PIC PIC® 24F Microcontroller IC 16-Bit 32MHz 64KB (22K x 24) FLASH 28-SOIC #CommonPartsLibrary #IntegratedCircuit #Embedded #Microcontroller #PIC24FJ64GA002

Touchscreen Controller 2 Wire Capacitive I2C Interface 20-VQFN (3x3) The MTCH2120-V/REB specification defines the engineering requirements for a capacitive touch sensing controller integrated circuit designed for human-machine interface applications in embedded electronic systems. This specification establishes the functional, electrical, mechanical, environmental, and quality requirements necessary to ensure accurate touch detection, stable system performance, and reliable operation across consumer, industrial, and embedded environments. The device is intended for use in applications requiring touch-based user input such as control panels, interface buttons, and capacitive sensing surfaces. It provides robust sensing performance with immunity to noise and environmental variation, enabling reliable detection of touch events in compact and low-power electronic designs. Engineering Requirements The integrated circuit shall be manufactured using qualified semiconductor fabrication processes to ensure consistent sensing performance, low power consumption, and long-term operational stability. The device shall support reliable capacitive touch detection under defined electrical and environmental conditions without degradation of sensitivity or accuracy. The sensing architecture shall provide stable touch event detection with immunity to electrical noise, environmental interference, and parasitic capacitance variations. The system shall maintain consistent performance across intended operating conditions including temperature variation and supply voltage fluctuation. Electrical characteristics shall ensure stable digital communication, accurate sensing response, and reliable operation during startup, normal operation, and power transitions. The device shall maintain functional integrity during dynamic system conditions without false triggering or loss of sensitivity. Mechanical and package construction shall be suitable for surface-mount assembly and shall ensure robustness during soldering, handling, and long-term operation. Workmanship shall be free from defects such as contamination, cracks, bonding issues, or structural inconsistencies that could impact electrical or mechanical reliability. Inspection, validation, and testing shall be performed using controlled procedures and calibrated equipment to ensure compliance with all applicable engineering and quality requirements. Any deviation from this specification shall require formal engineering review, documented justification, and approval through established change control processes. Documentation Supporting documentation shall include official datasheets, reference design materials, electrical characterization reports, qualification data, inspection records, and revision-controlled manufacturing documentation. All documentation shall be maintained under formal configuration management and quality assurance systems to ensure traceability and consistency. Revision Control All modifications to this specification shall be managed through formal engineering change control procedures. Each revision shall undergo technical evaluation, validation, and approval prior to implementation to ensure continued compliance with design intent and applicable standards. #EngineeringSpecification #CapacitiveTouch #HMI #MicrochipTechnology #EmbeddedSystems #UserInterface #SensorIC #LowPowerDesign #ElectronicsDesign #QualityAssurance #EngineeringDocumentation

PIC PIC® 16F Microcontroller IC 8-Bit 20MHz 14KB (8K x 14) FLASH 28-SPDIP #CommonPartsLibrary #IntegratedCircuit #Embedded #Microcontroller #PIC16F876

PIC PIC® XLP™ 16F Microcontroller IC 8-Bit 32MHz 3.5KB (2K x 14) FLASH 8-DFN (3x3) #CommonPartsLibrary #IntegratedCircuit #Embedded #Microcontroller #PIC16LF15313

11 Position Connector Header, Center Strip Contacts Surface Mount Gold or Gold, GXT™ The 91911-31311LF is a 1.00 mm pitch board-to-board mezzanine connector from the Conan™ / MezzSelect™ series by Amphenol ICC. It is designed for compact, high-density PCB stacking applications commonly used in industrial, embedded, networking, and portable electronic systems. Key Features 11-position vertical header 1.00 mm pitch compact board-to-board connector Surface-mount (SMT) mounting 5 mm mated stacking height Gold/GXT™ contact plating for reliable signal integrity and durability Board guide and solder retention features for easier assembly and improved mechanical stability Supports high-density PCB layouts Designed for industrial and embedded applications RoHS and REACH compliant Housing material: LCP (Liquid Crystal Polymer) Rated up to 1 A current and 500 V voltage Typical Applications Embedded computing modules Industrial control systems Networking equipment Portable electronics Compact PCB stacking designs

ARM® Cortex®-M4 STM32F4 Microcontroller IC 32-Bit Single-Core 168MHz 1MB (1M x 8) FLASH 176-LQFP (24x24) #CommonPartsLibrary #IntegratedCircuit #Embedded #Microcontroller #STM32F407

8 Position Connector Receptacle, Center Strip Contacts Surface Mount Gold The TE Connectivity part 2386586-1 is a fine-pitch board-to-board (BTB) PCB receptacle connector designed for compact, high-density electronic devices. It is a vertical surface-mount connector with 8 positions and a 0.4 mm pitch, commonly used in portable electronics, embedded systems, and space-constrained PCB designs. Key Features Connector Type: PCB mount receptacle Connector System: Board-to-board (BTB) Positions: 8-pin Pitch: 0.4 mm fine pitch Rows: 2 Mounting Style: Surface mount (SMT) Orientation: Vertical Stack Height: 0.8 mm low-profile design Contact Plating: Gold (Au) Contact Material: Copper alloy Rated Current: 0.5 A max per contact Operating Voltage: 60 VDC Temperature Range: −40 °C to +85 °C Housing Material: High-temperature thermoplastic Application: Signal transmission in compact electronics Packaging: Tape & Reel for automated assembly This connector is optimized for: Compact embedded systems Wearables and handheld devices High-density PCB stacking Consumer electronics Low-profile modular designs

6-Position Vertical Through-Hole Male Pin Header – Single-row unshrouded PCB header designed for board-to-board interconnects, wire-to-board connections, industrial controls, embedded systems, instrumentation, development boards, and general-purpose electronic applications. The Samtec TSW-106-07-G-S is part of the TSW Series, featuring 6 male pins on a 2.54 mm (0.100") pitch with a vertical through-hole mounting configuration. It utilizes square phosphor bronze contacts with 10 µin (0.25 µm) gold plating on the mating area and 3 µin (0.076 µm) gold plating on the posts, providing excellent conductivity, corrosion resistance, and long-term reliability. The connector features a 5.84 mm mating pin length, 2.54 mm post length, 10.92 mm overall contact length, push-pull mating, and a UL94 V-0 rated black PBT insulator. It operates over a −55°C to +125°C temperature range, making it ideal for reliable embedded, industrial, and prototyping applications. #Samtec #TSW10607GS #TSWSeries #MaleHeader #PinHeader #ThroughHoleConnector #BoardToBoard #254mmPitch #IndustrialElectronics #EmbeddedSystems #PCBConnector

PIC PIC® 16F Microcontroller IC 8-Bit 20MHz 7KB (4K x 14) FLASH 28-SSOP #CommonPartsLibrary #IntegratedCircuit #Embedded #Microcontroller #PIC16F873

STM32F756ZG, mbed-Enabled Development Nucleo-144 STM32F7 ARM® Cortex®-M7 MCU 32-Bit Embedded Evaluation Board #nucleo #stm32 #stm32f7 #arduino

PIC PIC® 16F Microcontroller IC 8-Bit 20MHz 7KB (4K x 14) FLASH 18-PDIP #CommonPartsLibrary #IntegratedCircuit #Embedded #Microcontroller #PIC16F88

Cyclone® IV E Field Programmable Gate Array (FPGA) IC 91 276480 6272 144-LQFP Exposed Pad #CommonPartsLibrary #IntegratedCircuit #Embedded #FPGAs