Reviewed available part information for the published part project silicon-yard/upd2425 / UPD2425, including project metadata, schematic terminals, footprint pads, and official datasheet data.
Existing Part Metadata
Project/part name: UPD2425
Published as part: yes
Part UID: bffa21d5-fa71-42e4-8ae9-74cc6635f29c
Description: Solid State Relays - PCB Mount UPD Single-Phase 240V / 25A ZC PCB
BOM items: none; this is a part project made from terminal primitives.
Official Datasheet Source
The Datasheet URL property was already populated, so no property update was required. The existing URL points to Sensata/Crydom official content. Web search also found a newer canonical Sensata URL for the same UPD Series datasheet:
Max on-state voltage drop at rated current: 1.4 Vpk.
Thermal resistance junction-to-case: 0.7 °C/W.
Max off-state leakage at rated voltage: 0.1 mArms.
Control input: 3–32 VDC.
Typical input current at 12 VDC: 10 mA DC.
Max turn-on voltage: 3.0 VDC.
Min turn-off voltage: 1.0 VDC.
Turn-on time: 1/2 cycle for UPD2425 zero-crossing version.
Turn-off time: 1/2 cycle.
Dielectric strength input/output/base: 2500 Vrms.
Minimum insulation resistance at 500 VDC: 10^9 Ω.
Maximum input/output capacitance: 10 pF.
Operating temperature: −40 to +80 °C.
Storage temperature: −40 to +125 °C.
Typical weight: 1.5 oz / 42.5 g.
Heat sinking required; use derating curves for load-current vs ambient.
Datasheet Pinout / Terminal Functions
The UPD2425 PCB-mount version has 6 PCB pins. Datasheet note: output terminals are doubled for 25 A models.
Table
Pin
Datasheet function
Existing schematic terminal
Status
1
Input −
-INPUT, Pin Number 1
Matches
2
Input +
+INPUT, Pin Number 2
Matches
3
Output AC terminal, doubled
OUTPUT_1, Pin Number 3
Functionally matches, but pin description missing
4
Output AC terminal, doubled
OUTPUT_2, Pin Number 4
Functionally matches, but pin description missing
5
Output AC terminal, doubled
OUTPUT_3, Pin Number 5
Functionally matches, but pin description missing
6
Output AC terminal, doubled
OUTPUT_4, Pin Number 6
Functionally matches, but pin description missing
Schematic Symbol Check
Existing symbol uses six terminal components:
-INPUT pin 1
+INPUT pin 2
OUTPUT_1 pin 3
OUTPUT_2 pin 4
OUTPUT_3 pin 5
OUTPUT_4 pin 6
Findings:
Pin count matches the datasheet for the 25 A PCB-mount UPD2425.
Input polarity and pin numbers match the datasheet.
The four AC output pins match the doubled-output-terminal concept for the 25 A model.
Pin Type is Unspecified for every terminal; for a relay/SSR this is tolerable but less informative than Input for control pins and Passive/Power for load pins.
Pin Description properties are not populated. This should be improved so users can distinguish the two paralleled AC terminal pairs.
Recommended symbol metadata updates:
Pin 1 description: DC control input negative (−)
Pin 2 description: DC control input positive (+), 3–32 VDC
Pin 3 description: AC load output terminal A, paralleled 25 A pin 1 of 2
Pin 4 description: AC load output terminal A, paralleled 25 A pin 2 of 2
Pin 5 description: AC load output terminal B, paralleled 25 A pin 1 of 2
Pin 6 description: AC load output terminal B, paralleled 25 A pin 2 of 2
Footprint Check
Datasheet/mechanical drawing facts found:
Package type: 6-pin SIP / PCB through-hole SSR.
Pin terminal cross-section: square 0.032 in ±0.005 in, 6 places.
Tolerance: ±0.02 in / ±0.5 mm.
Approximate package length: 3.08–3.09 in / 78.2–78.5 mm.
Body length: 2.80 in / 71.1 mm.
Height: 1.12 in / 28.4 mm.
Depth/thickness: ~0.50 in / 12.7 mm.
Expected pin X positions from leftmost pin: 0.00, 0.20, 0.80, 1.00, 1.40, 1.60 in = 0.0, 5.08, 20.32, 25.40, 35.56, 40.64 mm.
Existing footprint data inspected:
Pads are present at X positions shown by the tool as 0, 0.00508, 0.02032, 0.0254, 0.03556, 0.04064 with unit reported as mm.
Pad size is shown as 0.002025 x 0.002025 with unit reported as mm.
Default hole size rule is 0.7 mm.
The silk/fab outline visually spans roughly −19.8 mm to +60.4 mm, which is consistent with an ~80 mm package outline.
Footprint concern:
The pad coordinate and pad-size values appear to be scaled by 1/1000 if interpreted literally as millimeters. They numerically correspond to 0, 5.08, 20.32, 25.4, 35.56, and 40.64 mm when treated as meters, while the tool reports unit: mm.
The displayed silk outline appears correctly sized in mm, but the pad computed rules are inconsistent with normal through-hole pad dimensions. This should be verified visually in the PCB editor or corrected if the pads are actually microscopic.
Pad hole size of 0.7 mm is likely too small or marginal for 0.032 in square pins. The pin diagonal is about 1.15 mm; practical plated through-hole diameter should likely be around 1.2–1.4 mm, with an adequate annular ring, subject to manufacturer/assembly requirements.
Pad type is inherited from default as SMD unless overridden; for this part the pads should be through-hole/plated holes.
Mismatches / Issues Flagged
Footprint pad scaling may be wrong: pad positions and size are reported as tiny mm values, although the silk appears correctly sized. Verify/correct pad coordinate unit handling.
Pad type/hole likely wrong: current pad rules inherit SMD pad type and 0.7 mm hole default; UPD2425 requires through-hole pads for 0.032 in square pins.
Pad size likely wrong: reported pad size is microscopic; expected pad outer diameter should be sized for a ~1.2–1.4 mm hole and suitable annular ring for a high-current SSR package.
Pin descriptions missing: schematic terminal names and pin numbers match, but Pin Description fields are not populated.
Part Type may be too generic: terminals are all Terminal; the published part should ideally identify as a Relay/Solid State Relay/Isolator class if Flux property options allow it.
The high-level metadata, datasheet link, pin count, and pin numbering/function naming are consistent with the official UPD2425 datasheet. The main risk is the footprint: pad units/type/hole/size need correction or visual verification before this part is used for manufacturing, especially because this is a 240 VAC / 25 A SSR requiring appropriate through-hole geometry, creepage/clearance, thermal design, and high-current copper design.