power dissipation while maintaining excellent audio performance, making it particularly suitable for battery-powered applications. The MAX98357AETE+T incorporates advanced audio processing capabilities, low electromagnetic interference characteristics, and integrated protection features to ensure reliable operation in compact embedded audio designs. Features Digital input Class-D audio amplifier Integrated digital-to-analog conversion functionality Direct I²S audio interface support High-efficiency power amplification architecture Filterless output design Compact surface-mount package Low electromagnetic interference operation Integrated click-and-pop suppression Low power consumption High audio fidelity performance Simplified external component requirements Integrated thermal protection Short-circuit protection capability Suitable for mono speaker applications Optimized for embedded audio systems Electrical Characteristics Digital audio input architecture Class-D switching amplifier topology High-efficiency power conversion Low distortion audio reproduction Wide operating supply range Low standby power consumption Direct speaker drive capability Integrated audio signal processing functions Applications Smart speakers Embedded audio systems Internet of Things devices Portable electronics Voice-enabled products Multimedia equipment Consumer audio devices Wireless audio products Home automation systems Educational and development platforms Battery-powered audio applications Human-machine interface systems Package Information TQFN surface-mount package Compact footprint for space-constrained designs Suitable for automated PCB assembly Thermally optimized package construction High-density electronic product integration #commonpartslibrary #integratedcircuit #audio #audioamplifier #classd amplifier #digitalaudio #i2s #dac #embeddedaudio #consumerelectronics #iot #multimedia #signalprocessing #powermanagement #maximintegrated #analogdevices #electronicsdesign #audioelectronics #speakerdriver #embeddedsystems

IC RF TxRx + MCU Bluetooth, WiFi 802.11b/g/n, Bluetooth v5.0 2.412GHz ~ 2.484GHz 56-VFQFN Exposed Pad The ESP32-S3R8 is a high-performance wireless microcontroller system-on-chip manufactured by Espressif Systems. This device integrates dual-core processing, Wi-Fi connectivity, Bluetooth Low Energy communication, embedded memory resources, and advanced peripheral interfaces within a compact package optimized for embedded and IoT applications. The microcontroller is based on the Xtensa LX7 architecture and is designed to support edge computing, wireless communication, human-machine interfaces, audio processing, AI acceleration, and low-power connected systems. The ESP32-S3R8 includes integrated flash and RAM resources, advanced security functions, vector instruction acceleration, and extensive GPIO/peripheral capability for modern embedded development. The device is widely used in IoT devices, industrial automation systems, smart home equipment, wearable electronics, wireless sensor nodes, edge AI applications, USB-enabled embedded systems, and portable consumer electronics. Its integrated wireless functionality and high processing performance reduce external component count while simplifying system-level design for connected embedded platforms. Engineering Specification Device Type Wireless microcontroller system-on-chip Processor Architecture Dual-core Xtensa LX7 microcontroller architecture Wireless Connectivity Integrated Wi-Fi and Bluetooth Low Energy communication Processing Features High-performance embedded processing with vector instruction acceleration Memory Resources Integrated RAM and embedded memory architecture Communication Interfaces SPI I2C UART I2S USB PWM ADC GPIO interfaces Wireless Features Secure wireless networking and low-power communication support USB Capability Integrated USB communication and device functionality AI and DSP Features Vector instruction support for AI and digital signal processing workloads Security Features Hardware encryption and secure boot support Power Characteristics Low-power operating modes for battery-powered systems Package Type QFN surface-mount package Mounting Style Surface mount technology Applications IoT devices Wireless embedded systems Industrial automation Smart home electronics Edge AI applications Wearable devices Consumer electronics USB-enabled systems Sensor networks Embedded communication platforms Manufacturer Espressif Systems #commonpartslibrary #esp32 #esp32s3 #wirelessmcu #microcontroller #iot #embeddedhardware #wifi #bluetoothlowenergy #espressif #surfaceountcomponents #electronicsdesign #edgeai #wirelesscommunication #consumerelectronics

CONN HEADER TH R/A 6POS 2.5mm The M2557R-2x3-N0 is a 2×3 position (6-pin) right-angle wire-to-board header connector from XFCN. It is part of the 2.50 mm pitch M2557 series, commonly used for power and signal connections in consumer electronics, industrial control boards, power supplies, battery systems, and embedded devices. The connector is designed for through-hole PCB mounting and mates with the corresponding P2557 series housing and crimp terminals. Key Features Connector Type: Wire-to-board male header Positions: 6 pins (2 rows × 3 pins) Pitch: 2.50 mm Mounting Style: Through-hole, right-angle Current Rating: 3 A per contact Voltage Rating: 250 V AC/DC Operating Temperature: −25°C to +85°C Contact Material: Brass or phosphor bronze contacts Housing Material: Nylon 66, UL94V-0 flame-retardant Contact Resistance: 30 mΩ max Insulation Resistance: 1000 MΩ minimum Withstanding Voltage: 800 V AC for 1 minute RoHS Compliant Typical Applications Power distribution connections Battery-powered equipment Home appliances Industrial control systems Development boards and embedded electronics General-purpose signal and power interconnects Mechanical Description Configuration: 2 rows × 3 positions PCB Orientation: Right-angle (90°) Mating Housing: P2557 series receptacle housing Pitch Between Pins: 2.50 mm #CommonPartsLibrary #Connector

The ESP32-C3FH4 is a highly integrated wireless microcontroller designed for Internet of Things, smart devices, industrial automation, consumer electronics, and embedded connectivity applications. It combines a low-power RISC-V processor with integrated Wi-Fi and Bluetooth Low Energy connectivity, providing a cost-effective and secure platform for wireless communication and edge computing. The device incorporates embedded flash memory, advanced security features, low-power operating modes, and a rich set of peripheral interfaces, making it suitable for battery-powered and always-connected systems. Its compact design and comprehensive software ecosystem enable rapid development of connected products while maintaining high reliability and energy efficiency. The ESP32-C3FH4 is widely used in smart sensors, home automation devices, wearable electronics, industrial monitoring systems, wireless control modules, and cloud-connected embedded products. Features Integrated RISC-V microcontroller core Built-in Wi-Fi connectivity Integrated Bluetooth Low Energy support Embedded flash memory Low-power operation for battery-powered applications Hardware cryptographic acceleration Secure boot capability Flash encryption support Multiple GPIO interfaces Integrated UART, SPI, I²C, I²S, PWM, and ADC peripherals Real-time processing capability Wireless networking and cloud connectivity support OTA firmware update support Compact surface-mount package Industrial-grade reliability Electrical Characteristics Wireless microcontroller architecture Integrated RF subsystem Low-power operating modes High-performance embedded processing Secure communication support Multi-protocol wireless connectivity Flexible peripheral expansion capability Optimized power consumption for IoT devices Applications Internet of Things devices Smart home automation Wireless sensor networks Industrial monitoring systems Asset tracking devices Wearable electronics Smart appliances Remote control systems Data acquisition platforms Edge computing applications Connected consumer products Embedded wireless gateways Package Information Surface-mount package Compact footprint for embedded applications Suitable for automated assembly processes Optimized thermal and electrical performance PCB-friendly package design #commonpartslibrary #integratedcircuit #microcontroller #wirelessconnectivity #wifi #bluetoothlowenergy #iot #embeddedsystems #espressif #smartdevices #industrialautomation #edgecomputing #wirelessmodule #internetofthings #electronicsdesign #riscv #embeddedelectronics #lowpowerdesign

IC RF TxRx + MCU Bluetooth Bluetooth v5.0 2.4GHz 32-VFQFN Exposed Pad nRF52810-QCAA-R is a multiprotocol ultra-low-power wireless System-on-Chip from Nordic Semiconductor designed for Bluetooth Low Energy and proprietary wireless communication applications. The device integrates a high-performance ARM Cortex-M processor, radio transceiver, memory resources, and peripheral interfaces into a compact package optimized for low-power embedded systems and IoT devices. This SoC supports reliable wireless connectivity with low energy consumption, making it suitable for wearable electronics, wireless sensors, smart home devices, industrial monitoring systems, and battery-powered portable applications. The integrated radio architecture provides stable RF performance with support for advanced wireless features, secure communication, and efficient coexistence in crowded RF environments. The nRF52810-QCAA-R includes multiple GPIOs, serial communication peripherals, timers, PWM functionality, analog interfaces, and low-power operating modes that simplify embedded hardware design and firmware development. Its compact package and optimized power profile make it ideal for space-constrained and energy-sensitive wireless applications. #commonpartslibrary #nordicsemiconductor #bluetoothlowenergy #wirelesssoc #iotdevices #embeddedhardware #rfdesign #lowpowerdesign #wearableelectronics #wirelesscommunication

CONN HEADER 8POS 2.54mm DUAL ROW SMD The 2.54-2×4P is a generic 8-pin dual-row connector/header with a 2.54 mm (0.1 inch) pitch, commonly used for board-to-board, wire-to-board, and programming/debug interfaces in electronic circuits. The designation 2×4P indicates two rows of four pins, providing a total of eight electrical connections in a compact arrangement. This type of connector is widely used in embedded systems, development boards, industrial control equipment, consumer electronics, and prototyping applications due to its standard pitch and broad compatibility with jumper wires, IDC cables, and mating sockets. Key Features 2.54 mm standard pitch (0.1 inch industry standard) 2×4 pin configuration (8 total contacts) Available in through-hole (THT) and sometimes surface-mount (SMT) versions Supports board-to-board and wire-to-board connections Compatible with standard jumper wires and ribbon cable connectors Compact dual-row design for higher pin density Typically constructed with gold-plated or tin-plated contacts for reliable electrical performance Suitable for signal, control, and low-power applications Commonly used for programming, debugging, communication interfaces, and expansion headers Available in straight (vertical) or right-angle orientations depending on manufacturer Typical Applications Microcontroller and development boards ISP/JTAG/SWD programming headers Sensor and peripheral connections Industrial control systems Prototyping and breadboard-compatible designs Communication interfaces and expansion ports #CommonPartsLibrary #Connector

USBPD and Multiple Fast Charging Protocol Receiving Chip CH224 CH224K is a USB Power Delivery protocol controller integrated circuit designed for fast-charging and programmable USB Type-C power negotiation applications. The device enables intelligent voltage trigger and power profile selection from compatible USB Type-C and USB PD power sources, making it suitable for embedded power systems, portable electronics, development boards, and battery-powered devices. This controller supports automatic communication with USB Type-C power adapters to negotiate higher voltage and current profiles for efficient power delivery. It simplifies USB PD implementation by integrating protocol handling, voltage selection logic, and interface control into a compact low-power solution with minimal external component requirements. The CH224K is widely used in DIY electronics, portable charging systems, embedded controllers, IoT hardware, industrial devices, and USB Type-C powered applications requiring stable and configurable DC power input. Its compact surface-mount package and simplified design architecture enable rapid integration into space-constrained PCB layouts. #commonpartslibrary #usbtypec #usbpd #powerdelivery #powermanagement #embeddedhardware #fastcharging #electronicscomponents #portableelectronics #surfacemountdevice

ST Microelectronics STM32L432KCU6 UFQFPN-32_L5.0-W5.0-P0.50-TL-EP3.5 LCSC Part Number: C1337280 JLCPCB Part Class: Extended Part Manufactured by ST(意法半导体) STMicroelectronics STM32L432KC ultra-low-power 32-bit ARM Cortex-M4 microcontroller with FPU running up to 80MHz, featuring 256KB Flash memory, 64KB SRAM, USB 2.0 Full-Speed device support, Quad-SPI interface, RTC with calendar and alarms, true random number generator (TRNG), DMA controller, CAN 2.0B, UART, LPUART, SPI, I2C, SAI audio interface, 12-bit 5MSPS ADC, dual 12-bit DACs, operational amplifier with PGA, comparators, capacitive sensing channels, advanced timers and ultra-low-power modes. Operates from 1.71V to 3.6V and is optimized for battery-powered, industrial, medical, IoT and portable embedded applications. Search Keywords: STM32L432KC, STM32L432KCU6, STM32L432KCU6TR, STM32L432, STM32L4 series, STM32 Cortex-M4 MCU, STM32 low power microcontroller, STM32 256KB Flash 64KB SRAM, STM32 USB FS MCU, STM32 CAN MCU, STM32 Quad SPI MCU, STM32L432 datasheet, STM32L432 development board, Nucleo-L432KC, ARM Cortex-M4 FPU Hashtags: #STM32L432KC #STM32L432KCU6 #STM32L432 #STM32L4 #STMicroelectronics #CortexM4 #ARMMicrocontroller #LowPowerMCU #EmbeddedSystems #USBFS #CANBus #QuadSPI #ADC12bit #DAC12bit #RTC #TRNG #IoTMCU #IndustrialMCU #MedicalElectronics #NucleoL432KC

Bluetooth, WiFi 802.11b/g/n, Bluetooth v5.0 Transceiver Module 2.402GHz ~ 2.48GHz Antenna Not Included Surface Mount The ESP32-C3 is a low-power, highly integrated 32-bit microcontroller (MCU) from Espressif Systems that combines 2.4 GHz Wi-Fi and Bluetooth® 5 Low Energy (BLE) connectivity in a single chip. Built around a single-core RISC-V processor running at up to 160 MHz, it is designed for secure, cost-effective IoT and embedded applications. The ESP32-C3 offers excellent wireless performance, low power consumption, robust security features, and a rich set of peripherals, making it ideal for smart home devices, industrial automation, wearable electronics, wireless sensors, and consumer IoT products. Key Features 32-bit RISC-V single-core CPU running up to 160 MHz Integrated 2.4 GHz Wi-Fi (802.11 b/g/n) and Bluetooth® 5 LE Low-power architecture with multiple sleep modes for battery-powered devices Advanced security features including Secure Boot, Flash Encryption, AES, SHA, RSA, HMAC, and hardware random number generator (RNG) Rich peripheral set including GPIO, UART, SPI, I²C, I²S, PWM, ADC, TWAI (CAN), USB Serial/JTAG, and timers Supports external QSPI flash memory and OTA (Over-the-Air) firmware updates Compact package options suitable for space-constrained embedded designs Fully supported by the ESP-IDF, Arduino, and MicroPython development ecosystems #ESP32C3 #Espressif #RISCV #WiFi #BluetoothLE #IoT #EmbeddedSystems #Microcontroller #WirelessMCU #LowPower #SmartHome #IndustrialIoT #SecureMCU #EdgeComputing #FirmwareDevelopment

ARM® Cortex®-A7 Microprocessor IC STM32MP1 2 Core, 32-Bit 209MHz, 650MHz 361-TFBGA (12x12) # Engineering Specification ## Product Name STM32MP157CAC3 ## General Description STM32MP157CAC3 is a high-performance microprocessor unit that combines application processing and real-time control capabilities within a single integrated circuit. The device is designed to support advanced embedded systems requiring a balance of computing performance, deterministic control, multimedia processing, connectivity, and security functionality. The component integrates multi-core processing resources, memory interfaces, graphics capabilities, peripheral controllers, and communication subsystems to enable the development of sophisticated embedded platforms. Its heterogeneous architecture allows high-level operating systems and real-time firmware to operate simultaneously, supporting applications that require both user-interface functionality and low-latency control. The device is intended for industrial automation, human-machine interface systems, edge computing platforms, communication equipment, medical devices, smart infrastructure, and Internet of Things applications. Its architecture enables consolidation of system functions, reducing component count and simplifying overall hardware design. The design emphasizes processing efficiency, system scalability, power management, security, and long-term reliability. It supports advanced software ecosystems and facilitates the development of connected embedded products with graphical interfaces, networking capabilities, and real-time operational control. ## Functional Requirements ### Application Processing The device shall provide application-level processing capabilities suitable for operating systems, middleware, and user applications. ### Real-Time Processing The device shall support deterministic control functions for time-critical embedded operations. ### Multimedia Support The component shall support graphical and multimedia processing functions for display and user-interface applications. ### System Integration The device shall integrate processing, communication, and peripheral functions within a unified embedded computing platform. ## Electrical Requirements ### Power Management The device shall support efficient power operation and multiple power management modes to optimize energy consumption. ### Memory Interface Support The component shall support external memory devices for program execution, data storage, and system operation. ### Peripheral Connectivity The device shall provide interfaces for communication, control, monitoring, and external subsystem integration. ### Signal Integrity The design shall support reliable operation across supported interface standards and operating conditions. ## Processing Architecture Requirements ### Multi-Core Operation The device shall support concurrent execution of application and real-time workloads through integrated processing resources. ### Operating System Support The architecture shall support embedded operating systems and software frameworks suitable for advanced application development. ### Security Features The device shall support hardware-based mechanisms intended to protect system integrity, software assets, and sensitive data. ### Resource Management The component shall support efficient allocation of processing, memory, and peripheral resources. ## Mechanical Requirements ### Surface Mount Construction The device shall be supplied in a high-density surface mount package suitable for automated manufacturing processes. ### PCB Integration The package shall support integration into multilayer printed circuit boards designed for high-performance embedded systems. ### Structural Integrity The device shall maintain electrical and mechanical reliability during assembly and operational service life. ## Environmental Requirements ### Operating Conditions The component shall operate reliably within environmental conditions commonly encountered in industrial and embedded applications. ### Thermal Performance The device shall support stable operation under sustained processing workloads and associated thermal conditions. ### Storage and Handling The component shall maintain physical and electrical integrity during transportation, storage, and manufacturing processes. ## Quality Requirements ### Reliability The device shall provide dependable long-term operation in embedded and industrial computing environments. ### Verification Processing, peripheral, communication, and system functions shall be validated through applicable testing and qualification procedures. ### Compliance The product shall conform to relevant semiconductor, quality, and embedded computing standards applicable to its intended use. ## Documentation Requirements Technical documentation shall include processor architecture information, hardware integration guidelines, memory interface recommendations, power management considerations, software development support, security features, and application design guidance. ## Classification Tags #STM32MP157CAC3 #STM32MP1 #Microprocessor #MPU #EmbeddedProcessor #ARMProcessor #EmbeddedLinux #RealTimeControl #IndustrialAutomation #HumanMachineInterface #EdgeComputing #IoTGateway #EmbeddedSystems #SystemOnChip #SoC #ApplicationProcessor #GraphicsProcessor #ConnectivityPlatform #IndustrialElectronics #PCBDesign #HardwareDevelopment #ElectricalEngineering #CommonPartsLibrary #ComponentLibrary #EngineeringSpecification #TechnicalDocumentation #SystemIntegration #SecureEmbeddedSystems #MulticoreProcessing