FFPF60SA60DSTU
Diode Array 1 Pair Common Cathode 600 V 8A Through Hole TO-220-3 Full Pack #CommonPartsLibrary #Diode #Arrray #Rectifier... show more0 Uses
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ULN2804A
Bipolar (BJT) Transistor Array 8 NPN Darlington 50V 500mA - 2.25W Through Hole 18-DIP #CommonPartsLibrary #TransistorsArrays #ULN2804... show more0 Uses
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C4D15120D
Diode Array 1 Pair Common Cathode Silicon Carbide Schottky 1200 V 24.5V (DC) Through Hole TO-247-3 #CommonPartsLibrary #Schottky #DiodeArray #Diodes... show more1 Use
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C3D16065D
Diode Array 1 Pair Common Cathode Silicon Carbide Schottky 650 V 8A (DC) Through Hole TO-247-3 #CommonPartsLibrary #Schottky #DiodeArray #Diodes... show more0 Uses
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C3D16060D
Diode Array 1 Pair Common Cathode Silicon Carbide Schottky 600 V 8A (DC) Through Hole TO-247-3 #CommonPartsLibrary #Diode #Schottky... show more0 Uses
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BAV70SH6827XTSA1
Diode Array 2 Pair Common Cathode Standard 80 V 200mA (DC) Surface Mount 6-VSSOP, SC-88, SOT-363 #CommonPartsLibrary #Diode #BAV70... show more0 Uses
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BAT54CW
Diode Array 1 Pair Common Anode Schottky 30 V 100mA Surface Mount SC-70, SOT-323 #CommonPartsLibrary #Diode #BAT54... show more1 Use
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BAT54C
Diode Array 1 Pair Common Cathode Schottky 30 V 200mA Surface Mount SOT-23 #CommonPartsLibrary #Diode #BAT54... show more22 Uses
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BAT54AWFILMY
Diode Array 1 Pair Common Anode Schottky 40 V 300mA (DC) Surface Mount SC-70, SOT-323 #CommonPartsLibrary #Diode #BAT54... show more1 Use
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BAS40-04
Diode Array 1 Pair Series Connection Schottky 40 V 200mA (DC) Surface Mount TO-236-3, SC-59, SOT-23-3 #CommonPartsLibrary #Diode #BAS40-04... show more2 Uses
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BAS16TW-7
Diode Array 3 Independent Standard 75 V 150mA Surface Mount 6-TSSOP, SC-88, SOT-363 #CommonPartsLibrary #Diode #BAS16TW... show more24 Uses
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FFB5551
Bipolar (BJT) Transistor Array 2 NPN (Dual) 160V 200mA 300MHz 200mW Surface Mount SC-88 (SC-70-6) #CommonPartsLibrary #Transistors #Bipolar(BJT) #DualNPN #BipolarTransistorArrays... show more7 Uses
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FFB2222A
Bipolar (BJT) Transistor Array 2 NPN (Dual) 40V 500mA 300MHz 300mW Surface Mount SC-88 (SC-70-6) #CommonPartsLibrary #Transistors #Bipolar(BJT) #DualNPN #BipolarTransistorArrays... show more2 Uses
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C3D20065D
Diode Array 1 Pair Common Cathode Silicon Carbide Schottky 650 V 10A (DC) Through Hole TO-247-3 #CommonPartsLibrary #Schottky #DiodeArray #Diodes... show more2 Uses
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ACDSV6-4448TI-G
Diode Array 3 Independent Standard 80 V 100mA Surface Mount 6-TSSOP, SC-88, SOT-363 #CommonPartsLibrary #DiodesArray #Diodes... show more0 Uses
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158301227
LED Lighting WL-SWTP White, Warm 2700K 3V 20mA 120° 1206 (3216 Metric) The 158301227 is a surface-mount white LED manufactured by Würth Elektronik, belonging to the WL-SWTP series of top-view PLCC-packaged light-emitting diodes designed for general illumination, backlighting, and signal indication applications in compact electronics. It is built on a gallium nitride semiconductor chip, the standard chip technology used in high-efficiency white LED production, which achieves white light emission by combining a blue GaN die with a phosphor conversion layer that down-converts a portion of the blue photons into broader-spectrum yellow light, with the combined blue and yellow output perceived by the human eye as white light. This particular variant is characterized by a warm white Sunrise color temperature, placing it in the lowest color temperature tier of the WL-SWTP family. Warm white light at this color temperature produces a yellowish, incandescent-like appearance that is widely preferred in residential, hospitality, and ambient lighting applications where a soft, comfortable visual environment is desired. This makes the device a natural fit for LED-based replacements for incandescent and halogen light sources in T5 and T8 fluorescent tube form factor products, as well as indoor display backlights, decorative architectural lighting, and other applications where a warm light quality is specified or preferred by end users. The WL-SWTP series features fast switching, no infrared radiation, high color rendering index, slim and miniature size, low power consumption, suitability for all SMT assembly methods, a top-view emission direction, and a wide viewing angle. The high color rendering index characteristic of this device means that objects illuminated by it appear with colors close to how they would look under natural daylight illumination, which is an important quality metric in retail, museum, medical examination, and other environments where accurate color representation enhances user experience or functional accuracy. Texas Instruments The PLCC package style used in this device is a molded plastic leaded chip carrier format that provides a well-defined, mechanically stable footprint for surface-mount assembly, with the optical emitting surface oriented perpendicular to the PCB plane in the top-view configuration. This top-view orientation makes the device suitable for direct illumination of surfaces positioned above the PCB, such as diffusers, light guides, or display panels mounted parallel to the LED board. The compact 3014 package footprint allows high-density LED arrays to be assembled on narrow PCB strips or modules, which is typical in LED tube light and edge-lit backlight designs. The device is supplied on tape-and-reel packaging suitable for automated high-speed pick-and-place assembly at production volumes. Spec Sheet Identification Part Number: 158301227 Series: WL-SWTP — SMD White Top View PLCC LED Manufacturer: Würth Elektronik GmbH & Co. KG Functional Classification Device Type: Surface-mount white LED Chip Technology: Gallium Nitride (GaN) with phosphor conversion Emission Type: White light via blue die plus phosphor down-conversion View Direction: Top view — perpendicular to PCB surface Optical Characteristics Emitting Color: Sunrise warm white Color Temperature: Warm white class, lowest CCT tier in WL-SWTP family Color Rendering Index: High CRI class, suitable for color-critical applications Viewing Angle: Wide angle, broad spatial distribution Infrared Radiation: None — no IR emission Electrical Characteristics Operating Current: Standard signal LED drive current class Forward Voltage: Standard GaN white LED forward voltage class Switching Speed: Fast switching capable Thermal Characteristics Thermal Resistance, Junction to Solder Point: Defined per series specification Maximum LED Junction Temperature: Rated to elevated junction temperature class Package & Mechanical Package Type: PLCC (Plastic Leaded Chip Carrier), PLCC-2 style Package Size: 3014 SMD footprint Mounting Method: Surface mount technology (SMT) Assembly Compatibility: Suitable for all standard SMT assembly methods including reflow soldering Target Applications Signal indication and pilot lights Indoor display backlighting General illumination and commercial lighting Replacement for PLCC 3528 devices in T8 and T5 LED tube designs Architectural and ambient lighting systems Environmental & Qualification RoHS Compliance: Yes REACH Compliance: Yes Packaging Supply Format: Tape-and-reel Standard Reel Quantity: Standard volume reel per Würth packaging convention #WuerthElektronik #WuerthElectronic #WLSWTP #WhiteLED #WarmWhiteLED #SunriseLED #PLCCLED #SMDLed #3014LED #TopViewLED #GaNLED #HighCRI #LEDBacklight #GeneralIllumination #IndoorLighting #SignalLED #LightingDesign #OptoelectronicComponent #EngineeringSpec #ComponentLibrary #CommonPartsLibrary #RoHSCompliant #REACHCompliant... show more72 Uses
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61082-101400LF
100 Position Connector Receptacle, Outer Shroud Contacts Surface Mount Gold #CommonPartsLibrary #Connector #Interconnect #Rectangular-Connector #Arrays #Edge-Type #Mezzanine-(Board to Board) #61082... show more51 Uses
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IRLR7843TRPBF
N-Channel 30 V 161A (Tc) 140W (Tc) Surface Mount TO-252AA (DPAK) The IRLR7843TRPBF is an N-channel power MOSFET built on Infineon's HEXFET technology platform, originally developed by International Rectifier. It is designed as a low-voltage, high-current switching device intended for applications where minimizing conduction loss and maximizing efficiency are primary design goals. The part is particularly well suited to synchronous switching topologies, where pairs or arrays of MOSFETs alternately conduct to regulate power flow with minimal energy dissipation. This device targets high-density power conversion applications where board space is limited but current demands are substantial, such as notebook computer power delivery, point-of-load converters used in servers, and advanced telecom and datacom equipment. It is commonly found supporting synchronous buck converter stages that step down a higher input rail to a lower output voltage suitable for powering processors, memory, and other low-voltage digital logic. Its low on-resistance characteristic allows it to carry significant current while generating comparatively little resistive heating, which is essential in compact enclosures with constrained thermal budgets. The transistor is fabricated using a refined trench gate process that improves upon earlier HEXFET generations, offering reduced gate charge and lower switching losses alongside its low conduction resistance. This combination makes it effective in both the high-side and low-side positions of a synchronous switching cell, where fast, clean transitions reduce overlap losses and improve overall converter efficiency. The device also offers well-characterized avalanche energy ratings, giving designers confidence in its ruggedness when exposed to transient overvoltage events that can occur during switching, and it presents a very low gate impedance, allowing it to be driven efficiently by standard gate driver circuitry. Mechanically, the part is housed in a surface-mount power package with an exposed tab for enhanced thermal conduction to the host PCB, allowing heat generated during operation to be efficiently transferred away from the silicon die. This package style is widely used in power-dense designs where through-hole packages would be impractical. The device is supplied in a tape-and-reel format suitable for automated assembly and is compliant with RoHS material restrictions, reflecting current environmental and regulatory standards for electronic components. Spec Sheet Identification Part Number: IRLR7843TRPBF Device Family: HEXFET Power MOSFET Manufacturer: Infineon Technologies Functional Classification Device Type: Power MOSFET Channel Type: N-channel Technology: Trench-gate HEXFET (IR MOSFET legacy technology) Logic Level Compatibility: Logic-level gate drive compatible Electrical Characteristics Drain-to-Source Voltage Rating: Low-voltage class, optimized for sub-30V rail applications On-Resistance: Ultra-low on-resistance class Drain Current Capability: High continuous current class Gate Charge: Low gate charge, optimized for fast switching Gate Impedance: Ultra-low gate impedance Avalanche Characteristics: Fully characterized avalanche voltage and current rating Switching & Application Behavior Primary Application: Synchronous buck converter switching stages Suitable Position: High-side and low-side switch positions Target Use Cases: Point-of-load conversion, notebook power delivery, telecom/datacom power systems Thermal & Mechanical Package Type: Surface-mount power package with exposed thermal tab (DPAK-style) Mounting: Surface mount technology (SMT) Thermal Path: Tab-based conduction to PCB for heat dissipation Environmental & Qualification RoHS Compliance: Yes Lifecycle Status: Active production Packaging Format Supply Format: Tape-and-reel, per part suffix designation #IRLR7843 #Infineon #HEXFET #PowerMOSFET #NChannelMOSFET #SynchronousBuck #PowerElectronics #DCDCConverter #PointOfLoad #PowerConversion #DPAK #SMTPackage #RoHSCompliant #SemiconductorIC #EngineeringSpec #ComponentLibrary #CommonPartsLibrary #PowerDensity #LowRDSon #DiscreteSemiconductor #commonpartslibrary #transistor... show more3 Uses
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ULN2004A
High Voltage, High Current Darlington Transistor Arrays, 16-DIP #CommonPartsLibrary #IntegradedCircuits #PowerManagement #PowerDistributionSwitches #LoadDrivers #ULN2004... show more13 Uses
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DF40C-60DP-0.4V(51)
60 Position Connector Plug, Outer Shroud Contacts Surface Mount Gold #CommonPartsLibrary #Connector #Interconnect #Rectangular-Connector #Arrays #Edge-Type #Mezzanine #DF40C... show more5 Uses
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NCV1413BDR2G
High Voltage, High Current Darlington Transistor Arrays, SOIC16 #CommonPartsLibrary #TransistorsArrays #NCV1413... show more5 Uses
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BM20B(0.6)-24DP-0.4V(51)
24 Position Connector Header, Outer Shroud Contacts Surface Mount Gold #Connector #Rectangular-Connectors #Arrays #Edge-Type #Mezzanine #BM20... show more8 Uses
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ULN2002AN
High Voltage, High Current Darlington Transistor Arrays, 16-DIP #CommonPartsLibrary #IntegradedCircuits #PowerManagement #PowerDistributionSwitches #LoadDrivers #ULN2002... show more0 Uses
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SN75468N
Higher Voltage, High Current Darlington Transistor Arrays, 5V CMOS/TTL-compatible input, DIP16 #CommonPartsLibrary #TransistorsArrays #75468... show more0 Uses
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ULN2004D1013TR
High Voltage, High Current Darlington Transistor Arrays, 16-SOIC #CommonPartsLibrary #IntegradedCircuits #PowerManagement #PowerDistributionSwitches #LoadDrivers #ULN2004... show more1 Use
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