8 Position Connector Receptacle, Center Strip Contacts Surface Mount Gold The TE Connectivity part 2386586-1 is a fine-pitch board-to-board (BTB) PCB receptacle connector designed for compact, high-density electronic devices. It is a vertical surface-mount connector with 8 positions and a 0.4 mm pitch, commonly used in portable electronics, embedded systems, and space-constrained PCB designs. Key Features Connector Type: PCB mount receptacle Connector System: Board-to-board (BTB) Positions: 8-pin Pitch: 0.4 mm fine pitch Rows: 2 Mounting Style: Surface mount (SMT) Orientation: Vertical Stack Height: 0.8 mm low-profile design Contact Plating: Gold (Au) Contact Material: Copper alloy Rated Current: 0.5 A max per contact Operating Voltage: 60 VDC Temperature Range: −40 °C to +85 °C Housing Material: High-temperature thermoplastic Application: Signal transmission in compact electronics Packaging: Tape & Reel for automated assembly This connector is optimized for: Compact embedded systems Wearables and handheld devices High-density PCB stacking Consumer electronics Low-profile modular designs

Logarithmic Amplifier IC Receiver Signal Strength Indication (RSSI) 8-SOIC #CommonPartsLibrary #IntegratedCircuit #Linear #Amplifier #Special-Purpose-Amplifier #AD8307

High-Performance, 16-bit Digital Signal Controller, 40MIPS, 256k Flash, 30k SRAM, TQFP-100 (12x12) #CommonPartsLibrary #Microcontrollers #dsPIC33 #DSPIC33EP256MU810

Bluetooth, WiFi 802.11b/g/n/ax, Bluetooth v5.4 Transceiver Module 2.4GHz Integrated, Chip Surface Mount Silicon Labs SiWG917 module is our lowest power Wi-Fi 6 plus Bluetooth LE 5.4, ideal for ultra-low power IoT wireless devices using Wi-Fi®, Bluetooth, Matter, and IP networking for secure cloud connectivity. It is optimal for developing battery operated devices that need long battery life. SiWG917 module includes an ultra-low power Wi-Fi 6 plus Bluetooth Low Energy (LE) 5.4 wireless CPU subsystem, and an integrated micro-controller (MCU) application subsystem, security, peripherals and power management subsystem all in a single 16 x 21.1 x 2.3 mm package. The wireless subsystem consists of a multi-threaded Network Wireless Processor (NWP) running up to 160 MHz, baseband digital signal processing, analog front end, 2.4 GHz RF transceiver and integrated power amplifier. The application subsystem consists of an ARM® Cortex®-M4 running up to 180 MHz, embedded SRAM, flash, ultra-low power sensor hub, and matrix vector processor. The ARM® Cortex®-M4 is dedicated for peripheral and application-related processing, while the NWP runs the wireless and networking stacks on independent threads, thus providing a fully integrated solution that is ready for a wide range of embedded wireless IoT applications. The modules come with modular radio type approvals for various countries, including USA (FCC), Canada (IC/ISED) and Japan (MIC), and are in compliance with the relevant EN standards (including EN 300 328 v2.2.2) for the conformity with the directives and regulations in EU and UK. KEY FEATURES • Wi-Fi 6 Single Band 2.4 GHz 20 MHz 1x1 stream IEEE 802.11 b/g/n/ax • Bluetooth LE 5.4 • Single chip Matter Over Wi-Fi Solution • ARM® Cortex® M4 Processor with FPU subsystem up to 180 MHz with rich set of Digital and Analog Peripherals. • Wi-Fi 6 Benefits: TWT for improved efficiency and longer battery life, MUMIMO/OFDMA for Higher Throughput, network capacity and low latency • Best in Class Device and Wireless Security • WLAN Tx power up to +17.5 dBm with integrated PA • Bluetooth LE Tx power up to +17 dBm with integrated PA • WLAN Rx sensitivity as low as -95.5 dBm • Wi-Fi 4 Standby Associated mode current: 71 μA @ 1-second listen interval • Embedded Flash option up to 8 MB/ optional external Flash up to 16 MB • Embedded PSRAM option up to 2 MB/ optional external PSRAM option up to 16 MB • Ultra-low power sensor hub peripherals • Matrix Vector Processor (MVP) • Embedded Wi-Fi, Bluetooth LE, Matter, and networking stacks supporting wireless coexistence • Three software-configurable MCU application memory options for sharing the RAM between the wireless, system, and application (192/256/320 KB) • Operating temperature: -40 to +85 ºC • Operating supply range: 3.0 to 3.63 V • Supply voltage for GPIOs: 1.71 to 3.63 V #WiFi6 #BluetoothLE54 #IoTModule #WirelessSoC #SiliconLabs #EmbeddedSystems #SmartHome #IndustrialIoT #LowPowerDesign #RFModule #ConnectedDevices #EdgeComputing #MatterReady #PCBDesign #ElectronicsEngineering

1.8k Ohms 1 Signal Line Ferrite Bead 0402 (1005 Metric) 100mA 1.4Ohm #commonpartslibrary #filter #ferritebead #BLM15BD

Accelerometer X, Y, Z Axis ±400g 160Hz ~ 2.56kHz 16-LGA (3x3.25) The ADXL373BCCZ-RL7 is an ultralow power, high-g digital MEMS accelerometer developed by Analog Devices for motion sensing and impact detection applications. The device is optimized for battery-powered and always-on systems requiring continuous acceleration monitoring with minimal power consumption. It supports selectable measurement ranges suitable for shock, vibration, and activity monitoring in industrial, wearable, medical, asset tracking, and IoT applications. The accelerometer integrates embedded motion detection features, a FIFO buffer, and interrupt capabilities to reduce host processor workload and overall system power consumption. Engineering Specification Device Type Ultralow power 3-axis digital MEMS accelerometer Manufacturer Analog Devices Inc. Manufacturer Part Number ADXL373BCCZ-RL7 Measurement Axes Three-axis acceleration sensing Acceleration Range Selectable full-scale ranges supporting high-g measurements up to ±400 g Output Interface SPI digital serial communication interface Resolution High-resolution digital acceleration output with integrated filtering and signal conditioning Power Supply Requirement Operates from a low-voltage DC supply suitable for portable and embedded systems Power Consumption Designed for extremely low current operation during measurement and wake-up monitoring modes Embedded Features Integrated activity detection Motion and impact sensing FIFO data buffering Interrupt generation Wake-up detection functionality Sampling and Performance Programmable output data rates and filtering options for optimized noise and bandwidth performance Operating Temperature Range Industrial temperature range suitable for harsh environmental applications Package Type LGA surface-mount package Mounting Style Surface mount technology Application Areas Impact event recording Condition monitoring Asset tracking Industrial sensing Wearable electronics Portable instrumentation Shock and vibration monitoring Always-on motion detection systems #commonpartslibrary #integratedcircuit #accelerometer #sensor

Audio Transformers / Signal Transformers POE70P Flyback 7uH 5.0 V 1.4 A SMD,12.7x10.5mm Pulse Transformers RoHS The POE70P-50LD, manufactured by Coilcraft, is a magnetic component designed for PoE applications, where electrical power is delivered together with data over Ethernet cables. It is optimized for isolated DC-DC conversion in network-powered devices. Key Characteristics Part Type: PoE transformer / flyback transformer Technology: Magnetic (ferrite core) transformer Mounting: Surface-mount (SMT) Power Rating: ~7 W Isolation Voltage: up to 1500 Vrms Input Range: typically 36–72 V (PoE standard range) Output Example: ~5 V / 1.4 A (depending on design) Core Material: Ferrite Operating Temp: −40 °C to +85 °C Function (How it works) Converts high-voltage PoE input into low-voltage DC output Provides galvanic isolation between Ethernet line and device Works in a flyback converter topology Supports efficient energy transfer and EMI control Typical Applications IP cameras VoIP phones Wireless access points Network switches Industrial IoT devices #CommonPartsLibrary #Transformer

Molex SL series right-angle PCB header with latch and split pegs, 2.54mm (0.100") pitch wire-to-board connector, available in 2 to 25 circuit positions, through-hole mounting, 0.64mm square pins, glass-filled polyester UL94V-0 housing, phosphor bronze terminals, positive locking latch for secure cable retention, designed for reliable signal and power connections in industrial, consumer, automotive and embedded electronic applications. Molex 70551-0003 Molex SL header, Molex SL series connector, Molex 70400, Molex 70430, right angle header with latch, split peg header, 2.54mm wire to board connector, 0.100 inch header, Molex SL right angle header, locking PCB header, through hole connector, phosphor bronze header, Molex wire to board system Hashtags: #MolexSL #MolexConnector #SLSeries #WireToBoardConnector #RightAngleHeader #LockingHeader #SplitPegHeader #254mmPitch #100MilConnector #ThroughHoleConnector #PCBHeader #PhosphorBronzeContacts #IndustrialConnector #EmbeddedHardware #Molex70400 #Molex704302.54mm Pitch SL Header, Single Row, Right Angle, 3.05mm Pocket, Shrouded, with Beveled Plastic Peg, 4 Circuits, Tin (Sn) Plating

Slide Switch, SPDT, On-On, Through Hole, OS Series, 100mA # OS102011MS2QN1 ## General Description The OS102011MS2QN1 is a miniature slide switch manufactured by C&K, designed for low-power signal switching and control applications in electronic equipment. The switch features a compact mechanical design, reliable contact performance, and through-hole mounting configuration, making it suitable for embedded systems, industrial controls, instrumentation, telecommunications equipment, consumer electronics, and portable devices. Its robust construction ensures dependable operation throughout repeated switching cycles while maintaining stable electrical performance. The device is commonly utilized for mode selection, power control, configuration settings, and user-interface functions within electronic assemblies. ## Key Features ### Mechanical Characteristics * Miniature slide switch construction * Through-hole PCB mounting * Compact form factor * Durable actuator mechanism * Positive switching action * Designed for repeated mechanical operation ### Switching Characteristics * Maintained-contact operation * Reliable position retention * Low-force actuation * Stable contact engagement * Suitable for signal and control switching applications ### Electrical Characteristics * Low contact resistance * Reliable signal transmission * Stable switching performance * Suitable for low-current and low-voltage circuits * Consistent electrical operation throughout service life ### Contact System * High-reliability contact materials * Corrosion-resistant contact surfaces * Long operational durability * Dependable electrical continuity ### Material Construction * High-strength thermoplastic housing * Industrial-grade metallic contacts * Durable actuator assembly * RoHS-compliant materials ### Environmental Characteristics * Suitable for commercial and industrial electronic equipment * Resistant to mechanical wear * Reliable performance under normal operating environments * Designed for long-term service reliability ### Application Areas * Embedded Systems * Industrial Control Equipment * Consumer Electronics * Test and Measurement Instruments * Communication Devices * Medical Electronics * Power Control Circuits * User Interface Controls * Configuration and Mode Selection Functions * Electronic Development Platforms ### Compliance * RoHS Compliant * Lead-Free Compatible * Industrial-Grade Switching Component ## Manufacturer C&K ## Product Family OS Series Miniature Slide Switches #OS102011MS2QN1 #CKSwitches #SlideSwitch #MiniatureSwitch #ElectronicSwitch #PCBSwitch #EmbeddedSystems #IndustrialElectronics #ControlSystems #ConsumerElectronics #HardwareDesign #ElectronicsEngineering #SignalSwitching #PCBAssembly #ElectronicComponents #commonpartslibrary #switch #slide #spdt

RF ANTENNA Bluetooth, Wi-Fi, WLAN, Zigbee™ Ceramic Patch Solder Surface Mount The SWLP.2450.10.4.A.02 specification defines the engineering requirements for a surface-mount radio frequency antenna designed for wireless communication applications operating within the 2.4 GHz frequency band. This specification establishes the functional, electrical, mechanical, environmental, and quality requirements necessary to ensure efficient RF transmission and reception, stable antenna performance, and long-term operational reliability in embedded electronic systems. The antenna is intended for use in wireless communication devices supporting technologies such as Bluetooth, Wi-Fi, Zigbee, Thread, and other 2.4 GHz ISM band protocols. It is optimized for compact PCB integration while providing efficient radiation characteristics, stable impedance matching, and dependable performance in space-constrained electronic products including IoT devices, industrial controllers, consumer electronics, and smart sensing platforms. Engineering Requirements The antenna shall be manufactured using qualified conductive and dielectric materials with controlled production processes to ensure consistent RF performance, mechanical durability, and long-term reliability. The construction shall maintain stable electrical characteristics throughout the specified operating temperature and environmental conditions. Electrical characteristics shall provide efficient radiation efficiency, stable impedance matching, low return loss, and reliable signal transmission and reception across the intended operating frequency range. The antenna shall maintain consistent performance when integrated according to the recommended PCB layout and grounding practices. The RF structure shall minimize insertion losses and support reliable wireless communication while maintaining acceptable gain, bandwidth, and radiation pattern characteristics. The antenna shall exhibit stable performance under normal operating conditions without significant degradation caused by thermal variation or environmental exposure. Mechanical construction shall be suitable for automated surface-mount assembly and compatible with standard solder reflow manufacturing processes. The package shall withstand vibration, thermal cycling, mechanical handling, and environmental stress without degradation of electrical or structural performance. Workmanship shall be free from defects including cracks, contamination, plating irregularities, or structural inconsistencies that could adversely affect RF performance or reliability. Inspection, validation, and testing shall be performed using calibrated RF measurement equipment and controlled quality procedures to verify compliance with engineering and manufacturing requirements. Any deviation from this specification shall require formal engineering evaluation, documented technical justification, and approval through the established engineering change control process before implementation. Documentation Supporting documentation shall include engineering drawings, RF performance specifications, impedance matching recommendations, qualification reports, inspection records, reliability data, material declarations, and revision-controlled manufacturing documentation. All documentation shall be maintained under formal configuration management and quality assurance systems to ensure complete product traceability. Revision Control Any modification to this specification shall be managed through the formal engineering change management process. All revisions shall undergo technical review, validation, and approval before release to ensure continued compliance with design intent and applicable engineering standards. #EngineeringSpecification #RFAntenna #WirelessCommunication #Antenna #Bluetooth #WiFi #IoT #EmbeddedSystems #QualityAssurance #EngineeringDocumentation

Bipolar (BJT) Transistor NPN 40V 200mA 300MHz 350mW Surface Mount SOT-23 The MMBT3904-TP is an NPN general-purpose bipolar junction transistor (BJT) in a SOT-23 surface-mount package. It is a compact SMD version of the classic 2N3904, designed for switching and low-power signal amplification in a wide range of electronic circuits. It is commonly used in embedded systems, consumer electronics, and PCB designs where small size and reliable switching performance are required. Key Features NPN Bipolar Junction Transistor (BJT) Suitable for switching and amplification applications SOT-23 Surface-Mount Package Compact footprint for high-density PCB designs Collector-Emitter Voltage (Vceo) Typically up to 40V Collector Current Up to 200 mA continuous Low Power Operation Designed for small signal and low-power switching tasks High Gain (hFE) DC current gain typically 100–300 Fast Switching Capability Suitable for digital and pulse applications Wide Operating Temperature Range Typically -55°C to +150°C High Reliability Stable performance for general-purpose use RoHS Compliant Environmentally compliant manufacturing Typical Applications Signal switching in digital circuits LED driving circuits Small relay or load switching Sensor interface circuits General-purpose amplification stages 2N3904 SOT-23 #CommonPartsLibrary #Transistor #BJT #NPN #MMBT3904