The XIAO RP2350 packs the power of the Raspberry Pi RP2350 (switchable architecture of dual Arm Cortex-M33 cores running at 150MHz with FPU, and dual open-hardware Hazard3 RISC‑V cores, enhanced security and encryption) into the classic XIAO form factor. Measuring just 21x17.5mm, it features 19 multifunction GPIOs, an RGB LED, and a Battery Management System with ultra-low power consumption of 27μA, battery power supply, and direct battery voltage measurement. Thanks to the XIAO ecosystem, the XIAO RP2350 is compatible with a wide range of add-ons, including displays, LED matrix, Grove modules, CAN Bus, Vision AI sensors, and mmWave sensors. With native support for MicroPython, C, and C++, the XIAO RP2350 is perfect for developers of all levels looking to create compact, battery-powered applications for smart control, wearables, DIY keyboards, and more.

Temp Monitoring System (Sensor) - External Sensor SPI Output 20-TQFN (5x5) #commonpartslibrary #sensor #Temperaturesensor #integratedcircuit

SparkFun's Qwiic Connect System uses 4-pin JST connectors to quickly interface development boards with sensors, LCDs, relays and more. Connector Header Surface Mount, Right Angle 4 position 0.039" (1.00mm)

RF System on a Chip - SoC Ultra-low power Bluetooth Multiprotocol 5.4 SoC System-on-Chip #CommonPartsLibrary #IntegratedCircuit #RF-Transceiver #NRF54L15

Automotive, 60-V, 6-A, 30-mΩ, one-channel smart high-side switch with adjustable current limit TPS1HTC30-Q1 is a single-channel, smart high-side switch, with integrated NMOS power FET and charge pump, designed to meet the requirements of 24-V automotive battery systems. The low RON(30 mΩ) minimizes device power dissipation driving a wide range of output load current up to 6-A DC, and the 60- V DC operating range improves system robustness. The device integrates protection features such as thermal shutdown, output clamp, and current limit. These features improve system robustness during fault events such as short circuit. TPS1HTC30-Q1 implements an adjustable current limiting circuit that improves the reliability of the system by reducing inrush current when driving large capacitive loads and minimizing overload current. The device also provides an accurate load current sense that allows for improved load diagnostics such as overload and open-load detection enabling better predictive maintenance. TPS1HTC30-Q1 is available in a small 14-pin, 4.40- mm × 5.0-mm HTSSOP leaded package with 0.65- mm pin pitch minimizing the PCB footprint. • Single-channel smart high-side power switch for 24-V automotive systems with full diagnostics • Wide operating voltage range: 6 V to 60 V – OVP protection: 66 V • Low RON: 30-mΩ typical, 55-mΩ maximum • Low standby current: < 0.5 µA • Low quiescent current (Iq): < 2 mA • Improve system level reliability through adjustable current limiting – Current limit: 2 A –16 A • Accurate current sensing: ±4% at 1 A • Protection – Overload and short-circuit protection – Integrated inductive discharge clamp – Undervoltage lockout (UVLO) protection – Loss of GND, loss of supply protection – Reverse battery protection with external components • Diagnostics – On and off state output open-load and short-tobattery detection – Overload and short to ground detection – Absolute and relative thermal shutdown detection • Functional Safety-Capable – Documentation available to aid functional safety system design • Operating junction temperature: –40 to 125°C • Input control: 1.8-V, 3.3-V and 5-V logic compatible • Integrated fault sense voltage scaling for ADC protection • Qualifications – AEC-Q100 qualified for automotive applications • Temperature grade 1: –40°C to +125°C, TA • 14-pin thermally-enhanced TSSOP package TPS1HTC30AQPWPRQ1 #CommonPartsLibrary #IntegratedCircuit

Multi-Sensor High Accuracy Digital Temperature Measurement System

Buck Switching Regulator IC Positive Adjustable 1.2V 1 Output 3.5A 8-PowerSOIC (0.154", 3.90mm Width) The LM5013DDAR is a 100-V input, 3.5-A buck switching regulator IC that efficiently steps down high DC voltages (such as 24 V, 48 V, or battery rails) to lower regulated outputs. It is optimized for rugged environments where wide input variations and high reliability are required. It features ultra-low quiescent current operation, making it suitable for systems that require high efficiency even at light load or standby conditions. Key Features Wide input voltage range: 6 V to 100 V Up to 3.5 A output current capability Integrated 100-V high-side MOSFET Non-synchronous buck topology Ultra-low quiescent current (IQ) for high efficiency in standby Constant-on-time (COT) control for fast transient response No external compensation components required Adjustable output voltage (down to ~1.2 V reference) 50 ns minimum on/off time for high step-down ratios Built-in protection features: Overcurrent protection Thermal shutdown Input undervoltage lockout (UVLO) Open-drain power-good (PGOOD) signal for system monitoring Meets low EMI requirements (CISPR 25 Class 5 capable) Package 8-pin SO PowerPAD (DDA) surface-mount package Designed for good thermal performance in high-voltage applications Typical Applications Industrial power supplies (24 V / 48 V systems) Automotive power systems Telecom and networking equipment High cell-count battery systems Motor control and inverter subsystems #LM5013 #BuckConverter #DCDCConverter #TexasInstruments #PowerManagementIC #HighVoltageRegulator #3ARegulator #IndustrialPower #AutomotiveElectronics #SwitchingRegulator #COTController

1/1 Transceiver Half CANbus 8-SOIC The SN65HVD230DR is a high-speed Controller Area Network (CAN) transceiver designed to interface a CAN protocol controller with the physical two-wire CAN bus. It operates as a differential line driver and receiver, translating logic-level signals into robust bus-level signals suitable for automotive, industrial, and distributed control applications. The device is optimized for reliable communication in electrically noisy environments and supports low-power operation, making it suitable for systems requiring energy efficiency and extended operational stability. This transceiver conforms to widely adopted CAN physical layer standards and is intended for use in systems requiring high data integrity, fault tolerance, and electromagnetic compatibility. It integrates protection features and supports standby functionality to reduce system power consumption when communication is inactive. Functional Overview The device provides bidirectional signal conversion between a CAN controller and the differential CAN bus lines. It features a transmit data input and a receive data output, enabling full-duplex communication at the protocol level. The driver stage generates differential output signals on the bus, while the receiver stage detects and translates bus signals back into logic-level data. An internal control mechanism allows the device to enter a low-power standby mode, reducing current consumption when active communication is not required. The transceiver includes slope control capability to manage signal edge rates, which helps minimize electromagnetic interference and improves signal integrity across the network. Electrical Characteristics The transceiver operates from a single low-voltage supply and is designed for compatibility with modern microcontrollers and digital logic systems. It provides differential output drive capability with controlled rise and fall characteristics. The receiver is designed with high input sensitivity and noise immunity to ensure accurate signal detection under varying bus conditions. The device includes thermal protection and safeguards against bus faults, including short-circuit conditions. Its internal circuitry is designed to maintain stable operation across a wide range of environmental conditions and supply variations. Interface Requirements The logic interface is compatible with standard digital input and output levels, allowing direct connection to a CAN controller. The bus interface consists of two differential lines that connect to the CAN network. Proper termination and layout practices are required to ensure optimal communication performance and compliance with CAN network design guidelines. Operating Conditions The device is intended for operation across a broad temperature range suitable for industrial and automotive environments. It maintains functional integrity under typical voltage fluctuations and environmental stresses encountered in embedded systems. Protection and Reliability Features The transceiver incorporates protection mechanisms to guard against overcurrent, thermal overload, and electrostatic discharge. It is designed to maintain communication reliability even in the presence of transient disturbances and electrical noise. Packaging and Integration The SN65HVD230DR is provided in a compact surface-mount package suitable for automated assembly. Its pin configuration supports straightforward integration into printed circuit board designs with minimal external components. #CommonPartsLibrary #IntegratedCircuits #Interface #Drivers #Receivers #Transceivers #65HVD230

The FS8205A is a dual N-channel enhancement-mode power MOSFET designed primarily for lithium-ion and lithium-polymer battery protection applications. Manufactured by several semiconductor vendors including Fortune Semiconductor, this device integrates two low on-resistance MOSFETs within a compact surface-mount package, enabling efficient bidirectional current control for battery charging and discharging systems. The device is commonly paired with single-cell battery protection controller ICs such as the DW01A to provide overcharge, overdischarge, overcurrent, and short-circuit protection in portable electronic products. Its low drain-to-source resistance minimizes conduction losses and improves overall battery efficiency while maintaining compact PCB layout requirements. The FS8205A is widely used in battery management systems, portable consumer electronics, rechargeable battery packs, USB-powered devices, IoT hardware, and embedded power management circuits requiring reliable load switching and battery protection functionality. Engineering Specification Device Type Dual N-channel power MOSFET Transistor Technology Enhancement-mode MOSFET architecture Channel Configuration Dual independent N-channel MOSFETs Switching Characteristics Low on-resistance for efficient power switching Gate Characteristics Logic-level gate drive compatibility Current Handling Optimized for battery charge and discharge current control Power Efficiency Low conduction loss for improved battery runtime Protection System Compatibility Designed for lithium battery protection controller integration Thermal Characteristics Compact thermal-efficient surface-mount structure Package Type SOP-8 surface-mount package Mounting Style Surface mount technology Reliability Features Stable switching performance and robust load handling capability Applications Lithium-ion battery protection Battery management systems Portable electronics Rechargeable battery packs USB-powered devices Power path switching Embedded systems Consumer electronics IoT hardware Load switching circuits Manufacturer Commonly manufactured by Fortune Semiconductor and compatible vendors #commonpartslibrary #mosfet #dualmosfet #nchannelmosfet #batteryprotection #batterymanagement #powermanagement #powerelectronics #embeddedhardware #consumerelectronics #surfaceountcomponents #electronicsdesign #lithiumbattery #loadswitch #portableelectronics

Power Switch/Driver 1:1 N-Channel 3.8A 6-WQFN-HR (1.5x0.75) The TPS22995RZGR is a high-current, low ON-resistance load switch designed for power distribution and power sequencing applications. It features an integrated N-channel MOSFET capable of handling high load currents while maintaining minimal voltage drop. The device includes controlled rise time to reduce inrush current, making it suitable for sensitive power rails and battery-powered systems. It also integrates thermal shutdown and overcurrent protection, ensuring safe operation under fault conditions. Its compact package and low quiescent current make it ideal for portable and space-constrained designs. Key Features Ultra-low ON-resistance (R_ON) Wide input voltage range High continuous output current capability Controlled slew rate for inrush current limiting Low quiescent current Thermal shutdown protection Reverse current blocking (when disabled) Active high enable pin (ON pin) Compact WQFN package Electrical Characteristics Input Voltage Range: 0.5 V to 5.5 V ON-Resistance (R_ON): Typically ~5 mΩ (VIN = 5 V) Continuous Output Current: Up to 6 A (typical, PCB dependent) Quiescent Current: Typically < 10 µA Shutdown Current: Typically < 1 µA Enable Threshold Voltage: ~0.9 V (typical) Functional Description The TPS22995RZGR operates as a load switch that connects or disconnects a power supply to a load using an internal MOSFET controlled by an enable (ON) pin. When the ON pin is asserted high, the device turns on with a controlled rise time, limiting inrush current. When disabled, the switch turns off quickly and prevents reverse current flow from the output to the input. Integrated protection features such as thermal shutdown ensure reliability during abnormal operating conditions. Absolute Maximum Ratings Input Voltage (VIN): -0.3 V to 6 V ON Pin Voltage: -0.3 V to 6 V Output Voltage (VOUT): -0.3 V to VIN + 0.3 V Operating Junction Temperature: -40°C to +125°C Storage Temperature: -65°C to +150°C Package Information Package Type: WQFN (RZG) Package Size: 3 mm × 3 mm Mounting Type: Surface Mount Pin Count: 12 Applications Power rail switching Portable electronics USB power distribution Solid-state drives (SSD) Battery-powered systems Embedded systems power management Advantages Minimizes power loss due to low R_ON Reduces system inrush current Enhances system reliability with built-in protections Suitable for high-current, compact designs #commonpartslibrary #integratedcircuit #powermanagement

Dual ARM® Cortex®-A9 MPCore™ with CoreSight™ System On Chip (SOC) IC Zynq®-7000 Artix™-7 FPGA, 85K Logic Cells 766MHz 400-CSPBGA (17x17) #CommonPartsLibrary #IntegratedCircuit #Embedded

20 Position Receptacle Connector 0.100" (2.54mm) Through Hole Tin The SSW-120-01-T-S is a single-row, 20-position female (receptacle) socket strip with a 2.54 mm (0.1") pitch, intended for through-hole PCB mounting. It uses Samtec’s Tiger Buy™ contact system, providing reliable electrical performance and durability for repeated mating cycles. It is commonly used in embedded systems, development boards, and general PCB interconnections, especially where standard 0.1" headers are required. Female header 1x20 2.54mm Key Features Standard 2.54 mm Pitch Industry-standard spacing compatible with most pin headers and prototyping systems 20 Positions, Single Row Ideal for compact signal connections and header interfaces Tiger Buy™ Contact System Provides low insertion force and reliable electrical contact Available in standard or low insertion force variants Through-Hole Mounting Ensures strong mechanical retention and durability on PCBs Tin-Plated Contacts (T option) Cost-effective plating suitable for general-purpose applications High-Speed Capability Supports signals up to ~8 Gbps, depending on application and layout Wide Operating Temperature Range Typically −55 °C to +105 °C, suitable for industrial environments Material Construction Contacts: Phosphor bronze Insulator: High-temperature plastic (e.g., LCP) Versatile Mating Compatibility Mates with common Samtec header series (TSW, MTSW, etc.) and standard 0.025" square posts #CommonPartsLibrary #Connector #SSW-120

Amplifier IC 2 Channel (Stereo) Class D 32-HTSSOP The TPA3116D2QDADRQ1 is an automotive-grade, high-efficiency Class-D stereo audio power amplifier IC from Texas Instruments. It is designed to drive speakers directly in compact audio systems while maintaining high output power and low heat dissipation. The device is part of the TPA3116-Q1 family, qualified for AEC-Q100 automotive applications, making it suitable for harsh environments such as vehicle infotainment and industrial audio systems. It operates from a single supply and uses advanced Class-D switching architecture to achieve high efficiency (typically >90%), reducing the need for large heat sinks and improving overall system power efficiency. 🔑 Key Features Output power capability Up to 2 × 50 W into 4 Ω (BTL mode at ~21 V) Wide supply voltage range 4.5 V to 26 V single supply operation High efficiency Class-D operation 90% efficiency with low idle power loss Stereo and mono configurations Supports BTL stereo and PBTL mono modes Differential and single-ended inputs Flexible audio input compatibility Advanced protection features Overvoltage protection Undervoltage protection Overtemperature shutdown Short-circuit protection DC detect protection with fault reporting EMI-optimized design Reduced electromagnetic interference for easier system compliance Programmable power limit Helps protect speakers and manage output levels Thermally enhanced 32-pin HTSSOP package Designed for better heat dissipation in compact layouts Typical Applications Automotive infotainment systems Car audio amplifiers Soundbars and home audio systems Portable and powered speakers Industrial audio solutions #commonpartslibrary #integratedcircuit #linearamplifier #audioamplifier

Bluetooth Low Energy 5.0 SiP module, nRF52832-based, 6.5 x 6.5 x 1.15 mm 52-pad package with optional internal or external antenna The ANNA-B112-01B is an ultra-compact, stand-alone Bluetooth® Low Energy (BLE) 5 module developed by u-blox. It is built around the Nordic nRF52832 SoC, which integrates a powerful Arm Cortex-M4 processor with FPU, RF circuitry, memory, and antenna in a single System-in-Package (SiP). This module is designed for industrial and IoT applications, offering a combination of high performance, low power consumption, and small size. It supports both host-controlled operation (AT commands via u-connectXpress) and standalone embedded applications (open CPU mode), giving designers flexibility in system architecture. 🔑 Key Features 🧠 Processing & Memory 64 MHz Arm Cortex-M4 CPU with FPU 512 KB Flash and 64 KB RAM Supports open CPU (run user firmware directly on module) 📡 Wireless Connectivity Bluetooth 5.0 (BLE) compliant Supports: GATT client & server Bluetooth mesh Simultaneous central + peripheral roles Data rate up to 2 Mbps 📶 RF & Antenna Operates at 2.4 GHz ISM band Integrated chip antenna Optional external antenna via antenna pin Range up to ~160 m (internal antenna) 🔌 Interfaces & Peripherals Communication interfaces: UART, SPI, I²C, I²S Additional features: ADC (12-bit) PWM, PDM Up to 25 GPIOs Supports NFC (for pairing / data) ⚙️ Software & Development Comes with u-connectXpress firmware: AT command interface Serial Port Service (SPS) Easy integration without deep BLE stack knowledge Supports development using: Nordic SDK Arm Mbed Supports FOTA (Firmware Over-The-Air updates) 🔋 Power & Electrical Supply voltage: 1.7V to 3.6V Optimized for low-power applications Sleep current as low as ~300 nA 📦 Physical Characteristics Ultra-compact size: 6.5 × 6.5 × 1.2 mm Package: 52-pin SMD module Operating temperature: –40°C to +85°C 🌍 Certifications Globally pre-certified (FCC, CE, etc.) Reduces time and cost for product certification

Accelerometer X, Y, Z Axis ±2g, 4g, 8g, 16g 0.05Hz ~ 1.6kHz 14-LGA (3x5) The ADXL345 is a small, thin, ultralow power, 3-axis accelerometer with high resolution (13-bit) measurement at up to ±16 g. Digital output data is formatted as 16-bit twos complement and is accessible through either a SPI (3- or 4-wire) or I2C digital interface. The ADXL345 is well suited for mobile device applications. It measures the static acceleration of gravity in tilt-sensing applications, as well as dynamic acceleration resulting from motion or shock. Its high resolution (3.9 mg/LSB) enables measurement of inclination changes less than 1.0°. Several special sensing functions are provided. Activity and inactivity sensing detect the presence or lack of motion by comparing the acceleration on any axis with user-set thresholds. Tap sensing detects single and double taps in any direction. Free-fall sensing detects if the device is falling. These functions can be mapped individually to either of two interrupt output pins. An integrated memory management system with a 32-level first in, first out (FIFO) buffer can be used to store data to minimize host processor activity and lower overall system power consumption. Low power modes enable intelligent motion-based power management with threshold sensing and active acceleration measurement at extremely low power dissipation. The ADXL345 is supplied in a small, thin, 3 mm × 5 mm × 1 mm, 14-lead, plastic package. ► Ultralow power: as low as 23 µA in measurement mode and 0.1 µA in standby mode at VS = 2.5 V (typical) ► Power consumption scales automatically with bandwidth ► User-selectable resolution ► Fixed 10-bit resolution ► Full resolution, where resolution increases with g range, up to 13-bit resolution at ±16 g (maintaining 4 mg/LSB scale factor in all g ranges) ► Embedded memory management system with FIFO technology minimizes host processor load ► Single tap/double tap detection ► Activity/inactivity monitoring ► Free-fall detection ► Supply voltage range: 2.0 V to 3.6 V ► I/O voltage range: 1.7 V to VS ► SPI (3- and 4-wire) and I2C digital interfaces ► Flexible interrupt modes mappable to either interrupt pin ► Measurement ranges selectable via serial command ► Bandwidth selectable via serial command ► Wide temperature range (−40°C to +85°C) ► 10,000 g shock survival ► Pb free/RoHS compliant #CommonPartsLibrary #IntegratedCircuit #Sensor #Transducer #Motion-Sensor #Accelerometer #ADXL345

24 Bit Analog to Digital Converter 8 Input 8 Sigma-Delta 32-TQFP (5x5) The ADS131M08IPBSR is a high-precision, simultaneous-sampling analog-to-digital converter designed for multi-channel data acquisition systems requiring accurate and synchronized measurements. Manufactured by Texas Instruments, this device integrates eight differential input channels with low-noise performance, programmable gain amplification, and precision voltage reference support. The converter architecture is optimized for industrial automation, energy monitoring, medical instrumentation, and precision sensing applications where phase alignment and signal fidelity are critical. The device incorporates delta-sigma conversion technology with integrated digital filtering to provide high dynamic range and excellent noise performance across a wide operating bandwidth. It supports flexible data interface configurations through a high-speed SPI-compatible serial interface, enabling efficient communication with microcontrollers, DSPs, and FPGA-based systems. The integrated diagnostic and monitoring features improve system reliability and simplify fault detection in safety-critical applications. The ADS131M08IPBSR operates from low-voltage analog and digital supplies while maintaining low power consumption suitable for embedded and portable systems. The compact thermally enhanced package supports dense PCB layouts and reliable operation across industrial temperature environments. Engineering Specification Device Type: Simultaneous-Sampling Delta-Sigma Analog-to-Digital Converter Manufacturer: Texas Instruments Channel Configuration: Eight Differential Input Channels Resolution: Twenty-Four Bit ADC Architecture: Delta-Sigma Sampling Type: Simultaneous Sampling Input Type: Differential Analog Inputs Programmable Gain Amplifier: Integrated Data Output Interface: SPI-Compatible Serial Interface Reference Support: External Precision Voltage Reference Digital Filtering: Integrated Sinc Filter Architecture Operating Supply Voltage: Low-Voltage Analog and Digital Supplies Noise Performance: Low Noise Precision Measurement Capability Power Consumption: Optimized for Low Power Operation Diagnostics Features: Integrated Self-Monitoring and Fault Detection Temperature Range: Industrial Operating Temperature Range Package Type: TQFP Surface-Mount Package Mounting Type: Surface Mount Technology Application Areas: Energy Metering, Industrial Automation, Medical Instrumentation, Data Acquisition Systems, Multi-Channel Sensor Interfaces #commonpartslibrary #integratedcircuit #analog #digital #converter

67 Position Female Connector M.2 (NGFF) Mini Card Gold 0.020" (0.50mm) Black # Engineering Specification ## Product Name 2199230-4 ## General Description 2199230-4 is a surface mount board-edge connector designed to support standardized M.2 module interfaces, specifically configured for Key E applications used in wireless communication, embedded computing, and high-speed peripheral expansion systems. The component provides a reliable mechanical and electrical interface between a host printed circuit board and a removable or fixed M.2 module. The connector is engineered to accept gold-finger edge contacts from an M.2 module, enabling secure signal transmission for high-speed data communication, power delivery, and control signaling. Its design supports stable mechanical retention, precise alignment, and consistent electrical contact performance under repeated mating cycles. This component is widely used in industrial computing platforms, telecommunications equipment, IoT devices, and embedded system architectures where modular expansion and standardized connectivity are required. It enables flexible system design by allowing interchangeable M.2 modules for wireless communication, storage, and specialized processing functions. The design emphasizes signal integrity, mechanical durability, and compatibility with high-density PCB layouts. It is suitable for applications requiring robust high-frequency performance and reliable long-term mechanical stability. ## Functional Requirements ### Module Interface The connector shall provide a standardized interface for M.2 Key E module insertion and electrical connection. ### Signal Transmission The connector shall support high-speed electrical signal routing between host systems and M.2 modules. ### Mechanical Retention The connector shall securely retain inserted modules under vibration and operational stress conditions. ### System Modularity The connector shall enable modular expansion and replacement of functional M.2 devices within host systems. ## Electrical Requirements ### Contact Performance The connector shall provide stable electrical contact between gold-finger module pads and host PCB terminals. ### Signal Integrity The design shall support high-frequency signal transmission with minimal loss and interference. ### Power Delivery The connector shall support regulated power distribution to installed M.2 modules. ### Low Resistance Path The electrical interface shall maintain low contact resistance for reliable long-term operation. ## Mechanical Requirements ### Board Edge Mounting The connector shall be mounted on a printed circuit board to accept edge-insertion M.2 modules. ### Alignment and Fit The design shall ensure precise alignment between module contacts and connector terminals. ### Durability The connector shall withstand repeated module insertion and removal cycles without performance degradation. ### Structural Stability The assembly shall maintain mechanical integrity under vibration and operational stress conditions. ## Environmental Requirements ### Operating Conditions The connector shall operate reliably in industrial, commercial, and embedded system environments. ### Thermal Performance The device shall maintain mechanical and electrical stability under elevated operating temperatures. ### Storage and Handling The component shall retain structural and functional integrity during storage, transportation, and assembly processes. ## Quality Requirements ### Reliability The connector shall provide consistent electrical and mechanical performance throughout its operational lifetime. ### Verification Mechanical retention, contact resistance, and signal integrity shall be validated through appropriate qualification testing. ### Compliance The product shall conform to applicable standards governing M.2 interface connectors and high-speed board-edge interconnect systems. ## Documentation Requirements Technical documentation shall include footprint layout guidance, mating interface specifications, signal routing recommendations, mechanical keep-out regions, and application guidelines for M.2 system integration. ## Classification Tags #21992304 #M2Connector #M2KeyE #EdgeCardConnector #GoldFingerInterface #HighSpeedConnector #BoardEdgeConnector #WirelessModuleConnector #PCIeInterface #NGFF #EmbeddedSystems #IoTHardware #TelecomHardware #PCBDesign #MechanicalConnector #SignalIntegrity #HighFrequencyDesign #CommonPartsLibrary #ComponentLibrary #EngineeringSpecification #SystemIntegration #HardwareDesign #TEConnectivity #ModuleInterface #BoardToModule

2 Position Wire to Board Terminal Block Vertical with Board 0.138" (3.50mm) Surface Mount The 1250360000 is a high-quality PCB terminal block manufactured by Weidmüller, designed for secure and reliable wire-to-board connections. It features a robust screw-clamp connection system that ensures strong mechanical retention and excellent electrical conductivity. This component is widely used in industrial control systems, power distribution modules, and automation equipment where dependable field wiring is required. The terminal block is designed for easy installation on printed circuit boards and supports solid or stranded wires. Its durable housing material provides resistance to environmental stress, making it suitable for long-term operation in demanding applications. Key Features Screw clamp connection for secure wire termination Through-hole PCB mounting for strong mechanical stability High current carrying capability مقاust insulating housing with flame-retardant properties واضحة labeling area for easy identification Suitable for industrial and automation applications Electrical Characteristics Rated Voltage: 300 V (typical, verify datasheet) Rated Current: Up to 10–16 A (depending on wire size) Contact Resistance: Low (optimized for power applications) Insulation Resistance: High (>10⁸ Ω typical) Mechanical Characteristics Mounting Type: Through-Hole PCB Connection Type: Screw Clamp Number of Positions: Typically 2–12 positions (variant dependent) Wire Gauge Range: ~24 AWG to 12 AWG (approx.) Pitch: Typically 5.00 mm or 5.08 mm (verify exact variant) Material Information Housing Material: Polyamide (PA), flame-retardant (UL94 V-0) Contact Material: Copper alloy Contact Plating: Tin-plated Environmental Characteristics Operating Temperature Range: -40°C to +105°C (typical) Flammability Rating: UL94 V-0 RoHS Compliant: Yes Applications Industrial control systems Power supply units Automation and PLC systems Signal and power distribution boards Building and factory wiring interfaces Notes Exact electrical ratings and pitch may vary depending on the specific configuration under this series. Always refer to the official Weidmüller datasheet for precise parameters before design integration. #commonpartslibrary #connector #terminalblock

2 Position Wire to Board Terminal Block Horizontal with Board 0.138" (3.50mm) Through Hole The 2601-1102 specification defines the engineering requirements for a generic electronic or electromechanical component intended for integration into controlled system assemblies. This specification establishes the functional, mechanical, electrical, environmental, and quality expectations required to ensure consistent performance, reliability, and manufacturability across its intended applications. The component is designed for use in systems requiring stable operation, predictable behavior, and compatibility with standard manufacturing and assembly processes. It shall be suitable for integration into electronic or mechanical subsystems where long-term durability, consistent quality, and dependable operation are required. Engineering Requirements The component shall be manufactured using qualified materials and controlled production processes to ensure uniform performance and structural integrity. All construction methods shall support repeatability, stability, and compliance with established engineering intent. Electrical or functional characteristics shall remain stable under intended operating conditions and environmental exposure. The component shall maintain reliable operation during normal use, handling, and system integration without degradation of performance. Mechanical construction shall ensure durability and proper fit within the intended assembly environment. The component shall resist deformation, contamination, corrosion, and other defects that could compromise functionality or service life. Workmanship shall be free from visible or functional defects that may affect performance or reliability. All manufacturing and inspection activities shall be performed under controlled quality systems using calibrated methods to ensure compliance with engineering requirements. Any deviation from this specification shall require formal engineering evaluation, documented justification, and approval through established change control procedures prior to implementation. Documentation Supporting documentation shall include engineering drawings, material declarations, inspection records, qualification data, manufacturing instructions, and revision-controlled technical files. All documentation shall be maintained under formal configuration management and quality assurance systems to ensure traceability and consistency. Revision Control All changes to this specification shall be managed through formal engineering change control procedures. Each revision shall undergo technical review, validation, and approval prior to release to ensure continued compliance with design intent and applicable requirements. #EngineeringSpecification #ElectronicComponents #ElectromechanicalSystems #Manufacturing #QualityAssurance #EngineeringDesign #ProductCompliance #ReliabilityEngineering #ConfigurationControl

Battery Fuel Gauge IC Lithium Ion/Polymer 24-TQFN (4x4) The MAX17320G20+ is a high-accuracy, ultra-low-power fuel gauge and battery protector IC designed for 2-cell to 4-cell lithium-ion and lithium-polymer battery packs. The device integrates Maxim Integrated’s ModelGauge™ m5 EZ algorithm to provide precise battery state-of-charge estimation without requiring battery relearning after system resets or battery replacement. It is optimized for portable, wearable, industrial, and IoT battery-powered applications where accurate battery monitoring and robust protection are required. The device combines fuel gauging, battery authentication support, autonomous battery protection, current sensing, and voltage monitoring into a single integrated solution. It includes configurable protection features such as overvoltage, undervoltage, overcurrent, short-circuit, and thermal protection, helping improve system safety and battery reliability. The MAX17320G20+ communicates through an I²C-compatible interface and supports low-power operation for extended battery runtime. Features High-accuracy battery fuel gauge for multi-cell lithium-ion batteries Supports 2-cell to 4-cell battery pack configurations Integrated ModelGauge m5 EZ algorithm with no battery relearning required Integrated battery protector with autonomous safety monitoring Supports overvoltage, undervoltage, overcurrent, short-circuit, and thermal protection Integrated current-sense amplifier for accurate current measurement Low quiescent current optimized for portable and always-on systems I²C-compatible communication interface Configurable alert and interrupt functions Battery aging compensation and cycle tracking Supports battery authentication functionality Integrated ADCs for voltage, current, and temperature monitoring Programmable protection thresholds and timing parameters Low-power hibernate and sleep operating modes Electrical Characteristics Designed for lithium-ion and lithium-polymer battery chemistries Supports battery stack voltages corresponding to 2S to 4S configurations High-resolution voltage, current, temperature, and capacity measurements Low operating current suitable for battery-powered systems Integrated precision coulomb counter Wide operating temperature range suitable for industrial applications Protection Functions Cell overvoltage protection Cell undervoltage protection Charge overcurrent protection Discharge overcurrent protection Short-circuit protection Overtemperature and undertemperature protection Permanent failure detection and fault logging Autonomous FET control for pack isolation Interface and Control I²C serial communication interface Programmable registers for protection and fuel gauge configuration Interrupt and alert outputs for fault and status indication Supports host processor communication and diagnostics Nonvolatile memory for configuration storage Package Information Package type is TQFN Compact surface-mount package suitable for space-constrained designs RoHS compliant and lead-free package option Typical Applications Smart battery packs Portable medical devices Industrial handheld equipment IoT and wireless sensor devices Battery-powered consumer electronics Portable test and measurement systems Rechargeable multi-cell battery systems #commonpartslibrary #integratedcircuit #powermanagement #batterymanagement

1 18~22 5mm 1x2P 8A 2P 300V Blue 2 1 Plugin,P=5mm Spring Clamp System Terminal Block ROHS #Connector #Terminal-block

Hot Swap Controller 1 Channel General Purpose 23-LQFN-CLIP (6x5) The TPS16850VMAR is an automotive-grade integrated hot-swap and protection controller designed for robust power-path management in low-voltage DC systems. The device provides comprehensive protection features including overvoltage protection, undervoltage protection, reverse current blocking, inrush current control, overcurrent protection, and short-circuit protection. It is intended for applications requiring controlled power delivery and fault isolation in harsh electrical environments. The device integrates dual back-to-back MOSFET control to support bidirectional current blocking and safe power switching. Adjustable protection thresholds and timing parameters allow flexible system configuration for various power rail requirements. The TPS16850VMAR supports operation across a wide supply voltage range and is optimized for automotive and industrial systems requiring high reliability and transient immunity. The controller includes fault reporting and system status monitoring functions to support intelligent power management architectures. Soft-start capability minimizes inrush current during startup, reducing stress on connectors, power supplies, and downstream circuitry. Integrated thermal protection enhances system safety during abnormal operating conditions. The TPS16850VMAR is qualified for automotive applications and complies with AEC-Q100 requirements. The device is provided in a compact VQFN package suitable for space-constrained designs and high-density PCB layouts. Key Features Automotive-qualified hot-swap and eFuse controller Wide operating input voltage range Adjustable overvoltage and undervoltage protection Reverse current and reverse polarity protection Inrush current control with programmable soft-start Adjustable overcurrent and short-circuit protection Fault monitoring and reporting outputs Integrated thermal shutdown protection Back-to-back MOSFET control architecture Fast fault response and isolation Support for controlled power sequencing Designed for harsh automotive electrical environments AEC-Q100 qualified for automotive applications Compact VQFN surface-mount package Applications Automotive electronic control units Infotainment and telematics systems ADAS and camera modules Industrial power distribution Hot-swappable system power rails Battery-powered embedded systems Power-path management systems Protection for sensitive downstream electronics Electrical Characteristics Operates from low-voltage DC power rails Supports programmable protection thresholds Integrated current sensing and fault detection High transient immunity for automotive environments Low standby current operation Fast response to overload and fault conditions Mechanical Characteristics Surface-mount VQFN package Compact footprint for dense PCB layouts RoHS-compliant package construction Suitable for automated assembly processes Environmental and Reliability Specifications Automotive AEC-Q100 qualified Extended operating temperature range ESD protection on interface pins Designed for high-reliability applications Supports operation in electrically noisy environments #commonpartslibrary #integratedcircuit #powermanagement #hotswapcontrollers

0.5 mOhms ±1% 5W Chip Resistor Nonstandard Automotive AEC-Q200, Current Sense Metal Element # Engineering Specification ## Product Name CSS4J-4026R-L500F ## General Description CSS4J-4026R-L500F is a precision four-terminal Kelvin current sense shunt resistor designed for accurate current measurement in high-performance electronic and power management systems. The device is intended for use in applications requiring low resistance sensing, high measurement accuracy, and stable thermal performance under varying electrical loads. The component utilizes a metal element resistive structure optimized for minimal resistance drift, reduced temperature effects, and consistent long-term stability. Its four-terminal Kelvin configuration separates current flow and voltage sensing paths, enabling improved measurement accuracy by eliminating errors caused by PCB trace and connection resistance. The device is widely used in power conversion systems, battery monitoring systems, motor control circuits, and industrial power electronics where precise current feedback is essential for control, protection, and monitoring functions. Its surface-mount construction supports compact PCB layouts and automated assembly processes while maintaining robust mechanical and electrical reliability. The design emphasizes efficient heat dissipation, stable electrical characteristics, and compatibility with demanding industrial and automotive environments. It is suitable for integration into systems requiring continuous current monitoring and high measurement fidelity. ## Functional Requirements ### Current Measurement The device shall provide accurate current sensing through a low-resistance conductive path designed for minimal measurement error. ### Kelvin Sensing Operation The device shall support four-terminal Kelvin sensing to improve measurement accuracy by separating current and voltage sensing paths. ### Signal Stability The device shall maintain stable sensing characteristics under varying load and thermal conditions. ### System Integration The component shall support integration into power electronics and embedded control systems requiring precise current feedback. ## Electrical Requirements ### Low Resistance Operation The device shall exhibit very low resistance to minimize power loss and maintain measurement accuracy. ### Thermal Stability The resistor shall maintain consistent electrical behavior under elevated operating temperatures and thermal cycling conditions. ### Power Handling The device shall support operation in high-current environments typical of power conversion and motor control systems. ### Measurement Accuracy The design shall support precise voltage drop measurement proportional to current flow for control and monitoring applications. ## Mechanical Requirements ### Surface Mount Construction The device shall be provided in a surface mount package suitable for automated PCB assembly. ### Structural Integrity The component shall maintain mechanical stability during assembly, operation, and thermal cycling. ### PCB Integration The device shall support direct integration into multilayer printed circuit board designs with optimized current path layout. ## Environmental Requirements ### Operating Conditions The device shall operate reliably under industrial and automotive environmental conditions. ### Thermal Performance The component shall maintain performance stability under continuous electrical loading and heat generation. ### Storage and Handling The device shall maintain physical and electrical integrity during storage, transport, and handling procedures. ## Quality Requirements ### Reliability The device shall provide long-term stability in resistance value and sensing accuracy under continuous operation. ### Verification Electrical, thermal, and mechanical characteristics shall be validated through appropriate testing and qualification procedures. ### Compliance The product shall conform to applicable standards for current sensing resistors used in industrial and automotive electronics. ## Documentation Requirements Technical documentation shall include application guidelines, layout recommendations for Kelvin sensing, thermal considerations, electrical characteristics, and integration practices for power electronics systems. ## Classification Tags #CSS4J4026RL500F #CurrentSenseResistor #ShuntResistor #KelvinSensing #FourTerminalResistor #PowerElectronics #BatteryManagement #MotorControl #PowerSupplyDesign #AnalogSensing #ElectricalEngineering #PCBDesign #EmbeddedSystems #IndustrialElectronics #AutomotiveElectronics #CommonPartsLibrary #ComponentLibrary #EngineeringSpecification #TechnicalDocumentation #HighCurrentSensing #PrecisionMeasurement #CircuitDesign

Bipolar Motor Driver NMOS On/Off, PWM 44-HTSSOP The DRV8262QDDWRQ1 is an automotive-qualified, high-power H-bridge motor driver from Texas Instruments designed for 24 V and 48 V automotive systems. It integrates two H-bridges capable of driving one or two brushed DC motors, a bipolar stepper motor, or thermoelectric coolers (TECs). The device features integrated high-side current sensing, programmable current regulation, and comprehensive protection functions, eliminating the need for external current-sense resistors while reducing PCB area and system cost. It supports wide supply voltages from 4.5 V to 60 V, making it suitable for demanding automotive body electronics and industrial motor control applications. Key Features Automotive AEC-Q100 Grade 1 qualified (-40°C to +125°C) Wide 4.5 V to 60 V operating supply voltage Dual H-bridge or single high-current H-bridge operation Drives: One or two brushed DC motors One bipolar stepper motor One or two thermoelectric coolers (TECs) Up to 8 A peak (dual H-bridge mode) Up to 16 A peak (single H-bridge mode) Low MOSFET on-resistance: 100 mΩ (dual H-bridge) 50 mΩ (single H-bridge) Integrated high-side current sensing with ±4% accuracy Programmable current regulation and current limiting Supports 1.8 V, 3.3 V, and 5 V logic interfaces Configurable PWM control modes (PH/EN or IN/IN) Ultra-low 3 µA sleep current Integrated protection features: Undervoltage Lockout (UVLO) Charge Pump Undervoltage (CPUV) Overcurrent Protection (OCP) Thermal Shutdown (OTSD) Fault output (nFAULT) Functional safety-capable with supporting documentation for automotive system design. #DRV8262QDDWRQ1 #MotorDriver #HBridge #AutomotiveElectronics #BrushedDCMotor #StepperMotor #CurrentSense #AECQ100 #TexasInstruments #EmbeddedSystems #PowerManagement #PCBDesign

Bluetooth, WiFi 802.11b/g/n/ax, Bluetooth v5.4 Transceiver Module 2.4GHz Integrated, Chip Surface Mount Silicon Labs SiWG917 module is our lowest power Wi-Fi 6 plus Bluetooth LE 5.4, ideal for ultra-low power IoT wireless devices using Wi-Fi®, Bluetooth, Matter, and IP networking for secure cloud connectivity. It is optimal for developing battery operated devices that need long battery life. SiWG917 module includes an ultra-low power Wi-Fi 6 plus Bluetooth Low Energy (LE) 5.4 wireless CPU subsystem, and an integrated micro-controller (MCU) application subsystem, security, peripherals and power management subsystem all in a single 16 x 21.1 x 2.3 mm package. The wireless subsystem consists of a multi-threaded Network Wireless Processor (NWP) running up to 160 MHz, baseband digital signal processing, analog front end, 2.4 GHz RF transceiver and integrated power amplifier. The application subsystem consists of an ARM® Cortex®-M4 running up to 180 MHz, embedded SRAM, flash, ultra-low power sensor hub, and matrix vector processor. The ARM® Cortex®-M4 is dedicated for peripheral and application-related processing, while the NWP runs the wireless and networking stacks on independent threads, thus providing a fully integrated solution that is ready for a wide range of embedded wireless IoT applications. The modules come with modular radio type approvals for various countries, including USA (FCC), Canada (IC/ISED) and Japan (MIC), and are in compliance with the relevant EN standards (including EN 300 328 v2.2.2) for the conformity with the directives and regulations in EU and UK. KEY FEATURES • Wi-Fi 6 Single Band 2.4 GHz 20 MHz 1x1 stream IEEE 802.11 b/g/n/ax • Bluetooth LE 5.4 • Single chip Matter Over Wi-Fi Solution • ARM® Cortex® M4 Processor with FPU subsystem up to 180 MHz with rich set of Digital and Analog Peripherals. • Wi-Fi 6 Benefits: TWT for improved efficiency and longer battery life, MUMIMO/OFDMA for Higher Throughput, network capacity and low latency • Best in Class Device and Wireless Security • WLAN Tx power up to +17.5 dBm with integrated PA • Bluetooth LE Tx power up to +17 dBm with integrated PA • WLAN Rx sensitivity as low as -95.5 dBm • Wi-Fi 4 Standby Associated mode current: 71 μA @ 1-second listen interval • Embedded Flash option up to 8 MB/ optional external Flash up to 16 MB • Embedded PSRAM option up to 2 MB/ optional external PSRAM option up to 16 MB • Ultra-low power sensor hub peripherals • Matrix Vector Processor (MVP) • Embedded Wi-Fi, Bluetooth LE, Matter, and networking stacks supporting wireless coexistence • Three software-configurable MCU application memory options for sharing the RAM between the wireless, system, and application (192/256/320 KB) • Operating temperature: -40 to +85 ºC • Operating supply range: 3.0 to 3.63 V • Supply voltage for GPIOs: 1.71 to 3.63 V #WiFi6 #BluetoothLE54 #IoTModule #WirelessSoC #SiliconLabs #EmbeddedSystems #SmartHome #IndustrialIoT #LowPowerDesign #RFModule #ConnectedDevices #EdgeComputing #MatterReady #PCBDesign #ElectronicsEngineering