NINA‑W15 modules come with pre-flashed application software, Wi-Fi (802.11b/g/n) and Bluetooth dual-mode (Bluetooth 4.2 BR/EDR and Bluetooth Low Energy). NINA-W15 has several important embedded security features, including secure boot which ensures that only authenticated software can run on the module. The modules are ideal for critical IoT applications where security is important. NINA-W156 has an internal PCB trace antenna.

The Raspberry Pi Pico 2 is now equipped with the RP2350, a cutting-edge, high-performance microcontroller designed with enhanced security and versatility in mind. Every element of its design has been upgraded, from the advanced CPU cores to the innovative PIO (Programmable I/O) interfacing subsystem. #raspberrypi #newpico #pipico2 #pipico #rp2350 #shield

2.4GHz -98dBm SMD,19.2x18mm RF Transceiver Modules and Modems RoHS The ESP32-WROOM-32UE-N16 is a 2.4 GHz wireless MCU module built around the ESP32 SoC. It combines a dual-core processor, integrated Wi-Fi (802.11 b/g/n) and Bluetooth 4.2 (Classic + BLE), along with rich peripherals. The “UE” variant specifically uses a U.FL / IPEX connector for an external antenna, making it ideal for applications that require better RF performance or flexible antenna placement (e.g., enclosed products or long-range communication). The “N16” indicates 16 MB external flash memory, suitable for large firmware, OTA updates, and data-heavy applications. Processing Dual-core Xtensa LX6 32-bit CPU Clock speed up to 240 MHz Memory 16 MB Flash (N16 variant) ~520 KB SRAM + 448 KB ROM Connectivity Wi-Fi: 802.11 b/g/n (up to 150 Mbps) Bluetooth: v4.2 (BR/EDR + BLE) Frequency: 2.4 GHz band Antenna External antenna via U.FL connector Better range and flexibility vs PCB antenna Interfaces / Peripherals GPIO (≈26 usable pins) UART, SPI, I2C, I2S, SDIO ADC, DAC PWM (LED & motor control) Capacitive touch sensing Security Hardware encryption: AES, SHA, RSA Secure boot & flash encryption support Power Operating voltage: 3.0V – 3.6V (typ. 3.3V) Multiple low-power modes for battery applications Environmental Operating temperature: -40°C to +85°C Physical Surface-mount module (~38 pins / 52 pads depending on reference) Compact and RF-shielded design Typical Applications Smart home devices (IoT) Industrial automation Wireless sensors and data loggers Wearables and consumer electronics Remote monitoring systems #Module #ESP32

Bluetooth, WiFi 802.11b/g/n, Bluetooth v5.0 Transceiver Module 2.402GHz ~ 2.48GHz Antenna Not Included Surface Mount The ESP32-C3 is a low-power, highly integrated 32-bit microcontroller (MCU) from Espressif Systems that combines 2.4 GHz Wi-Fi and Bluetooth® 5 Low Energy (BLE) connectivity in a single chip. Built around a single-core RISC-V processor running at up to 160 MHz, it is designed for secure, cost-effective IoT and embedded applications. The ESP32-C3 offers excellent wireless performance, low power consumption, robust security features, and a rich set of peripherals, making it ideal for smart home devices, industrial automation, wearable electronics, wireless sensors, and consumer IoT products. Key Features 32-bit RISC-V single-core CPU running up to 160 MHz Integrated 2.4 GHz Wi-Fi (802.11 b/g/n) and Bluetooth® 5 LE Low-power architecture with multiple sleep modes for battery-powered devices Advanced security features including Secure Boot, Flash Encryption, AES, SHA, RSA, HMAC, and hardware random number generator (RNG) Rich peripheral set including GPIO, UART, SPI, I²C, I²S, PWM, ADC, TWAI (CAN), USB Serial/JTAG, and timers Supports external QSPI flash memory and OTA (Over-the-Air) firmware updates Compact package options suitable for space-constrained embedded designs Fully supported by the ESP-IDF, Arduino, and MicroPython development ecosystems #ESP32C3 #Espressif #RISCV #WiFi #BluetoothLE #IoT #EmbeddedSystems #Microcontroller #WirelessMCU #LowPower #SmartHome #IndustrialIoT #SecureMCU #EdgeComputing #FirmwareDevelopment

ARM® Cortex®-A7 Microprocessor IC STM32MP1 2 Core, 32-Bit 209MHz, 650MHz 361-TFBGA (12x12) # Engineering Specification ## Product Name STM32MP157CAC3 ## General Description STM32MP157CAC3 is a high-performance microprocessor unit that combines application processing and real-time control capabilities within a single integrated circuit. The device is designed to support advanced embedded systems requiring a balance of computing performance, deterministic control, multimedia processing, connectivity, and security functionality. The component integrates multi-core processing resources, memory interfaces, graphics capabilities, peripheral controllers, and communication subsystems to enable the development of sophisticated embedded platforms. Its heterogeneous architecture allows high-level operating systems and real-time firmware to operate simultaneously, supporting applications that require both user-interface functionality and low-latency control. The device is intended for industrial automation, human-machine interface systems, edge computing platforms, communication equipment, medical devices, smart infrastructure, and Internet of Things applications. Its architecture enables consolidation of system functions, reducing component count and simplifying overall hardware design. The design emphasizes processing efficiency, system scalability, power management, security, and long-term reliability. It supports advanced software ecosystems and facilitates the development of connected embedded products with graphical interfaces, networking capabilities, and real-time operational control. ## Functional Requirements ### Application Processing The device shall provide application-level processing capabilities suitable for operating systems, middleware, and user applications. ### Real-Time Processing The device shall support deterministic control functions for time-critical embedded operations. ### Multimedia Support The component shall support graphical and multimedia processing functions for display and user-interface applications. ### System Integration The device shall integrate processing, communication, and peripheral functions within a unified embedded computing platform. ## Electrical Requirements ### Power Management The device shall support efficient power operation and multiple power management modes to optimize energy consumption. ### Memory Interface Support The component shall support external memory devices for program execution, data storage, and system operation. ### Peripheral Connectivity The device shall provide interfaces for communication, control, monitoring, and external subsystem integration. ### Signal Integrity The design shall support reliable operation across supported interface standards and operating conditions. ## Processing Architecture Requirements ### Multi-Core Operation The device shall support concurrent execution of application and real-time workloads through integrated processing resources. ### Operating System Support The architecture shall support embedded operating systems and software frameworks suitable for advanced application development. ### Security Features The device shall support hardware-based mechanisms intended to protect system integrity, software assets, and sensitive data. ### Resource Management The component shall support efficient allocation of processing, memory, and peripheral resources. ## Mechanical Requirements ### Surface Mount Construction The device shall be supplied in a high-density surface mount package suitable for automated manufacturing processes. ### PCB Integration The package shall support integration into multilayer printed circuit boards designed for high-performance embedded systems. ### Structural Integrity The device shall maintain electrical and mechanical reliability during assembly and operational service life. ## Environmental Requirements ### Operating Conditions The component shall operate reliably within environmental conditions commonly encountered in industrial and embedded applications. ### Thermal Performance The device shall support stable operation under sustained processing workloads and associated thermal conditions. ### Storage and Handling The component shall maintain physical and electrical integrity during transportation, storage, and manufacturing processes. ## Quality Requirements ### Reliability The device shall provide dependable long-term operation in embedded and industrial computing environments. ### Verification Processing, peripheral, communication, and system functions shall be validated through applicable testing and qualification procedures. ### Compliance The product shall conform to relevant semiconductor, quality, and embedded computing standards applicable to its intended use. ## Documentation Requirements Technical documentation shall include processor architecture information, hardware integration guidelines, memory interface recommendations, power management considerations, software development support, security features, and application design guidance. ## Classification Tags #STM32MP157CAC3 #STM32MP1 #Microprocessor #MPU #EmbeddedProcessor #ARMProcessor #EmbeddedLinux #RealTimeControl #IndustrialAutomation #HumanMachineInterface #EdgeComputing #IoTGateway #EmbeddedSystems #SystemOnChip #SoC #ApplicationProcessor #GraphicsProcessor #ConnectivityPlatform #IndustrialElectronics #PCBDesign #HardwareDevelopment #ElectricalEngineering #CommonPartsLibrary #ComponentLibrary #EngineeringSpecification #TechnicalDocumentation #SystemIntegration #SecureEmbeddedSystems #MulticoreProcessing

Security Authentication ICs DS2401P+T&R TSOC-6_L4.0-W4.0-P1.27-BL LCSC Part Number: C518978 JLCPCB Part Class: Extended Part Manufactured by ADI(亚德诺)/MAXIM(美信)

Security Authentication ICs ATSHA204A-MAHDA-T UDFN-8L_L2.0-W3.0-P0.50-BL-EP LCSC Part Number: C461613 JLCPCB Part Class: Extended Part Manufactured by MICROCHIP(美国微芯)

Security Authentication ICs RJM8L151C8T6Y LQFP-48_L7.0-W7.0-P0.50-LS9.0-BL LCSC Part Number: C490108 JLCPCB Part Class: Extended Part Manufactured by Runjet(瑞纳捷)

WiFi 802.11a/b/g/n, Bluetooth v5.0 Transceiver Module 2.4GHz PCB Trace The ESP32-S3-WROOM-1-N8R2 is a compact, low-power Wi-Fi and Bluetooth® Low Energy (BLE) module developed by Espressif Systems. It is based on the ESP32-S3 system-on-chip (SoC), which integrates a dual-core Xtensa® LX7 processor optimized for high performance and edge AI processing. This module includes 8 MB of external SPI flash memory and 2 MB of PSRAM, enabling efficient handling of memory-intensive applications such as graphical interfaces, buffering, and embedded machine learning workloads. Designed for flexibility and scalability, the module integrates RF components, power management, and a wide range of peripherals into a surface-mount package suitable for IoT, industrial, and consumer electronics applications. Key Features Dual-core Xtensa® LX7 processor operating up to 240 MHz Integrated 2.4 GHz Wi-Fi (802.11 b/g/n) Bluetooth 5 Low Energy support Embedded 8 MB SPI flash memory Integrated 2 MB PSRAM AI acceleration through vector instruction support USB OTG (full-speed) capability Multiple low-power operating modes Built-in hardware security features Extensive peripheral interface support Functional Overview The module consists of several integrated subsystems, including a dual-core processing unit, memory subsystem (flash and PSRAM), RF subsystem for wireless communication, peripheral interface controllers, power management circuitry, and a hardware-based security engine. Electrical Characteristics Operating voltage range: 3.0 V to 3.6 V (typical 3.3 V) Operating temperature range: -40°C to +85°C RF operating frequency: 2.4 GHz Current consumption varies depending on operating mode, ranging from microamp levels in deep sleep to hundreds of milliamps during active transmission Processor and Memory The module features a dual-core Xtensa® LX7 CPU capable of running at frequencies up to 240 MHz. It includes approximately 512 KB of internal SRAM, supplemented by 8 MB of external flash memory and 2 MB of PSRAM for extended data storage and processing. Wireless Connectivity The ESP32-S3-WROOM-1-N8R2 supports Wi-Fi communication compliant with 802.11 b/g/n standards in the 2.4 GHz band. It also supports Bluetooth 5 Low Energy for short-range wireless communication. The module includes an integrated PCB antenna and supports RF output power up to approximately +20 dBm. Peripheral Interfaces The module provides a wide range of interfaces, including general-purpose input/output (GPIO) pins, SPI, I2C, UART, and I2S for audio applications. It also supports PWM for LED control, a 12-bit analog-to-digital converter (ADC), and USB OTG functionality. Pin functions are multiplexed to maximize flexibility. Power Management Power efficiency is achieved through multiple operating modes, including active mode, modem sleep, light sleep, and deep sleep. The module includes an RTC subsystem for low-power timekeeping and supports dynamic frequency scaling to optimize performance and energy consumption. Security Features The module incorporates several hardware-based security mechanisms, including secure boot, flash encryption, and digital signature verification. It also includes a hardware random number generator and cryptographic accelerators supporting AES, SHA, RSA, and ECC algorithms. Mechanical Characteristics The module is designed for surface-mount integration and measures approximately 18 mm by 25.5 mm. It includes an onboard PCB antenna and is suitable for compact embedded designs. Pin Configuration Overview GPIO pins are multiplexed to support various peripheral functions such as analog inputs, communication interfaces, and control signals. Dedicated pins are provided for power supply, module enable, and boot configuration. Typical Applications Internet of Things (IoT) devices Smart home systems Industrial automation and monitoring Edge AI and machine learning applications Wearable electronics Audio and multimedia systems USB-enabled embedded devices Compliance The module is designed to meet Wi-Fi and Bluetooth standards and is compliant with RoHS requirements. Certification such as FCC or CE may apply depending on the specific module variant and deployment. Ordering Information The ESP32-S3-WROOM-1-N8R2 variant includes 8 MB of flash memory and 2 MB of PSRAM. #commonpartslibrary #integratedcircuit #transceiver #wireless #rf

SPI Flash Serial Flash Memory with Dual/Quad SPI The W25Q16JVUXIQ is a 16-Mbit (2-MByte) Serial NOR Flash memory device from Winbond. It is designed for embedded systems that require non-volatile code and data storage with minimal pin count, low power consumption, and high-speed access. The device supports standard SPI, Dual SPI, and Quad SPI interfaces, making it suitable for firmware storage, boot memory, IoT devices, microcontrollers, consumer electronics, and execute-in-place (XIP) applications. Key Features 16-Mbit (2-MByte) Flash Memory Capacity Operating Voltage: 2.7 V to 3.6 V Standard SPI, Dual SPI, and Quad SPI Interface Support Maximum SPI Clock Frequency: 133 MHz Equivalent Data Transfer Rates: 266 MHz (Dual SPI) 532 MHz (Quad SPI) Continuous Read and XIP (Execute-In-Place) Capability 4 KB Sector Erase, 32 KB Block Erase, 64 KB Block Erase, and Chip Erase 256-Byte Programmable Page Size Minimum 100,000 Program/Erase Cycles per Sector More Than 20 Years Data Retention Ultra-Low Power Consumption Typical power-down current below 1 µA 64-Bit Unique Serial Number Three 256-Byte Security Registers with OTP Protection JEDEC ID and SFDP Support Software and Hardware Write Protection Operating Temperature Options up to +85°C and +105°C Compact 8-Pad USON Package (2 mm × 3 mm) suitable for space-constrained designs #CommonPartsLibrary #IntegratedCircuit #Memory

Authentication Chip 8-UDFN (2x3) The ATECC608B-MAHDA-S is a secure authentication and cryptographic co-processor designed for hardware-based security, device authentication, encrypted communication, and secure key storage in embedded systems and IoT applications. The device integrates advanced cryptographic functionality with protected non-volatile memory to provide a secure root of trust for connected devices. The integrated security engine supports public key cryptography, secure boot validation, message authentication, key generation, digital signatures, and encrypted data exchange. The device is optimized for low-power embedded applications requiring protection against counterfeiting, unauthorized access, firmware tampering, and network-based attacks. The ATECC608B-MAHDA-S supports industry-standard cryptographic algorithms and secure provisioning workflows, enabling secure authentication in cloud-connected systems, industrial automation, consumer electronics, and automotive embedded platforms. The compact surface-mount package and low-power operation make the device suitable for highly integrated embedded designs where hardware security and identity protection are critical requirements. Key Features Hardware-based cryptographic security device Secure key storage and management Integrated authentication engine Public key cryptography support Secure boot and firmware validation capability Digital signature generation and verification Hardware random number generator Encrypted communication support Tamper-resistant key protection Secure provisioning and device identity management Low-power operation for embedded systems I2C serial communication interface Compact surface-mount package IoT and cloud authentication support Electrical Characteristics Secure non-volatile key storage architecture Low operating power consumption Hardware cryptographic acceleration Secure internal key isolation Fast authentication processing capability Wide operating voltage support Industrial temperature operation compatibility High-reliability embedded security implementation Applications IoT device authentication Secure embedded systems Cloud-connected devices Secure boot implementations Firmware integrity verification Industrial automation systems Smart home products Medical electronics Automotive embedded security Asset tracking and identification Anti-counterfeiting systems Encrypted communication platforms Package Information Package Type: SOIC Mounting Type: Surface Mount Compact embedded security package RoHS compliant configuration available #commonpartslibrary #integratedcircuit #securityic #cryptography #iotsecurity #embeddedhardware #authentication #secureboot #hardwaresecurity #encryptedcommunication

The CC1101RGP is a low-power sub-gigahertz RF transceiver designed for wireless communication applications requiring reliable long-range data transmission and high receiver sensitivity. It integrates a complete radio frequency front-end, packet handling engine, modulation and demodulation circuitry, frequency synthesizer, and advanced power management features within a compact package. The device supports multiple modulation formats and is optimized for industrial, scientific, medical, smart metering, home automation, remote control, wireless sensor networks, and Internet of Things applications. Its flexible configuration options enable designers to achieve an optimal balance between communication range, data throughput, power consumption, and system robustness. Features Sub-gigahertz RF transceiver for license-free ISM frequency bands High receiver sensitivity for extended communication range Programmable output power for optimized power consumption Multiple modulation schemes including FSK, GFSK, ASK, OOK, and MSK Integrated packet handling and error detection functions Fast frequency synthesizer settling time Low current consumption in transmit, receive, and sleep modes Hardware support for address filtering and data buffering Programmable channel spacing and data rate configuration Integrated RSSI, LQI, and clear channel assessment functions SPI interface for configuration and data communication Suitable for battery-powered wireless devices Applications Smart metering systems Wireless sensor networks Industrial monitoring and control Home and building automation Remote keyless entry systems Alarm and security systems Asset tracking devices Telemetry and data acquisition systems IoT communication nodes Proprietary wireless communication networks Electrical Characteristics Wide operating supply voltage range Low-power transmit and receive operation Programmable RF output power levels High-performance frequency synthesizer Low standby and sleep current consumption Integrated crystal oscillator support Robust RF performance across supported frequency bands Interface and Connectivity Serial Peripheral Interface communication Digital control and status signals Configurable interrupt outputs Integrated FIFO buffers for transmit and receive data External antenna connection through matching network Package Information Surface-mount package suitable for automated assembly Compact footprint for space-constrained applications RoHS-compliant device construction #commonpartslibrary #integratedcircuit #wirelesscommunication #rftransceiver #subghz #iot #embeddedsystems #industrialautomation #smartmetering #wirelesssensornetwork #lowpowerdesign #telemetry #homeautomation #remotecontrol #texasinstruments

IC RF TxRx + MCU Bluetooth, WiFi 802.11b/g/n, Bluetooth v5.0 2.412GHz ~ 2.484GHz 56-VFQFN Exposed Pad The ESP32-S3R8 is a high-performance wireless microcontroller system-on-chip manufactured by Espressif Systems. This device integrates dual-core processing, Wi-Fi connectivity, Bluetooth Low Energy communication, embedded memory resources, and advanced peripheral interfaces within a compact package optimized for embedded and IoT applications. The microcontroller is based on the Xtensa LX7 architecture and is designed to support edge computing, wireless communication, human-machine interfaces, audio processing, AI acceleration, and low-power connected systems. The ESP32-S3R8 includes integrated flash and RAM resources, advanced security functions, vector instruction acceleration, and extensive GPIO/peripheral capability for modern embedded development. The device is widely used in IoT devices, industrial automation systems, smart home equipment, wearable electronics, wireless sensor nodes, edge AI applications, USB-enabled embedded systems, and portable consumer electronics. Its integrated wireless functionality and high processing performance reduce external component count while simplifying system-level design for connected embedded platforms. Engineering Specification Device Type Wireless microcontroller system-on-chip Processor Architecture Dual-core Xtensa LX7 microcontroller architecture Wireless Connectivity Integrated Wi-Fi and Bluetooth Low Energy communication Processing Features High-performance embedded processing with vector instruction acceleration Memory Resources Integrated RAM and embedded memory architecture Communication Interfaces SPI I2C UART I2S USB PWM ADC GPIO interfaces Wireless Features Secure wireless networking and low-power communication support USB Capability Integrated USB communication and device functionality AI and DSP Features Vector instruction support for AI and digital signal processing workloads Security Features Hardware encryption and secure boot support Power Characteristics Low-power operating modes for battery-powered systems Package Type QFN surface-mount package Mounting Style Surface mount technology Applications IoT devices Wireless embedded systems Industrial automation Smart home electronics Edge AI applications Wearable devices Consumer electronics USB-enabled systems Sensor networks Embedded communication platforms Manufacturer Espressif Systems #commonpartslibrary #esp32 #esp32s3 #wirelessmcu #microcontroller #iot #embeddedhardware #wifi #bluetoothlowenergy #espressif #surfaceountcomponents #electronicsdesign #edgeai #wirelesscommunication #consumerelectronics

SMD,24x24mm RF Transceiver Modules and Modems RoHS A7670C-LASE is a compact LTE Cat 1 wireless communication module from SIMCom Wireless Solutions designed for IoT and M2M applications. It supports 4G LTE and 2G fallback connectivity, providing reliable cellular data communication for industrial, automotive, security, POS, and remote monitoring systems. The module uses a compact 24 mm × 24 mm LGA+LCC package, making it suitable for space-constrained designs. Key Features LTE Cat 1 cellular module with up to 10 Mbps downlink and 5 Mbps uplink data rates. Supports LTE-FDD, LTE-TDD, GSM, GPRS, and EDGE networks. Compact 24 mm × 24 mm LGA+LCC package for easy migration from 2G, NB-IoT, and Cat-M designs. Operating voltage range of 3.4 V to 4.2 V. Multiple interfaces including: USB 2.0 UART I²C SPI GPIO ADC Integrated TCP/IP protocol stack for internet connectivity. Supports major operating systems including Windows, Linux, and Android through USB drivers. Firmware Over-The-Air update (FOTA/DFOTA) support. Supports LBS (Location Based Service) positioning. TLS/SSL security protocol support for secure communications. AT command compatible cellular modem architecture. Typical Applications Vehicle telematics and fleet management Industrial IoT gateways and routers POS terminals Security and surveillance systems Remote monitoring and telemetry Healthcare and telemedicine devices

The ESP32-C3FH4 is a highly integrated wireless microcontroller designed for Internet of Things, smart devices, industrial automation, consumer electronics, and embedded connectivity applications. It combines a low-power RISC-V processor with integrated Wi-Fi and Bluetooth Low Energy connectivity, providing a cost-effective and secure platform for wireless communication and edge computing. The device incorporates embedded flash memory, advanced security features, low-power operating modes, and a rich set of peripheral interfaces, making it suitable for battery-powered and always-connected systems. Its compact design and comprehensive software ecosystem enable rapid development of connected products while maintaining high reliability and energy efficiency. The ESP32-C3FH4 is widely used in smart sensors, home automation devices, wearable electronics, industrial monitoring systems, wireless control modules, and cloud-connected embedded products. Features Integrated RISC-V microcontroller core Built-in Wi-Fi connectivity Integrated Bluetooth Low Energy support Embedded flash memory Low-power operation for battery-powered applications Hardware cryptographic acceleration Secure boot capability Flash encryption support Multiple GPIO interfaces Integrated UART, SPI, I²C, I²S, PWM, and ADC peripherals Real-time processing capability Wireless networking and cloud connectivity support OTA firmware update support Compact surface-mount package Industrial-grade reliability Electrical Characteristics Wireless microcontroller architecture Integrated RF subsystem Low-power operating modes High-performance embedded processing Secure communication support Multi-protocol wireless connectivity Flexible peripheral expansion capability Optimized power consumption for IoT devices Applications Internet of Things devices Smart home automation Wireless sensor networks Industrial monitoring systems Asset tracking devices Wearable electronics Smart appliances Remote control systems Data acquisition platforms Edge computing applications Connected consumer products Embedded wireless gateways Package Information Surface-mount package Compact footprint for embedded applications Suitable for automated assembly processes Optimized thermal and electrical performance PCB-friendly package design #commonpartslibrary #integratedcircuit #microcontroller #wirelessconnectivity #wifi #bluetoothlowenergy #iot #embeddedsystems #espressif #smartdevices #industrialautomation #edgecomputing #wirelessmodule #internetofthings #electronicsdesign #riscv #embeddedelectronics #lowpowerdesign

SPI Flash Memory with Dual/Quad SPI The W25Q128JV (128M-bit) Serial Flash memory provides a storage solution for systems with limited space, pins and power. The 25Q series offers flexibility and performance well beyond ordinary Serial Flash devices. They are ideal for code shadowing to RAM, executing code directly from Dual/Quad SPI (XIP) and storing voice, text and data. The device operates on a single 2.7V to 3.6V power supply with current consumption as low as 1µA for power-down. All devices are offered in space-saving packages. The W25Q128JV array is organized into 65,536 programmable pages of 256-bytes each. Up to 256 bytes can be programmed at a time. Pages can be erased in groups of 16 (4KB sector erase), groups of 128 (32KB block erase), groups of 256 (64KB block erase) or the entire chip (chip erase). The W25Q128JV has 4,096 erasable sectors and 256 erasable blocks respectively. The small 4KB sectors allow for greater flexibility in applications that require data and parameter storage. (See Figure 2.) The W25Q128JV supports the standard Serial Peripheral Interface (SPI), Dual/Quad I/O SPI: Serial Clock, Chip Select, Serial Data I/O0 (DI), I/O1 (DO), I/O2 and I/O3. SPI clock frequencies of W25Q128JV of up to 133MHz are supported allowing equivalent clock rates of 266MHz (133MHz x 2) for Dual I/O and 532MHz (133MHz x 4) for Quad I/O when using the Fast Read Dual/Quad I/O. These transfer rates can outperform standard Asynchronous 8 and 16-bit Parallel Flash memories.  New Family of SpiFlash Memories – W25Q128JV: 128M-bit / 16M-byte – Standard SPI: CLK, /CS, DI, DO – Dual SPI: CLK, /CS, IO0, IO1 – Quad SPI: CLK, /CS, IO0, IO1, IO2, IO3 – Software & Hardware Reset(1)  Highest Performance Serial Flash – 133MHz Single, Dual/Quad SPI clocks – 266/532MHz equivalent Dual/Quad SPI – 66MB/S continuous data transfer rate – Min. 100K Program-Erase cycles per sector – More than 20-year data retention  Efficient “Continuous Read” – Continuous Read with 8/16/32/64-Byte Wrap – As few as 8 clocks to address memory – Allows true XIP (execute in place) operation  Low Power, Wide Temperature Range – Single 2.7 to 3.6V supply – <1µA Power-down (typ.) – -40°C to +85°C operating range – -40°C to +105°C operating range Flexible Architecture with 4KB sectors – Uniform Sector/Block Erase (4K/32K/64K-Byte) – Program 1 to 256 byte per programmable page – Erase/Program Suspend & Resume  Advanced Security Features – Software and Hardware Write-Protect – Power Supply Lock-Down – Special OTP protection – Top/Bottom, Complement array protection – Individual Block/Sector array protection – 64-Bit Unique ID for each device – Discoverable Parameters (SFDP) Register – 3X256-Bytes Security Registers with OTP locks – Volatile & Non-volatile Status Register Bits  Space Efficient Packaging – 8-pin SOIC 208-mil – 16-pin SOIC 300-mil (additional /RESET pin) – 8-pad WSON 6x5-mm / 8x6-mm – 24-ball TFBGA 8x6-mm (6x4/5x5 ball array) – 24-ball WLCSP – Contact Winbond for KGD and other options #CommonPartsLibrary #IntegratedCircuit #Memory

Security Authentication ICs ATSHA204A-SSHDA-T SOIC-8_L4.9-W3.9-P1.27-LS6.0-BL LCSC Part Number: C404018 JLCPCB Part Class: Extended Part Manufactured by MICROCHIP(美国微芯)

Security Authentication ICs RJM8L303TBE6T QFN-48_L5.0-W5.0-P0.35-BL-EP LCSC Part Number: C490106 JLCPCB Part Class: Extended Part Manufactured by Runjet(瑞纳捷)

Security Authentication ICs RJM8L303TBF6T LQFP-48_L7.0-W7.0-P0.50-LS9.0-BL LCSC Part Number: C490107 JLCPCB Part Class: Extended Part Manufactured by Runjet(瑞纳捷)

Security Authentication ICs RJMU401FHO SSOP-20L_L7.2-W5.3-P0.65-LS7.8-BL LCSC Part Number: C490104 JLCPCB Part Class: Extended Part Manufactured by Runjet(瑞纳捷)