Reorganized all 100 STM32H563VGT6 terminals without changing pin names, numbers, mappings, or footprint assignments. Power is first, Ground last, Pin Group is removed, terminal orders are unique 1–100, and all sections are balanced within one pin.
Power: 11 pins, 6L/5R
GPIO / Multifunction: 76 pins, 38L/38R
Clock / Reset / Boot / Reference: 6 pins, 3L/3R
Ground: 7 pins, 3L/4R
Independent verification passed all structural and datasheet checks. The symbol is substantially more compact and symmetric, though some GPIO labels remain crowded due to the 100-pin density and immutable pin-label/position constraints.
Reviewed the published Flux part STM32H563VGT6 against the official STMicroelectronics family datasheet and product page, covering project metadata, ordering code, symbol terminals, footprint geometry, and terminal properties.
The existing Datasheet URL is an official ST URL and covers STM32H562xx/STM32H563xx, despite the filename containing stm32h562ag. It was already populated, so it was not changed.
Available part information
Table
Field
Current value
Datasheet/product result
Status
Manufacturer part number
STM32H563VGT6
STM32H563VGT6
Match
Manufacturer
STMicroelectronics
STMicroelectronics
Match
Pin count
100
V ordering-code field = 100 pins
Match
Package
Footprint is LQFP-100, 14 × 14 mm, 0.50 mm pitch
T ordering-code field = LQFP; LQFP100 body 14 × 14 mm, 0.50 mm pitch
Integrated Circuits; library subtype shown as Logic/AND
Microcontroller
Mismatch / misclassification
Package property
No explicit Package or Case Code property found
LQFP100, 14 × 14 mm
Missing property
Ordering-code decode
STM32 H 563 V G T 6
STM32: Arm-based STM32 MCU
H: high-performance family
563: STM32H563 device
V: 100 pins
G: 1 Mbyte Flash
T: LQFP package
6: industrial −40 to +85 °C, LDO option
Key specifications
Arm Cortex-M33 core with TrustZone, DSP and FPU
Maximum CPU frequency: 250 MHz
Performance: up to 375 DMIPS
Embedded Flash: 1 Mbyte for STM32H563VGT6
SRAM: 640 Kbytes
Main supply range: VDD 1.71 to 3.6 V
Package: LQFP100, 14 × 14 mm body, 0.50 mm lead pitch
Temperature grade: −40 to +85 °C
Security features include TrustZone and hardware security/cryptographic functions in the STM32H563 family
Mixed-signal and connectivity resources include ADC/DAC, timers, USB FS, FDCAN, USART/UART, SPI, I²C and audio/serial interfaces; exact muxing is pin-dependent
Schematic symbol audit
Pin-number and primary-name mapping
The symbol contains exactly 100 terminals with unique pin numbers 1–100. The terminal names and numbers match the official LQFP100 LDO-option pinout for the exact non-Q ordering code, including:
No missing, duplicated, or swapped primary pin names were identified in the 100-pin symbol.
Terminal metadata
Every terminal currently has:
Pin Type: Unspecified
No Pin Description
This is a significant quality gap. GPIOs should be classified as bidirectional/digital or programmable as appropriate; supply pins should be Power In or Ground; NRST/BOOT0 and oscillator/reference pins need appropriate electrical types. Pin descriptions should document supply function, reset/boot behavior, oscillator role, analog reference role, and GPIO alternate-function capability. Alternate functions do not need to be placed in the visible terminal name, but useful descriptions should be present.
Footprint audit
Correct items
100 pads
0.50 mm pitch
14 × 14 mm package body outline
16 × 16 mm nominal lead-tip envelope represented by the package geometry
Pad width: 0.30 mm, matching ST's footprint example
Pin-1 marker and counter-clockwise numbering arrangement appear consistent with an LQFP top view
Land-pattern mismatch
ST's datasheet footprint example indicates approximately:
Land width: 0.30 mm
Land length: 1.20 mm
Outer land-pattern span: 16.7 × 16.7 mm
Inner span: 14.3 mm
The current footprint uses 0.30 × 1.475 mm pads centered 7.738 mm from the origin. This produces approximately:
Outer copper span: 16.951 mm
Inner copper span: 14.001 mm
Therefore the pads are about 0.275 mm longer than the ST example and extend both farther inward and outward. The footprint may still be solderable, but it does not match the manufacturer's illustrated land pattern and reduces toe-to-courtyard margin. This should be reviewed against the intended IPC density level or replaced with the ST recommended dimensions.
The footprint filename QFP50P1600X1600X160-100N correctly encodes 0.50 mm pitch, 16 × 16 mm overall package span, 1.60 mm max height, and 100 leads.
Mismatches and recommended corrections
Critical metadata: Change the description from 2-Mbyte Flash to 1-Mbyte Flash for the G memory-density code.
Classification: Change Part Type from generic Integrated Circuits / Logic to Microcontroller and remove the erroneous Logic Function = AND classification.
Terminal quality: Add datasheet-derived Pin Description values and meaningful Pin Type classifications for all 100 terminals.
Package metadata: Add Package or Case Code: LQFP100 (14 × 14 mm, 0.50 mm pitch) and operating-temperature metadata.
Footprint: Review the 1.475 mm land length versus ST's 1.20 mm footprint example; current pads are longer by 0.275 mm.
Datasheet URL: No action required. The existing URL is official and applicable to the exact device family.
Overall assessment
The primary 100-pin symbol mapping is correct for STM32H563VGT6's LQFP100 LDO configuration. The main risks are incorrect Flash metadata, incorrect IC classification, absent terminal descriptions/types, and a footprint land length that differs materially from ST's example.