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XF28P650DK9PTP Part Review
Reviewed project metadata
  • Project / part: XF28P650DK9PTP
  • Manufacturer: Texas Instruments
  • Current Datasheet URL property: https://storage.googleapis.com/graviton-electric-symbols/document_assets/user-uploaded/f3ba4329b0ccb5891e2ec5f4057a54bbf9fba2e89eb5254203c213744d195425.pdf
  • Official datasheet found: TI TMS320F28P65x Real-Time Microcontrollers datasheet (Rev. D), https://www.ti.com/lit/ds/symlink/tms320f28p650dk.pdf
  • Official TI product page: https://www.ti.com/product/TMS320F28P650DK
The Datasheet URL property was already populated, so I did not overwrite it. The populated URL appears to be a stored PDF copy rather than the direct TI URL.
Key device specs from datasheet / TI product data
  • Device family: C2000 real-time MCU, TMS320F28P65x / F28P650DK9
  • Orderable active equivalent: F28P650DK9PTP; XF28P650DK9PTP appears to be older/preproduction/obsolete in TI quality data.
  • Package: PTP / HLQFP / PowerPAD thermally enhanced LQFP
  • Pin count: 176 peripheral leads plus exposed thermal pad / PowerPAD as pad 177
  • Package size: 26 mm × 26 mm, 0.5 mm pitch, max height 1.6 mm
  • Exposed pad: approximately 6.237 mm × 6.237 mm, tied to VSS / digital ground
  • Core supply: VDD nominal 1.2 V
  • I/O and analog supply: VDDIO / VDDA nominal 3.3 V, max 3.63 V
  • Operating temperature: -40 °C to 125 °C ambient; datasheet lists junction to 150 °C
  • CPU: dual C28x plus CLA, 200 MHz class
  • Memory: 1.28 MB flash, 248 KB RAM
  • Major peripherals: HRPWM, ADCs, CMPSS, DACs, EtherCAT, CAN-FD, USB, SPI, I2C, UART/SCI, FSI, eQEP, eCAP
Symbol / pin review
Project symbol consists of 177 Terminal entries, matching 176 signal/power pins plus EPAD/PowerPAD. Spot checks against the datasheet were consistent:

Table

Project terminalPinDatasheet check
GPIO88170GPIO88 I/O
A538A5 analog input / comparator functions / AIO232
B4,GPIO21564B4 ADC input and GPIO215
VDD161.2 V logic supply
GPIO45115GPIO45 and alternate functions
VREFHIA37ADC-A high reference input
B8,GPIO21766B8 ADC input and GPIO217
GPIO1912GPIO19 I/O expected for this range
VDDIO33.3 V digital I/O supply
GPIO2874GPIO28 / SCIA_RX / alternate functions
A10,GPIO21362A10 analog input and GPIO213
A11,GPIO21463A11 analog input and GPIO214
A8,GPIO21159A8 analog input and GPIO211
A9,GPIO21260A9 analog input and GPIO212
A0/DACA_OUT43A0 ADC input and DACA_OUT
EPAD177VSS / PowerPAD thermal pad
Footprint review
  • Layout summary: 178 pad nodes plus one footprint node.
  • Expected package: 176 signal leads plus exposed pad = 177 electrical pads. The project context reports 177 pads, while layout summary reports 178 pad nodes. The tree view shows one EPAD plus all named peripheral pads; there may be one additional pad-like node or duplicated pad counted by the layout summary.
  • Footprint naming/description HLQFP176_PTP_TEX matches the datasheet package family.
  • Datasheet land pattern reference: 176 × 1.45 mm × 0.3 mm signal pads, 0.5 mm pitch, 6.237 mm square thermal pad.
Mismatches / risks flagged
  1. MPN lifecycle / naming: Project MPN is XF28P650DK9PTP; TI search indicates the active orderable part is F28P650DK9PTP, while the XF... prefix appears preproduction/obsolete. If this part is intended for procurement, consider using F28P650DK9PTP as the Manufacturer Part Number and retaining the XF value only as an alias/legacy marking.
  2. Datasheet URL: A Datasheet URL is already set, but it is a stored uploaded PDF, not the direct official TI URL. Per instruction I did not overwrite it; direct official URL is https://www.ti.com/lit/ds/symlink/tms320f28p650dk.pdf.
  3. Pad count discrepancy: Project context says 177 pads, but layout summary reports 178 pad nodes. Expected electrical pads are 177 including PowerPAD. This should be investigated before publishing/releasing the footprint.
  4. Pin descriptions sparse: The terminal properties include Pin Number and Pin Type, but do not include rich Pin Description values from the datasheet. Functional names are present in terminal designators, but detailed descriptions/mux notes are not populated.
  5. Pin type simplification: Some analog pins with DAC output capability are marked Output (A0/DACA_OUT, B1/DACC_OUT), while the datasheet lists them as multi-function analog input / comparator input / DAC output pins. Bi-Directional or a more nuanced analog/mixed-signal description may better reflect the muxed nature.
  6. Ground pin typing: At least one VSSA terminal is marked Power Out; ground/reference pins are typically better represented as Power In/passive ground depending on Flux convention.
  • Decide whether to update MPN from XF28P650DK9PTP to active TI orderable F28P650DK9PTP.
  • Optionally replace or add the direct official TI datasheet URL.
  • Audit the extra layout pad count and confirm whether any non-electrical pad is being counted unexpectedly.
  • Populate Pin Description properties for terminals from datasheet signal descriptions, especially power, reference, oscillator, JTAG, reset, and analog muxed pins.
  • Review pin types for mixed analog/DAC pins and ground/reference pins.

  • Reviewed project metadata

  • Key device specs from datasheet / TI product data

  • Symbol / pin review

  • Footprint review

  • Mismatches / risks flagged

  • Recommended next fixes