Accelerometer X, Y, Z Axis ±2g, 4g, 8g 1.5kHz 14-CLCC (6x6) General Description The ADXL355BEZ is a low noise, low drift, low power, three-axis MEMS accelerometer intended for high-precision sensing applications. It delivers high-resolution digital acceleration data with excellent long-term stability and minimal temperature-induced variation. The device integrates a complete sensing chain, including the MEMS sensor element, analog conditioning, analog-to-digital conversion, and digital filtering. Output data is provided through SPI or I²C interfaces, enabling straightforward integration into embedded and industrial systems. Key Features Three-axis acceleration sensing (X, Y, Z) Selectable full-scale ranges: ±2 g, ±4 g, ±8 g Low noise density (~25 µg/√Hz) Low offset and minimal temperature drift High-resolution 20-bit digital output Integrated digital filtering SPI and I²C communication interfaces Low power consumption (~200 µA typical) Wide supply voltage range (2.25 V to 3.6 V) Integrated temperature sensor Hermetically sealed package Applications Structural health monitoring Vibration measurement and analysis Tilt and inclination sensing Industrial condition monitoring Navigation and inertial systems Seismic detection Robotics and stabilization platforms Functional Description The ADXL355BEZ includes an integrated sensing and processing architecture composed of: Three-axis MEMS sensing element Analog front-end signal conditioning High-resolution ADC Digital filtering and decimation stages Temperature sensing element Digital communication interface (SPI/I²C) Configuration and control registers Electrical Characteristics (Typical) Supply voltage: 2.25 V to 3.6 V Supply current: ~200 µA Output data rate: up to 4 kHz Noise density: ~25 µg/√Hz Resolution: 20-bit Interface: SPI / I²C Mechanical and Package Information Package type: LGA (Land Grid Array) Approximate dimensions: 3 mm × 5 mm × 1 mm Hermetically sealed for improved environmental robustness Interface and Communication Supports SPI (4-wire) and I²C protocols Outputs 20-bit acceleration data per axis Data format: two’s complement Measurement Ranges ±2 g ±4 g ±8 g Environmental Specifications Operating temperature range: -40°C to +125°C Storage temperature range: -55°C to +150°C Power Management Supports measurement and standby modes Designed for low-power operation in continuous sensing applications Compliance and Reliability Industrial-grade device Designed for long-term stability RoHS compliant #commonpartslibrary #sensor #accelerometer

Temperature Sensor Digital, Local -40°C ~ 125°C 10 b 8-MSOP The MCP9808T-E/MS is a high-accuracy digital temperature sensor developed by Microchip Technology for precision thermal monitoring applications. The device communicates through a standard I²C-compatible serial interface and is optimized for low-power embedded systems requiring accurate ambient temperature measurement. It integrates internal temperature sensing, analog-to-digital conversion, programmable alert functionality, and configurable power management within a compact MSOP package. The sensor is designed for applications including industrial monitoring, consumer electronics, IoT devices, thermal management systems, medical instrumentation, and battery-powered portable equipment. Its low operating current and shutdown capability make it suitable for energy-efficient systems where thermal accuracy and minimal power consumption are critical. The device supports programmable temperature limits and interrupt generation for over-temperature events, enabling autonomous thermal supervision without continuous host processor intervention. The MCP9808T-E/MS maintains high measurement accuracy across a wide operating temperature range and offers stable digital output without requiring external calibration components. Electrical Characteristics Supply voltage operation supports low-voltage and standard logic systems. Low operating current enables efficient continuous monitoring. Shutdown mode significantly reduces power consumption during inactive periods. Digital I²C interface supports standard and fast communication modes. Integrated temperature conversion engine provides direct digital temperature output. Temperature Sensing Features High-accuracy ambient temperature measurement. Wide operating temperature range suitable for industrial environments. Programmable resolution for balancing conversion speed and precision. Configurable upper, lower, and critical temperature alert thresholds. Integrated hysteresis control for stable thermal event detection. Communication Interface I²C-compatible serial communication interface. Configurable slave addressing for multi-device bus operation. Supports read and write access to internal configuration registers. Compatible with common microcontrollers and embedded processors. Functional Features Integrated alert output for thermal event signaling. Programmable interrupt and comparator operating modes. Internal registers support temperature monitoring and device configuration. Power-on reset circuitry ensures predictable startup behavior. Device identification registers support system-level verification. Mechanical Characteristics Package type is MSOP with compact surface-mount footprint. Suitable for automated PCB assembly processes. RoHS-compliant and lead-free manufacturing. Typical Applications Industrial temperature monitoring systems. Portable battery-powered electronics. Embedded microcontroller systems. Thermal protection and supervision circuits. Consumer and IoT sensing devices. Medical and laboratory instrumentation. #CommonPartsLibrary #Sensor #Transducer #Temperature-Sensor #MCP9808

Single Phase Multifunction Metering IC with Neutral Current Measurement 28-LFCSP-WQ (5x5) #CommonPartsLibrary #IntegratedCircuit #PowerManagement #Energy-metering #ADE7953

Connector Header Through Hole 18 position 0.100" (2.54mm) # TSW-118-07-G-S ## General Description The TSW-118-07-G-S is a through-hole board-to-board and wire-to-board interconnect header manufactured by Samtec. It belongs to the TSW series of standard terminal strip headers designed for reliable signal transmission in electronic assemblies, embedded systems, industrial controls, telecommunications equipment, instrumentation, and general-purpose printed circuit board applications. The component features precision-machined contacts, robust mechanical construction, and compatibility with a wide range of mating connectors. Its design supports secure electrical connections while maintaining excellent durability during repeated mating cycles and long-term operation in demanding environments. ## Key Features ### Mechanical Characteristics * Through-hole mounting configuration * Single-row terminal strip header design * Straight vertical orientation * Precision-machined contact system * High-reliability board-level interconnection ### Contact System * Gold-plated contact surface * Enhanced conductivity and signal integrity * Corrosion-resistant contact finish * Suitable for repeated insertion and removal cycles ### Electrical Characteristics * Low contact resistance * Reliable signal transmission * Suitable for low-power and signal-level applications * Stable electrical performance across operating conditions ### Material Construction * High-temperature thermoplastic insulator * Durable metallic contact structure * RoHS-compliant materials * Lead-free manufacturing compatibility ### Environmental Characteristics * Industrial-grade operating capability * Resistant to mechanical wear during mating cycles * Suitable for automated and manual assembly processes ### Application Areas * Embedded Systems * Microcontroller Development Boards * Industrial Automation Equipment * Telecommunications Hardware * Test and Measurement Instruments * Medical Electronics * Data Acquisition Systems * Prototyping Platforms * Consumer Electronic Devices * PCB Interconnection Applications ### Compliance * RoHS Compliant * Lead-Free Compatible * Industry-standard connector footprint ## Manufacturer Samtec Inc. ## Product Family TSW Series Terminal Strip Headers #Samtec #TSW11807GS #TerminalStripHeader #PCBConnector #BoardToBoardConnector #WireToBoardConnector #ElectronicsComponents #EmbeddedSystems #IndustrialElectronics #InterconnectSolutions #ThroughHoleConnector #ElectronicDesign #HardwareEngineering #PCBAssembly #CommonPartsLibrary #Connector #Header #TSW pin header 1x18 2.54mm

Battery Battery Monitor IC Lithium Ion 9-DSBGA The BQ27220YZFR is a highly integrated single-cell battery fuel gauge IC developed for rechargeable lithium-ion and lithium-polymer battery applications. The device utilizes Texas Instruments’ Impedance Track™ algorithm to provide highly accurate battery capacity measurement, state-of-charge estimation, runtime prediction, and battery health monitoring across varying load and temperature conditions. The device is designed for compact portable electronics, wearable devices, IoT products, handheld instruments, and low-power embedded systems requiring precise battery monitoring and extended operating life. The BQ27220YZFR supports system-side fuel gauging without requiring battery pack-side electronics, simplifying battery integration and reducing overall system cost. The fuel gauge continuously monitors battery voltage, current, and temperature to estimate available capacity, remaining runtime, full charge capacity, and state-of-health information. Integrated low-power operation enables ultra-low standby current consumption suitable for always-on battery-powered products. Communication with the host processor is implemented through a standard I²C interface, allowing configuration access, telemetry reporting, and battery parameter monitoring. The device also integrates protection and alert functionality through programmable interrupt outputs and battery condition monitoring features. The BQ27220YZFR is optimized for use with single-cell lithium-based chemistries and supports learning cycles for adaptive battery characterization over product lifetime. Internal data flash memory stores battery profile information and calibration parameters to improve long-term gauging accuracy. The device is supplied in a compact lead-free wafer chip-scale package suitable for space-constrained PCB designs and portable electronics requiring minimal footprint and low-profile assembly. Electrical Characteristics Device Type Single-cell battery fuel gauge and battery monitor IC Battery Chemistry Support Lithium-ion and lithium-polymer rechargeable batteries Input Voltage Range Supports single-cell battery operation Fuel Gauging Method Impedance Track™ algorithm Communication Interface I²C serial interface Measurement Functions Battery voltage monitoring Battery current monitoring Battery temperature monitoring State-of-charge estimation Remaining capacity calculation Full charge capacity estimation State-of-health reporting Runtime prediction Power Consumption Ultra-low operating current for portable applications Temperature Monitoring External thermistor support Host Alert Features Interrupt and alert reporting capability Data Storage Integrated nonvolatile configuration memory Calibration Features Automatic learning and battery characterization support Protection Monitoring Battery condition and system monitoring functions Package Type DSBGA wafer chip-scale package Mounting Style Surface mount Operating Temperature Range Industrial temperature operation suitable for portable electronics Functional Features High-accuracy fuel gauging over battery lifetime Adaptive battery modeling and aging compensation Low-power operation for battery-powered systems Integrated battery profiling capability Real-time remaining runtime estimation Automatic battery learning cycles Compact PCB footprint for portable devices System-side implementation without smart battery pack requirement Programmable battery alert functionality Support for low-power embedded processors and mobile systems Optimized for wearable and IoT applications RoHS compliant and lead-free package construction #commonpartslibrary #integratedcircuit #powermanagement #batterymanagement

Power Supply Controller Digital Power Monitor 10-VSSOP The INA228AIDGSR is a high-precision digital power monitor and current-sense amplifier designed for accurate measurement of shunt voltage, bus voltage, current, power, energy, and charge in DC power systems. The device integrates a low-offset differential amplifier with high-resolution analog-to-digital converters and supports bidirectional current sensing across a wide common-mode voltage range. Communication is provided through an I²C- and SMBus-compatible digital interface, enabling direct telemetry integration into embedded control and battery management systems. The device is optimized for high-accuracy power monitoring applications requiring low drift, low offset, and high dynamic range. Integrated mathematical computation functions reduce host processor overhead by internally calculating current, power, accumulated energy, and charge values. Programmable conversion timing and averaging modes allow optimization between measurement speed and noise performance. The INA228AIDGSR is suitable for server power distribution, industrial automation, telecom infrastructure, automotive subsystems, battery-powered equipment, and precision instrumentation requiring real-time power analytics and fault monitoring. Engineering Specification Device Type Digital power monitor with integrated current-sense amplifier and high-resolution ADC. Measurement Functions Supports measurement of: Differential shunt voltage Bus voltage Current Power Energy accumulation Charge accumulation Temperature through external sensing methods Current Sensing Supports bidirectional current measurements using an external shunt resistor with programmable calibration scaling. ADC Architecture Incorporates high-resolution delta-sigma analog-to-digital converters with programmable conversion time and averaging configuration. Interface Uses I²C- and SMBus-compatible serial communication interface with programmable device addressing. Voltage Monitoring Supports high-side and low-side sensing across a wide common-mode input voltage range suitable for multi-rail power systems. Accuracy Features Includes: Low input offset voltage Low offset drift Precision gain architecture High measurement linearity Integrated calibration engine Power Computation Internally computes: Instantaneous power Average power Energy accumulation over time Charge accumulation over time Alert and Protection Features Provides programmable alert functionality for: Overcurrent Undervoltage Overvoltage Power threshold violations Conversion-ready indication Operating Modes Supports: Continuous conversion mode Triggered conversion mode Low-power shutdown mode Package Information Supplied in a compact VSSOP surface-mount package suitable for automated PCB assembly and space-constrained applications. Temperature Range Designed for operation across industrial temperature environments suitable for embedded and power-management systems. Typical Applications Battery management systems Power supply monitoring Server and telecom power rails Industrial control systems DC energy metering Embedded power analytics Automotive electronics Portable instrumentation #commonpartslibrary #integratedcircuit #powermanagement #powersupplycontroller

Accelerometer, Gyroscope, 6 Axis Sensor I2C, I3C, SPI Output The BMI323 is a low-power, high-performance inertial measurement unit developed by Bosch Sensortec. It integrates a three-axis accelerometer and a three-axis gyroscope within a compact surface-mount package intended for motion sensing applications requiring precise movement detection, orientation tracking, vibration monitoring, and activity recognition. The device is optimized for wearable electronics, industrial sensing, robotics, navigation systems, IoT devices, and consumer electronics where low power consumption and high motion accuracy are critical. The sensor includes advanced digital signal processing, configurable motion-detection features, programmable interrupts, and integrated FIFO buffering to reduce host processor workload and improve system efficiency. Communication is supported through standard digital interfaces, enabling straightforward integration with microcontrollers and embedded platforms. The BMI323 is designed for robust environmental performance and supports flexible power management modes suitable for battery-operated systems. Engineering Specifications Device Type Six-axis inertial measurement unit consisting of: Three-axis accelerometer Three-axis gyroscope Manufacturer Bosch Sensortec Package Compact LGA surface-mount package suitable for automated assembly processes. Accelerometer Characteristics Supports multiple selectable full-scale measurement ranges for motion and acceleration sensing applications. Provides high-resolution digital output with configurable filtering and sampling parameters for low-noise operation and accurate motion analysis. Gyroscope Characteristics Integrated three-axis angular rate sensor with programmable measurement ranges and digital filtering capabilities. Designed for rotational movement tracking, stabilization, gesture recognition, and inertial navigation applications. Digital Interfaces Supports: I²C serial communication SPI serial communication I3C compatible operation Power Features Designed for ultra-low power operation with multiple configurable power modes to optimize energy consumption for portable and battery-powered devices. Embedded Features Includes integrated: FIFO data buffering Motion detection engine Activity and inactivity detection Tap and gesture detection Orientation and tilt sensing Interrupt generation Self-test functionality Output Data Handling Provides configurable output data rates, oversampling settings, and digital filtering options for balancing performance, bandwidth, and power consumption. Temperature Performance Integrated temperature sensing and compensation support for improved measurement stability across varying environmental conditions. Interrupt System Programmable interrupt outputs support event-driven system architectures and allow efficient host wake-up functionality. Operating Environment Designed for operation across industrial and consumer temperature ranges with stable sensor performance under dynamic motion conditions. Applications Suitable for: Wearable devices Smart watches Fitness trackers Industrial motion monitoring Robotics Drones Navigation systems Gaming controllers AR/VR systems IoT motion sensing Human-machine interfaces #commonpartslibrary #integratedcircuit #accelerometer #sensor

Current Sense Amplifier 1 Circuit Single-Ended SOT-23-6 The INA187A3IDBVR is a precision high-side and low-side current sense amplifier designed for accurate bidirectional current measurement in power management, motor control, battery monitoring, and industrial sensing applications. The device integrates a matched precision gain stage optimized for shunt resistor voltage amplification while maintaining excellent common-mode rejection and low offset drift. It supports wide common-mode input voltages, enabling current monitoring across supply rails in automotive, industrial, and embedded systems. The amplifier features fast response characteristics, low quiescent current consumption, and a compact surface-mount package suitable for space-constrained designs. Engineering Specification Device Type Precision Current Sense Amplifier Manufacturer Texas Instruments Manufacturer Part Number INA187A3IDBVR Amplifier Configuration Current shunt monitor with fixed gain Gain Variant High fixed gain configuration optimized for low-value shunt resistor sensing Input Measurement Capability Bidirectional current sensing Common-Mode Voltage Range Supports high-side and low-side sensing across wide supply rails Input Offset Characteristics Low offset voltage with low temperature drift for accurate current measurement Bandwidth Performance Wide bandwidth suitable for dynamic load and transient current monitoring Response Time Fast settling and propagation performance for real-time current feedback systems Power Supply Requirements Single-supply operation compatible with low-voltage logic systems Output Type Analog voltage output proportional to sensed shunt voltage Common-Mode Rejection High common-mode rejection ratio for stable operation in noisy environments Temperature Performance Industrial operating temperature range with stable gain accuracy over temperature Protection Features Robust input structure designed for high common-mode environments Package Type SOT-23 surface-mount package Mounting Method Surface mount technology Typical Applications Battery management systems, power distribution monitoring, motor current feedback, DC/DC converter monitoring, industrial automation, telecom power systems, and embedded power diagnostics. #commonpartslibrary #integratedcircuit #currentsenseamplifier

Accelerometer X, Y, Z Axis ±2g, 4g, 8g, 16g 0.5Hz ~ 625Hz 16-LGA (3x3) # LIS3DHTR ## General Description The LIS3DHTR is an ultra-low-power three-axis digital accelerometer manufactured by STMicroelectronics. It is designed to provide accurate motion, orientation, tilt, vibration, and acceleration sensing for a wide range of embedded and portable electronic applications. The device integrates advanced MEMS sensor technology, configurable measurement ranges, embedded motion-detection functions, and digital communication interfaces within a compact surface-mount package. Its low power consumption and high measurement accuracy make it suitable for wearable devices, industrial monitoring systems, asset tracking equipment, smart sensors, consumer electronics, medical devices, Internet of Things products, and battery-powered embedded systems. ## Key Features ### Sensor Architecture * Three-axis digital accelerometer * MEMS sensing technology * High-resolution motion measurement * Multi-axis acceleration detection * Real-time movement monitoring * Precision orientation sensing ### Measurement Capabilities * Motion detection functionality * Tilt sensing capability * Free-fall detection support * Vibration monitoring * Orientation recognition * Impact and shock detection * Activity and inactivity monitoring ### Electrical Characteristics * Ultra-low-power operation * Low current consumption * High measurement stability * Fast response capability * Reliable sensor performance * Optimized for battery-powered systems ### Embedded Processing Features * Integrated interrupt generation * Event detection capability * Motion recognition support * Threshold-based monitoring * Embedded motion-processing functions * Autonomous event reporting ### Communication Interfaces * SPI digital communication interface * I²C digital communication interface * Easy microcontroller integration * Reliable data transfer capability * Flexible system connectivity ### Package Characteristics * Compact surface-mount package * Low-profile design * Automated assembly compatible * High-density PCB layout support * Suitable for space-constrained applications ### Material Construction * Advanced MEMS sensor technology * High-reliability semiconductor integration * RoHS-compliant materials * Lead-free package construction * Industrial-grade manufacturing quality ### Environmental Characteristics * Long operational service life * Reliable operation under industrial conditions * Stable sensor performance over time * Resistant to mechanical stress and vibration * Suitable for continuous monitoring applications ### Application Areas * Wearable Electronics * Internet of Things Devices * Smart Sensors * Asset Tracking Systems * Industrial Monitoring Equipment * Consumer Electronics * Medical Devices * Portable Electronics * Motion Detection Systems * Vibration Monitoring Equipment * Fitness and Activity Tracking Devices * Embedded Control Systems ### Compliance * RoHS Compliant * Lead-Free Compatible * Industrial-Grade MEMS Motion Sensor Solution ## Manufacturer STMicroelectronics ## Product Family LIS3DH Three-Axis Digital Accelerometer Series #LIS3DHTR #STMicroelectronics #Accelerometer #MEMSSensor #MotionSensor #ThreeAxisAccelerometer #IoT #WearableDevices #EmbeddedSystems #IndustrialMonitoring #AssetTracking #VibrationMonitoring #ConsumerElectronics #ElectronicsEngineering #SensorTechnology

MCP3913 Series 3.6 V 4.5 mA SMT Six-Channel Analog Front End - SSOP-28 The MCP3913A1T-E/SS is a high-performance, multi-channel analog front-end (AFE) from Microchip Technology intended for precision measurement applications. It features six simultaneous sampling 24-bit delta-sigma ADCs with integrated programmable gain amplifiers, enabling accurate acquisition of low-level analog signals. Designed for energy monitoring and industrial sensing, the device provides low noise, high dynamic range, and flexible configuration. It supports SPI communication for efficient interfacing with microcontrollers and digital processing systems. Key Features Six simultaneous sampling 24-bit delta-sigma ADC channels Integrated programmable gain amplifiers per channel High signal-to-noise ratio and low distortion Programmable oversampling ratios for performance tuning Internal voltage reference with external reference option SPI-compatible digital interface Configurable data output formats and control registers Low power operation modes Electrical Characteristics Resolution: 24-bit Number of Channels: 6 Input Configuration: Differential Supply Voltage: 2.7V to 3.6V Operating Temperature Range: -40°C to +125°C Programmable Gain: Up to 32 V/V (typical) Reference Voltage: Internal or external selectable Functional Description The device integrates six high-resolution delta-sigma ADCs that sample input signals simultaneously, ensuring accurate phase and timing relationships across channels. Each input passes through a programmable gain stage, allowing optimization for different sensor levels. Analog signals are digitized using oversampling and digital filtering techniques to achieve high precision and noise reduction. Configuration is handled via internal registers, and data is transferred through an SPI interface. Package Information Package Type: SSOP Pin Count: 28 Mounting Type: Surface Mount Applications Energy metering Power monitoring systems Industrial automation Multi-channel data acquisition Sensor interfacing Smart grid systems Advantages High integration reduces external components Simultaneous sampling improves measurement accuracy High resolution supports precise signal analysis Flexible configuration for various system requirements #commonpartslibrary #integratedcircuit #powermanagement #energymetering

Pressure Sensor 4.35PSI ~ 18.13PSI (30kPa ~ 125kPa) Absolute 10-WFLGA The BMP581 is a high-precision digital barometric pressure sensor designed for altitude tracking, environmental monitoring, navigation, weather sensing, and industrial measurement applications. It integrates a MEMS pressure sensing element with a low-noise analog front end and digital signal processing to deliver highly accurate pressure and temperature measurements over a wide operating range. The device supports low-power operation, making it suitable for portable, battery-powered, and always-on sensing systems. The sensor communicates through standard digital interfaces and includes configurable sampling, filtering, and interrupt features for flexible system integration. Its compact package enables use in space-constrained embedded designs such as wearables, mobile devices, drones, smart home systems, IoT devices, and industrial instrumentation. Engineering Specification Device Type Digital barometric pressure and temperature sensor Manufacturer Bosch Sensortec Pressure Measurement High-resolution absolute pressure measurement with integrated temperature compensation Temperature Measurement Integrated digital temperature sensing for environmental monitoring and pressure compensation Pressure Range Wide atmospheric pressure sensing range suitable for altitude and environmental applications Interface Support I²C and SPI digital communication interfaces Supply Voltage Low-voltage operation optimized for embedded and portable systems Power Consumption Ultra-low power modes with configurable performance and sampling settings Measurement Features Oversampling support with programmable output data rate and internal filtering Accuracy High absolute and relative pressure accuracy for precise altitude estimation and environmental sensing Noise Performance Low-noise sensor architecture for stable pressure readings and improved altitude resolution Interrupt Features Configurable interrupt generation for data-ready and threshold-based events FIFO Support Integrated FIFO buffering for efficient sensor data management Operating Temperature Industrial temperature operating capability for consumer and industrial environments Package Type Compact surface-mount package optimized for small PCB footprint designs Applications Altitude tracking, indoor navigation, weather stations, drones, wearable electronics, IoT sensing, HVAC systems, industrial monitoring, and portable devices #CommonPartsLibrary #Sensor #Transducer #PressureSensor

Temperature Sensor Digital, Local -40°C ~ 125°C 16 b 4-DFN (1.5x1.5) STS40-CD1B-R3 is a high-accuracy digital temperature sensor from Sensirion, designed for precise temperature monitoring in space-constrained and low-power applications. Part of the STS4x series, it features a fully calibrated temperature sensing element with an I²C digital interface, providing reliable measurements over a wide operating temperature range. Its ultra-compact 4-DFN package makes it ideal for IoT devices, wearables, consumer electronics, industrial controls, and battery-powered systems. Key Features High-accuracy temperature measurement (±0.2°C typical at 25°C) Wide operating temperature range: -40°C to +125°C Digital I²C interface for easy MCU integration 16-bit temperature resolution Low operating voltage: 1.08 V to 3.6 V Factory calibrated and linearized output Ultra-small 1.5 mm × 1.5 mm DFN package Low power consumption suitable for battery-powered devices Surface-mount package for automated assembly Robust performance for industrial and consumer applications #STS40 #STS40CD1BR3 #Sensirion #TemperatureSensor #DigitalSensor #I2C #EmbeddedSystems #IoT #IndustrialAutomation #WearableElectronics #EnvironmentalMonitoring #ElectronicsDesign

16 Bit Digital to Analog Converter 1 10-VSSOP The DAC80501MDGSR is a high-precision, single-channel digital-to-analog converter developed by Texas Instruments for industrial, instrumentation, and embedded control applications requiring accurate voltage output generation. The device integrates a low-drift voltage reference, precision output buffer, and serial peripheral interface communication into a compact low-power solution optimized for high-resolution signal generation. Designed for applications such as programmable power supplies, process control systems, automated test equipment, and sensor calibration, the device delivers excellent linearity, low noise performance, and stable output characteristics across varying environmental conditions. The integrated architecture minimizes external component requirements while maintaining high accuracy and long-term reliability. The converter supports rail-to-rail output operation and offers flexible reference configurations to accommodate different system architectures. Its SPI-compatible digital interface enables straightforward integration with microcontrollers, processors, and FPGA-based systems. Electrical Characteristics The device operates from a single analog supply and supports precision voltage output generation with monotonic performance across the full operating range. Integrated precision reference circuitry provides low temperature drift and stable output characteristics suitable for high-accuracy measurement and control systems. Low glitch energy, low offset error, and low gain error characteristics improve output stability during code transitions. The output amplifier is capable of driving moderate capacitive loads while maintaining signal integrity and settling performance. Interface and Control Communication is implemented through a high-speed SPI-compatible serial interface supporting standard synchronous digital communication protocols. The interface allows direct programming of DAC output codes and internal configuration registers. The device supports daisy-chain capable serial communication architecture for simplified expansion in multi-device systems. Internal registers provide control of reference operation, power management, and output configuration functions. Power Management The DAC80501MDGSR incorporates low-power operating modes intended for energy-sensitive applications. Integrated power-down functionality reduces current consumption during inactive system states while preserving configuration integrity. Internal circuitry is optimized for low quiescent current operation without compromising output precision or dynamic response performance. Package Information The device is supplied in a compact VSSOP surface-mount package suitable for space-constrained industrial and embedded designs. The package configuration supports automated assembly processes and standard PCB manufacturing techniques. Typical Applications Typical applications include industrial automation, programmable voltage sources, data acquisition systems, sensor simulation, instrumentation equipment, motor control systems, and precision calibration platforms. The device is particularly suitable for systems requiring stable and repeatable analog voltage generation with minimal external circuitry. #commonpartslibrary #integratedcircuit #analog #digital #converter

Accelerometer X, Y, Z Axis ±2g, 4g, 8g, 16g 0.05Hz ~ 1.6kHz 14-LGA (3x5) The ADXL345-EP is an extended performance version of the ADXL345, which is a small, thin, ultralow power, 3-axis accelerometer with high resolution (13-bit) measurement at up to ±16 g. Digital output data is formatted as 16-bit twos complement and is accessible through either a SPI (3- or 4-wire) or I2 C digital interface. The ADXL345-EP is well suited for extended temperature range industrial and aerospace equipment. It measures the static acceleration of gravity in tilt-sensing applications, as well as dynamic acceleration resulting from motion or shock. Its high resolution (3.9 mg/LSB) enables measurement of inclination changes less than 1.0°. Several special sensing functions are provided. Activity and inactivity sensing detect the presence or lack of motion by comparing the acceleration on any axis with user-set thresholds. Tap sensing detects single and double taps in any direction. Freefall sensing detects if the device is falling. These functions can be mapped individually to either of two interrupt output pins. An integrated memory management system with a 32-level first in, first out (FIFO) buffer can be used to store data to minimize host processor activity and lower overall system power consumption. Low power modes enable intelligent motion-based power management with threshold sensing and active acceleration measurement at extremely low power dissipation. The ADXL345-EP is supplied in a small, thin, 3 mm × 5 mm × 1 mm, 14-lead, enhanced plastic package. Ultralow power: as low as 23 µA in measurement mode and 0.1 µA in standby mode at VS = 2.5 V (typical) Power consumption scales automatically with bandwidth User-selectable resolution from 10 to 13 bits 4 mg/LSB scale factor in all g ranges 32-sample FIFO minimizes host processor load Single tap, double tap, and free-fall detection Activity/inactivity monitoring Supply voltage range: 2.0 V to 3.6 V I/O voltage range: 1.7 V to VS SPI (3- and 4-wire) and I2C digital interfaces Flexible interrupt modes mappable to either interrupt pin Measurement ranges selectable via serial command Bandwidth selectable via serial command 10,000 g shock survival Pb free/RoHS compliant #commonpartslibrary #integratedcircuit #accelerometer

Thermal Image Sensor 32H x 24V TO-39 # MLX90640ESF-BAB-000-TU Engineering Specifications **General Description** The MLX90640ESF-BAB-000-TU is a contactless infrared thermal imaging sensor manufactured by Melexis. It incorporates a microbolometer array that detects infrared radiation emitted by objects and converts the captured thermal energy into temperature data, enabling the creation of thermal images without physical contact. The device is designed for compact and cost-effective thermal imaging applications, offering high thermal sensitivity and accurate temperature measurement capabilities. It integrates a digital signal-processing engine, calibration data memory, and a digital communication interface, allowing direct connection to microcontrollers, embedded systems, and industrial monitoring equipment. The sensor provides real-time thermal mapping across its field of view and is suitable for applications involving human presence detection, predictive maintenance, industrial automation, smart building systems, medical screening, consumer electronics, robotics, and thermal monitoring solutions. Its factory calibration ensures stable performance throughout its operating life while minimizing external calibration requirements. **Engineering Specifications** **Manufacturer:** Melexis **Manufacturer Part Number:** MLX90640ESF-BAB-000-TU **Component Type:** Infrared thermal imaging sensor **Sensor Technology:** Microbolometer thermal sensor array **Measurement Method:** Non-contact infrared temperature sensing **Output Type:** Digital thermal image data **Communication Interface:** I²C-compatible serial interface **Temperature Measurement Capability:** Object temperature monitoring and thermal imaging **Thermal Imaging Function:** Real-time thermal map generation **Integrated Processing:** On-chip signal processing and calibration management **Calibration:** Factory calibrated with stored calibration parameters **Power Supply Configuration:** Single-supply operation **Power Consumption:** Optimized for low-power embedded applications **Refresh Rate:** Programmable thermal frame refresh operation **Thermal Sensitivity:** High-sensitivity infrared detection **Field of View Variant:** Wide-angle thermal imaging configuration **Accuracy Characteristics:** High-precision temperature measurement with integrated compensation algorithms **Memory Features:** Internal EEPROM for calibration coefficients **Operating Mode:** Continuous and programmable thermal acquisition **Data Output Format:** Digital temperature and thermal pixel information **Environmental Stability:** Designed for reliable operation across varying ambient conditions **Electromagnetic Compatibility:** Suitable for embedded and industrial electronic systems **Package Type:** Surface-mount package with infrared-transparent window **Mounting Style:** Surface mount technology **Package Construction:** Reflow-solderable assembly **Lead Finish:** Lead-free finish **Environmental Compliance:** RoHS compliant and halogen-free **Reliability Features:** Factory-tested and production-calibrated thermal imaging device **Typical Applications** Thermal cameras Human presence detection systems Occupancy monitoring Industrial predictive maintenance Electrical equipment inspection Smart building automation HVAC monitoring systems Medical screening devices Consumer electronics Robotics and autonomous systems Fire detection and prevention systems Industrial process monitoring Energy management systems Automotive thermal sensing applications Security and surveillance equipment #MLX90640 #MLX90640ESF #Melexis #ThermalSensor #InfraredSensor #ThermalImaging #Microbolometer #TemperatureSensor #IndustrialAutomation #EmbeddedSystems #IoT #PredictiveMaintenance #SmartBuilding #ThermalCamera #ElectronicComponents #EngineeringSpecifications

1 mOhms ±1% 4W Chip Resistor Nonstandard Automotive AEC-Q200, Current Sense Metal Element Bourns Inc. CSS4J-4026R-1L00F is a high-power surface-mount current sense resistor designed for accurate current measurement in power electronics applications. It belongs to the CSS4J-4026 series and uses a metal element construction that provides low resistance, high power handling, and excellent stability for automotive and industrial applications. This device features a 1 mΩ resistance value, ±1% tolerance, and 4 W power rating, making it suitable for monitoring high-current paths while minimizing measurement losses. It is also qualified for AEC-Q200 automotive applications and operates across a wide temperature range. Key Features Component Type: SMD Current Sense Resistor (Metal Element / Metal Strip) Resistance Value: 1 mΩ (0.001 Ω) Resistance Tolerance: ±1% Power Rating: 4 W Package Size: 4026 (approx. 10.06 mm × 6.60 mm) Number of Terminals: 4 terminals (Kelvin sensing configuration) Temperature Coefficient: approximately ±75 ppm/°C Operating Temperature Range: −55°C to +170°C Construction: Metal element current shunt resistor for accurate current measurement Qualification: Automotive AEC-Q200 compliant Typical Applications Battery Management Systems (BMS) EV and automotive power systems Motor control circuits Power supplies and DC/DC converters Overcurrent monitoring and protection circuits Industrial power monitoring equipment #CommonPartsLibrary #Bourns #CSS4J4026 #CurrentSenseResistor #ShuntResistor #MetalElementResistor #AECQ200 #PowerElectronics #BatteryManagementSystem #EVElectronics #SMTComponents #PCBDesign

1000 pF ±10% 2000V (2kV) Ceramic Capacitor X7R 1808 (4520 Metric) ## Engineering Specification ## General Description The **C4520X7R3D102K130KE** is a TDK multilayer ceramic chip capacitor designed for high-voltage surface-mount applications. It uses X7R dielectric material and is suitable for circuits requiring stable ceramic capacitance, compact PCB mounting, and reliable high-voltage performance. The component is commonly used in power supplies, filtering circuits, coupling circuits, snubber networks, voltage multiplier circuits, and general electronic assemblies requiring a high-voltage MLCC solution. ## Device Identification Manufacturer Part Number: **C4520X7R3D102K130KE** Manufacturer: **TDK Corporation** Product Series: **C Series** Device Category: **Passive Electronic Component** Device Type: **Multilayer Ceramic Chip Capacitor** Capacitor Type: **Surface-Mount MLCC** Application Grade: **Commercial Grade** ## Functional Description The device functions as a fixed-value ceramic capacitor for energy storage, noise suppression, coupling, decoupling, and filtering applications. It is designed to provide capacitance in a compact surface-mount package while supporting high-voltage operation. The X7R dielectric provides usable capacitance stability across a wide operating temperature range, making the component suitable for many general-purpose and power-related electronic designs. ## Electrical Description The capacitor has a nominal capacitance of **1000 pF** with **±10% tolerance** and a rated voltage of **2000 V DC**. It uses **X7R dielectric characteristics**, making it suitable for applications where moderate capacitance stability and high-voltage capability are required. The device should be operated within the manufacturer’s specified electrical limits to maintain reliability and performance. ## Mechanical Description The component is supplied in a **C4520 metric package**, equivalent to **EIA 1808** chip size. It is designed for surface-mount PCB installation using reflow soldering. The package includes soft termination construction, which helps reduce mechanical stress on the ceramic body and solder joints during board flexing or thermal cycling. ## Material and Construction Description The device is constructed as a multilayer ceramic capacitor using ceramic dielectric layers and internal electrode structures. The soft termination design improves board-level reliability by helping absorb mechanical strain between the PCB and capacitor body. This construction is useful in applications where vibration, thermal expansion, or board bending may affect component reliability. ## Mounting and Assembly Description The capacitor is intended for surface-mount assembly using reflow soldering. PCB land pattern, solder paste volume, component placement, and reflow profile should follow TDK recommendations. Proper spacing, voltage clearance, and creepage considerations should be applied because the component is used in high-voltage circuits. ## Application Suitability The **C4520X7R3D102K130KE** is suitable for high-voltage filtering, DC blocking, coupling, decoupling, power supply circuits, snubber circuits, inverter circuits, lighting equipment, industrial electronics, measurement equipment, and general PCB assemblies requiring a compact high-voltage ceramic capacitor. ## Design Considerations The design should account for rated voltage, capacitance tolerance, DC bias behavior, temperature characteristics, insulation resistance, soldering conditions, mechanical stress, board flex, creepage distance, and clearance distance. For high-voltage applications, PCB layout should provide adequate spacing and avoid contamination paths that may reduce insulation performance. The capacitor should not be used beyond the manufacturer’s specified electrical, thermal, or mechanical limits. ## Hashtags #commonpartslibrary #capacitor #ceramiccapacitor #mlcc #tdk #tdkcapacitor #cseries #c4520 #x7r #highvoltagecapacitor #smdcapacitor #surfacemount #passivecomponent #electronicparts #electronicscomponents #pcbdesign #hardwaredesign #powersupply #filteringcircuit #snubbercircuit #decouplingcapacitor #industrialelectronics #componentlibrary #engineeringparts #electronicsengineering

Per-Pin Parametric Measurement Unit (PPMU) 80-TQFP-EP (12x12) #CommonPartsLibrary #IntegratedCircuit #AD5522

ARM® Cortex®-M0+ MSPM0 C Microcontroller IC 32-Bit 24MHz 16KB (16K x 8) FLASH 8-DSBGA (0.86x1.6) MSPM0C110x microcontrollers (MCUs) are part of the MSP highly-integrated ultra-low-power 32-bit MCU family based on the enhanced Arm® Cortex®-M0+ core platform operating at up to 24MHz frequency. These costoptimized MCUs offer high-performance analog peripheral integration, support extended temperature ranges from -40°C to 125°C, and operate with supply voltages from 1.62V to 3.6V. The MSPM0C110x devices provide up to 16KB embedded flash program memory with 1KB SRAM. These MCUs incorporate a high-speed on-chip oscillator with an accuracy from -2% to +1.2%, eliminating the need for an external crystal. Additional features include a 1-channel DMA, CRC-16 accelerator, and a variety of highperformance analog peripherals such as one 12-bit 1.5Msps ADC with VDD as the voltage reference, and an on-chip temperature sensor. These devices also offer intelligent digital peripherals such as one 16-bit advanced timer, two 16-bit general purpose timer, one windowed watchdog timer, and a variety of communication peripherals including one UART, one SPI, and one I2C. These communication peripherals offer protocol support for LIN, IrDA, DALI, Manchester, smart card, SMBus, and PMBus. The TI MSPM0 family of low-power MCUs consists of devices with varying degrees of analog and digital integration let customers find the MCU that meets their project needs. The architecture combined with extensive low-power modes is optimized to achieve extended battery life in portable measurement applications. MSPM0C110x MCUs are supported by an extensive hardware and software ecosystem with reference designs and code examples to get the design started quickly. Development kits include a LaunchPad™ kit available for purchase and design files for a target-socket board. TI also provides a free MSP Software Development Kit (SDK), which is available as a component of Code Composer Studio™ IDE desktop and cloud version within the TI Resource Explorer. MSPM0 MCUs are also supported by extensive online collateral, training with MSP Academy, and online support through the TI E2E™ support forums. Features • Core – Arm® 32-bit Cortex®-M0+ CPU, frequency up to 24MHz • Operating characteristics – Extended temperature: –40°C to 125°C – Wide supply voltage range: 1.62V to 3.6V • Memories – Up to 16KB of flash – 1KB of SRAM • High-performance analog peripherals – One analog-to-digital converter (ADC) with up to 10 total external channels, 1.7Msps at 10 bit or 1.5Msps at 12 bit with VDD as the voltage reference – Configurable 1.4V or 2.5V internal ADC voltage reference (VREF) – Integrated temperature sensor – Integrated supply monitor • Optimized low-power modes – RUN: 87µA/MHz – STOP: 609µA at 4MHz, 311µA at 32kHz – STANDBY: 5µA with SRAM retention – SHUTDOWN: 200nA • Intelligent digital peripherals – 1-channel DMA controller dedicated for ADC – Three timers supporting up to 14 PWM channels • One 16-bit advanced timers with deadband support up to 8 PWM channels • One 16-bit general purpose timer with 4 capture/compares • One 16-bit general purpose timer with 2 capture/compares – Windowed watchdog timer – BEEPER generating 1kHz, 2kHz, 4kHz, or 8kHz square wave to drive the external beeper • Enhanced communication interfaces – One UART interface supporting LIN, IrDA, DALI, smart card, Manchester and low-power operation in STANDBY mode – One I2C interface supporting FM+ (1Mbps), SMBus, PMBus, and wakeup from STOP mode – One SPI supporting up to 12Mbps • Clock system – Internal 24MHz oscillator with an accuracy from -2% to +1.2% (SYSOSC) – Internal 32kHz low-frequency oscillator (LFOSC) • Data integrity – Cyclic redundancy checker (CRC-16) • Flexible I/O features – Up to 18 GPIOs – Two 5V-tolerant open-drain IOs • Development support – 2-pin serial wire debug (SWD) • Package options – 20-pin TSSOP (PW) – 20-pin VSSOP (DGS) – 20-pin WQFN (RUK) – 16-pin SOT (DYY) – 8-pin SOT (DDF) – 8-pin WSON (DSG) – 8-pin DSBGA (YCJ) • Family members (also see Device Comparison) – MSPS003F4: 16KB of flash, 1KB of RAM – MSPS003F3: 8KB of flash, 1KB of RAM – MSPM0C1104: 16KB of flash, 1KB of RAM – MSPM0C1103: 8KB of flash, 1KB of RAM • Development kits and software (also see Tools and Software) – LP-MSPM0C1104 LaunchPad™ development kit – MSP Software Development Kit (SDK) 2 Applications • Battery charging and management • Power supplies and power delivery • Personal electronics • Building security and fire safety • Connected peripherals and printers • Grid infrastructure • Smart metering • Communication modules • Medical and healthcare • Lighting #MSPM0C1104S8YCJR #MSPM0C1104 #TexasInstruments #CortexM0Plus #Microcontroller #EmbeddedSystems #LowPowerMCU #IoT #WearableDevices #IndustrialControl #ConsumerElectronics #ADC #UART #SPI #I2C #PWM #TI #ElectronicsDesign #PCBDesign #EmbeddedDevelopment

Battery Multi-Function Controller IC Lithium Ion/Polymer 32-VFQFPN (5x5) L9961 is part of a complete battery pack monitoring, balancing, and protecting system for Li-Ion and Li-Polymer cells in 3, 4 or 5 series configurations. The L9961 uses a high precision ADC to provide cell voltage, stack voltage and temperature conversion via external NTC. Voltage monitoring functions are cyclically performed with a programmable loop time. Stack current is also monitored via a high accuracy CSA, continuously running and performing also Coulomb counting. Cell balancing is available and can be simultaneously activated on all cells. IC configuration and information exchange for SOC/SOH estimation are performed via I2C peripheral. The IC also integrates a dual pre-driver programmable in both HS/LS configurations for driving pack relays. L9961 also implements battery pack fuse protection to prevent fire and explosion hazards. A 3.3 V regulator with a high current capability is available for supplying pack controller and other external circuitry in both standby and normal operation modes. The IC protects the battery pack against over/under voltage conditions and monitors for over/ under temperature. It also features protection against overcurrent (both directions) and short-circuit in discharge events. Safety-relevant configurations can be stored in the internal NVM to avoid re-programming the device at each wake-up. Features • 2 μA shipment - DEEP SLEEP mode current and 5 μA standby consumption (with VREG LDO active) standby consumption (with VREG LDO active) • Integrated 3.3 V VREG LDO for supplying MCU and LEDs • Measures cell voltage (3 to 5 cells), with over/undervoltage detection and balance undervoltage protection • 12-bit voltage measurement with maximum error of ±15 mV in the [1.5 – 4.5] V range, for -40 °C < TJ < 105 °C • Measures stack voltage, with over/under voltage detection and plausibility check vs. sum of cells • Measures pack temperature via NTC, with over/undertemperature detection • Ratiometric temperature measurement with ±0.8% max. gain error in the [0.2 – VREG] V range, for -40 °C < TJ < 105 °C • Measures battery current, with Coulomb counting, overcurrent (both directions) and short-circuit in discharge protection. • 16-bit signed current measurement with 0.1% full scale error at room temperature • I 2C peripheral for device programming and data transfers over I2C bus • Cell balancing supporting up to 70 mA per cell • Dual configurable HS/LS predriver for pack relay management • Pack fuse management • Embedded NVM for configuration parameters storage • High hotplug robustness Applications • Cordless power tools • Backup energy storage systems and UPS • Light electric vehicles (e-bikes, scooters, etc.) • Portable and semi-portable equipment • Medical equipment #L9961TR #BatteryManagement #BMS #LiIonBattery #LiPoBattery #STMicroelectronics #BatteryProtection #CellBalancing #CoulombCounting #PowerManagement #EmbeddedSystems #EnergyStorage #EBike #PowerTools #ElectronicsDesign

1 mOhms ±1% 7W Chip Resistor Nonstandard Anti-Sulfur, Automotive AEC-Q200, Current Sense, Pulse Withstanding Metal Element The WSLP40261L000FEA is a high-power Power Metal Strip® current sense resistor manufactured by Vishay Intertechnology, Inc. (Vishay Dale). It is a surface-mount, ultra-low resistance resistor designed for precision current measurement and power monitoring applications. The device features a 1 mΩ resistance value, ±1% tolerance, and 7 W power rating, making it suitable for high-current automotive, industrial, battery management, and power supply applications. The resistor uses a solid metal element construction with a 4-terminal Kelvin connection to improve measurement accuracy by minimizing parasitic resistance effects. It is AEC-Q200 qualified, making it suitable for demanding automotive environments requiring high reliability and stability. • High power to foot print size ratio • All welded construction of the Power Metal Strip® resistors are ideal for all types of current sensing, voltage division and pulse applications • Proprietary processing technique produces extremely low resistance values, down to 0.0002 Ω • Sulfur resistance by construction that is unaffected by high sulfur environments • Specially selected and stabilized materials allow for high power rating (to 12 W) • Solid metal nickel-chrome or manganese-copper alloy resistive element with low TCR (< 20 ppm/°C) • Very low inductance 0.5 nH to 5 nH • Low thermal EMF (< 3 μV/°C) • AEC-Q200 qualified (1) • Material categorization: for definitions of compliance please see www.vishay.com/doc?99912 #WSLP40261L000FEA #Vishay #CurrentSenseResistor #PowerMetalStrip #ShuntResistor #LowOhmResistor #AECQ200 #AutomotiveElectronics #BMS #PowerElectronics #SMDResistor #PrecisionMeasurement

Pressure Sensor ±0.04PSI (±0.25kPa) Differential Male - 0.08" (1.93mm) Tube, Dual 12 b 8-DIP (0.524", 13.30mm), Dual Ports, Same Side Excellent — full picture confirmed from multiple sources. The HSCDRRN001ND2A5 is a TruStability HSC Series high accuracy digital I²C sensor with address 0x28, DIP package, dual radial barbed ports on the same side, differential pressure type, rated for ±1 inH₂O, operating on a 5.0 Vdc supply. Here's the complete spec. HIROSE Electric Engineering Specification — HSCDRRN001ND2A5 Manufacturer: Honeywell Sensing and Productivity Solutions Device Family: TruStability HSC Series General Description The HSCDRRN001ND2A5 is a high-accuracy, fully compensated and amplified differential pressure sensor manufactured by Honeywell, belonging to the TruStability HSC Series of board-mount pressure sensing devices. The device is built around a piezoresistive silicon sensing element housed within a ceramic package, combining a mature and proven sensing principle with advanced on-chip signal conditioning that makes the device ready for direct interfacing with a host microcontroller or processor without requiring extensive external analog signal processing circuitry. The defining characteristic of the TruStability HSC series, and of this device in particular, is its fully calibrated and temperature-compensated output, achieved through an integrated application-specific integrated circuit that corrects for sensor offset, sensitivity drift, temperature effects, and pressure nonlinearity across the device's rated operating range. This level of factory compensation allows the device to maintain its specified accuracy across the full compensated temperature range without requiring individual board-level calibration, significantly simplifying the design and production process for equipment that relies on precise low-pressure measurement. This particular configuration uses a digital I²C output interface, communicating pressure readings as high-resolution digital data words over a standard two-wire bus using a fixed I²C device address. This digital output makes it highly compatible with modern embedded system architectures where analog-to-digital conversion resources may be limited or where noise immunity and data integrity over longer trace runs are priorities. The device offers both high resolution and high accuracy within a tight total error band, making it suitable for applications where small differential pressure differences must be resolved reliably over time and temperature variation. The sensor is configured as a differential pressure measurement device, meaning it produces an output proportional to the difference in pressure between its two pneumatic ports rather than to absolute or gauge pressure relative to atmosphere. This makes it particularly well suited to airflow measurement, filter condition monitoring, liquid level detection, spirometry and respiratory measurement, HVAC duct pressure sensing, and other applications where the pressure difference across two points in a system is the relevant physical quantity. The device is housed in a through-hole dual in-line package with two radial barbed pneumatic port fittings located on the same side of the package body, allowing small-bore flexible tubing to be connected directly to each port without requiring additional adapter fittings. The barbed port design provides a secure, friction-held tube connection that resists accidental disconnection during normal handling and operation. The package is designed for standard through-hole PCB mounting, and the device is intended for use with non-corrosive, non-ionic dry gases only, consistent with the silicon and ceramic wetted materials used in its construction. Spec Sheet Identification Part Number: HSCDRRN001ND2A5 Series: TruStability HSC Series Manufacturer: Honeywell Sensing and Productivity Solutions Functional Classification Device Type: Board-mount piezoresistive silicon pressure sensor Sensing Type: Differential pressure Compensation: Fully calibrated and temperature compensated via integrated ASIC Accuracy Class: High accuracy, tight total error band class Output Interface Output Type: Digital I²C I²C Device Address: Fixed address 0x28 Output Resolution: High-resolution digital pressure word Applicable Interface Standards: I²C-compatible digital output Pressure Port Configuration Port Style: Dual radial barbed ports Port Orientation: Same side, both ports on the same face of the package Tubing Connection: Direct small-bore flexible tube connection via barbed fittings Media Compatibility: Non-corrosive, non-ionic dry gases only Pressure Characteristics Pressure Type: Differential Pressure Range: Very low differential pressure class, sub-inch water column range Overpressure Capability: Rated overpressure withstand above operating range Power Supply Supply Voltage: Standard logic-level supply rail class Environmental & Mechanical Operating Temperature Range: Commercial/industrial extended temperature range Compensated Temperature Range: Subset of the full operating temperature range, within which calibrated accuracy is maintained Mount Type: Through-hole Package: DIP (Dual In-line Package), standard pin pitch Application Suitability Target Applications: Airflow measurement, HVAC duct pressure sensing, filter monitoring, respiratory and spirometry equipment, liquid level detection, low-pressure process monitoring Environmental & Qualification RoHS Compliance: Yes Media Restriction: Dry, non-corrosive, non-ionic gases only; no liquid media on Port #HSCDRRN001ND2A5 #Honeywell #TruStability #HSCSeries #PressureSensor #DifferentialPressure #PiezoresistiveSensor #I2CSensor #BoardMountSensor #LowPressureSensor #AirflowSensor #HVACSensor #RespiratoryMedical #ThroughHole #DIPPackage #CompensatedSensor #TemperatureCompensated #SensorDatasheet #EngineeringSpec #ComponentLibrary #CommonPartsLibrary #RoHSCompliant

0.2 mOhms ±1% 9W Chip Resistor Nonstandard Anti-Sulfur, Automotive AEC-Q200, Current Sense, Moisture Resistant, Pulse Withstanding Metal Element The WSLP3921L2000FEA is a power metal strip current sense resistor manufactured by Vishay Dale, designed specifically for precision current measurement applications in power electronics circuits. It belongs to the WSL/WSLP family, a line of low-resistance, high-power surface-mount resistors built using a metal strip element rather than conventional thick-film or thin-film resistive technology, giving it characteristics that are particularly well suited to current sensing rather than general-purpose resistive applications. The defining characteristic of this component is its very low resistance value, which allows it to be placed in series with a current path while introducing minimal voltage drop and power loss, while still producing a measurable voltage signal proportional to the current flowing through it. This voltage signal can then be read by current-sense amplifiers, comparators, or analog-to-digital converters to provide accurate real-time current feedback for power supply regulation, overcurrent protection, battery management, motor control, and similar applications where knowing the instantaneous current is essential to safe and efficient operation. The metal strip construction used in this series offers a low temperature coefficient of resistance compared to thick-film alternatives, meaning the resistor's value remains more stable across varying operating temperatures, which directly improves the accuracy of current measurements taken over a wide thermal range. The element is also engineered for low thermal EMF and minimal self-inductance, both of which are important for maintaining measurement fidelity in fast-switching power conversion circuits where parasitic effects can otherwise distort the sensed signal. This particular part is qualified to automotive component reliability standards, reflecting its suitability for use in vehicle electrical systems, battery packs, and other safety- or reliability-critical power applications where component robustness under thermal cycling, vibration, and long-term stress must be assured. The device also features moisture-resistant and pulse-withstanding construction, along with a nonstandard anti-sulfuration design intended to resist corrosion-related resistance drift that can occur in resistors exposed to sulfur-containing environmental contaminants over time, a known failure mode in some conventional thick-film resistor technologies. The component is housed in a surface-mount package and is supplied on tape-and-reel packaging suitable for automated assembly, with construction compliant to RoHS material restrictions. Spec Sheet Identification Part Number: WSLP3921L2000FEA Series: WSLP Manufacturer: Vishay Dale Functional Classification Device Type: Current sense resistor Construction: Power metal strip element Application Role: Series current-sensing element for analog current measurement Electrical Characteristics Resistance Value: Ultra-low resistance class, optimized for current sensing Resistance Tolerance: Tight tolerance class for measurement accuracy Power Rating: High power dissipation class for its footprint Temperature Coefficient of Resistance: Low TCR for stable measurement across temperature Thermal EMF: Low thermal EMF construction Self-Inductance: Low parasitic inductance, suited to fast-switching circuits Reliability & Environmental Features Anti-Sulfuration: Nonstandard anti-sulfur construction for corrosion resistance Moisture Resistance: Moisture-resistant build Pulse Withstanding: Rated for pulse-load withstanding capability Automotive Qualification: AEC-Q200 qualified RoHS Compliance: Yes Mechanical Specifications Case Size Class: 3921 surface-mount footprint Mounting Method: Surface mount technology (SMT) Terminal Construction: Metal strip element with welded or clad terminations per series design Packaging Packaging Format: Tape-and-reel Packaging Code Meaning: Suffix denotes lead-free, standard reel quantity packaging #WSLP3921 #VishayDale #Vishay #CurrentSenseResistor #MetalStripResistor #PowerResistor #ShuntResistor #AECQ200 #CurrentSensing #PowerElectronics #SMTResistor #BatteryManagement #MotorControl #OvercurrentProtection #ResistorDatasheet #EngineeringSpec #ComponentLibrary #CommonPartsLibrary #RoHSCompliant #PassiveComponent

Temperature Sensor Digital, Local -40°C ~ 125°C 16 b 4-PICOSTAR (0.76x0.76) The TMP114NCIYMTR is a high-accuracy digital temperature sensor designed for precision thermal monitoring applications in industrial, automotive, medical, and embedded electronic systems. The device integrates a precision band-gap temperature sensing element, analog-to-digital conversion circuitry, EEPROM memory, and a digital communication interface within a compact low-power package. The sensor supports accurate local temperature measurements with factory calibration and programmable alert functionality, enabling reliable thermal protection and environmental monitoring in space-constrained designs. Engineering Specification Manufacturer: Texas Instruments Manufacturer Part Number: TMP114NCIYMTR Device Type: Digital Temperature Sensor Temperature Measurement Method: Local Semiconductor Temperature Sensing Interface Type: I²C-Compatible Serial Interface Supply Voltage Range: Ultra-Low Voltage Operation Compatible with Battery-Powered Systems Temperature Measurement Range: Industrial Temperature Range Support Accuracy: High-Precision Factory-Calibrated Temperature Measurement Resolution: High-Resolution Digital Temperature Output Conversion Architecture: Integrated Sigma-Delta Analog-to-Digital Conversion Programmable Features: High and low temperature alert thresholds EEPROM-stored configuration settings Programmable conversion rate Offset correction calibration Alert and interrupt functionality Power Consumption: Optimized for Low-Power Embedded Applications Communication Speed: Standard and Fast-Mode I²C Support Package Type: Small Outline Leadless Package Mounting Type: Surface Mount Technology Operating Environment: Suitable for Industrial and Embedded Control Systems Protection Features: Integrated thermal monitoring alerts Nonvolatile configuration retention Robust digital communication interface Applications: Industrial temperature monitoring Medical instrumentation Battery-powered electronics Thermal management systems Precision embedded sensing Data acquisition equipment Environmental monitoring devices #commonpartslibrary #integratedcircuit #temperaturesensor #digital

+/-24V PGA I/P 24-BIT 256KSPS DA The ADAQ7767-1BBCZ is a high-performance, precision data acquisition (DAQ) µModule® system from Analog Devices. It integrates a 24-bit sigma-delta analog-to-digital converter (ADC), signal conditioning, and essential analog front-end components into a compact package. Designed for high accuracy and ease of use, it significantly reduces design complexity, layout effort, and noise sensitivity in precision measurement systems. This device is optimized for applications requiring high resolution, low noise, and excellent DC performance, such as industrial automation, instrumentation, and test equipment. Key Features 24-bit resolution sigma-delta ADC Integrated analog front end (AFE) Low noise, high dynamic range performance Programmable gain amplifier (PGA) Wide input bandwidth Low drift and high linearity SPI-compatible serial interface Internal reference and buffer options Compact system-in-package (SiP) design Electrical Characteristics Resolution: 24 bits Sampling Rate: Up to 256 kSPS (depending on configuration) Input Type: Differential Input Voltage Range: ±VREF (dependent on configuration) Signal-to-Noise Ratio (SNR): ~108 dB (typical) Total Harmonic Distortion (THD): Low distortion performance Reference Voltage: Internal or external supported Power Requirements Analog Supply Voltage (AVDD): 4.5 V to 5.5 V (typical) Digital Supply Voltage (DVDD): 1.8 V to 3.3 V Power Consumption: Optimized for precision applications Interface Communication: SPI-compatible serial interface Data Output: Serial digital output Control: Register-based configuration Package Information Package Type: µModule® (BGA) Package Code: BBCZ Mounting Type: Surface mount Compact footprint for space-constrained designs Operating Conditions Operating Temperature Range: -40°C to +85°C (industrial grade) Storage Temperature Range: -65°C to +150°C Applications Industrial process control Data acquisition systems Precision instrumentation Test and measurement equipment Medical instrumentation Energy monitoring systems Advantages Reduces PCB design complexity Minimizes noise and parasitic effects Factory-optimized signal chain performance Faster time-to-market