Raspberry Pi Pico outline (RP2040 based) #RaspberryPi #Raspberry #Pi #RPi #Pico #template #project #project-template #template #project

#template #blackswift #generic-part-template #componentTemplate

#template #blackswift #generic-part-template #componentTemplate

#template #blackswift #generic-part-template #componentTemplate

#template #blackswift #generic-part-template #componentTemplate

#template #blackswift #generic-part-template #componentTemplate

Ceramic Capacitor 0603 (1608 Metric) Template NO default properties #simplifiedFootprint #noProp #CommonPartsLibrary #SMD

Chip Resistor 0805(2012 Metric) Template NO default properties #simplifiedFootprint #noProp #CommonPartsLibrary #Resistor

A power management circuit featuring the MP2162 from Monolithic Power Systems, incorporating inductors, capacitors, and resistors for regulation. #project #referenceDesign #powermanagement #template #reference-design #MP2162 #monolithicpower

STM32H7 LBEE5KL1DX-883 Transceiver; 802.11 b/g/n (Wi-Fi, WiFi, WLAN), Bluetooth® 5 2.4GHz Evaluation Board WITHOUT 3D model #Arduino #GIGA #STM32H7 #STM32H747XI #template #project #project-template #Shield

Simulator template for an LED part. Check out the Code editor for instructions!

Raspberry Pi Pico outline (RP2040 based) #RaspberryPi #Raspberry #Pi #RPi #Pico #template #project #project-template #template #project

LED Indication - Discrete 0402(1005 Metric) #led #0402 #template

SOT-223-4 is a small surface-mount package for electronic components. It has a body size of approximately 6.5 mm x 3.5 mm x 1.65 mm (L x W x H) with 4 leads and a lead pitch of 4.6 mm. The package features an increased heatsink to improve thermal performance. SOT-223, SOT223, SC-73. #part #template

Chip Resistor 0805(2012 Metric) Template #simplifiedFootprint

QFN-32-1EP is a quad flat no-lead package with a 32-pin count and an exposed pad (EP). It has a body size of 5 mm x 5 mm and a lead pitch of 0.5 mm. The EP size is 3.1 mm x 3.1 mm. The EP is located at the center of the bottom side of the package. This package is commonly used for a variety of ICs, such as amplifiers, regulators, and microcontrollers. 32-QFN #part #template

TO-92-3 is a small through-hole package for electronic components. It has a body size of approximately 5.2 mm x 4.8 mm x 4.8 mm (L x W x H) with 3 leads and a lead pitch of 2.54 mm. The leads are bent outward and have a spacing of approximately 3.7 mm. TO-226AA, TO-92. #part #template

SOIC-16 (Small Outline Integrated Circuit 16) is a surface-mount integrated circuit (IC) package with 16 pins arranged in two rows, with a rectangular body size of 3.9 mm x 9.9 mm and a standard 1.27 mm lead pitch. It is commonly used for a variety of low to medium power applications, including microcontrollers, amplifiers, and voltage regulators. 16-SOIC #part #template

LQFP-48 is a Low-Profile Quad Flat Package (LQFP) with 48 leads arranged in a 7x7mm body size and a lead pitch of 0.5mm. This package is commonly used for integrated circuits and microcontrollers that require a higher pin count. 48-LQFP #part #template

This is a WiFi relay board based on ESP32-H2 WiFi module. It have AC-DC power supply with output 12V and relay for controlling voltage #esp32 #project #Relay #wifi #esp32-h2 #iot #template

SOIC-20W is a 20-pin Small Outline Integrated Circuit (SOIC) package with a wide body size of approximately 7.5mm x 12.8mm and a standard lead pitch of 1.27mm. It has a lead count and pin configuration similar to a DIP-20 package, but with a smaller body size. The "W" in the package name refers to the wide body size. This package is commonly used for ICs such as microcontrollers and audio amplifiers. #part #template

QFN-24-1EP is a Quad Flat No-Lead (QFN) package with 24 leads arranged in a 4x4mm body size and a lead pitch of 0.5mm. This package has an exposed pad (EP) on the bottom with a size of 2.6x2.6mm that provides thermal and electrical conductivity. This package is commonly used for integrated circuits and microcontrollers that require a small form factor and a low profile. 24-QFN #part #template

LQFP-32 is a surface-mount package for integrated circuits (ICs) with 32 leads arranged in a 7x7 mm square grid. The lead pitch is 0.8 mm, and the body size is approximately 7.0 mm x 7.0 mm x 1.4 mm (L x W x H). LQFP-32 is commonly used for microcontrollers, digital signal processors, and other complex ICs that require a high pin count. It provides a low-profile solution that is well-suited for space-constrained applications. 32-LQFP #part #template

DIP-14 is a 14-pin Dual Inline Package (DIP) with a standard lead spacing of 7.62mm between each pin. #part #template

Use this template if you're planning to get your multi layer board manufactured in JLCPCB. It has the via min/max and trace width constraints already baked as global rules. #project-template #template #manufacturer-design-rules