STM32H503 Pin Grouping

flux

I’ll consolidate the symbol into 10 ordered functional groups, assign Power as order 1/Top and Ground as order 10/Bottom, then alternate the other groups across Left and Right and verify all 48 pins remain intact.
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STM32H503 Symbol Grouping
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flux

The 10-group update is complete. I’m checking the final order/orientation assignments and terminal count before closing.

flux

Completed and verified all 48 terminals:
  1. Power — Top
  2. Clock HSE — Left
  3. Clock LSE — Right
  4. System — Left
  5. GPIOA Low — Right
  6. GPIOA High — Left
  7. GPIOB Low — Right
  8. GPIOB High — Left
  9. GPIOC — Right
  10. Ground — Bottom
No pins were added, removed, duplicated, or split into sub-symbols.
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Part Audit Report
Scope
Review of the published Flux part STM32H503CBT7TR against the official STMicroelectronics production datasheet:
Available part information

Table

FieldCurrent valueAssessment
Manufacturer Part NumberSTM32H503CBT7TRCorrect
ManufacturerSTMicroelectronicsCorrect
DescriptionArm Cortex-M33 32-bit MCU+FPU, 375 DMIPS, 250 MHz, 128 Kbytes flash memory, 32 Kbytes RAM, I3CCorrect and representative
Pin count48Correct (C ordering-code position)
PackageLQFP48, 7 × 7 mm body, 0.50 mm pitch, 1.60 mm maximum heightFootprint geometry is consistent
PackingTape and reel (TR)Correct
Temperature suffix7: −40 to +105 °C, up to +125 °C at low dissipationCorrect
Part TypeIntegrated CircuitsBroad but acceptable; “Microcontroller” would be more accurate
Part subtypeLogicIncorrect
Logic functionANDIncorrect
Datasheet URLOfficial ST PDF already setNo update required
Designator PrefixICAcceptable
Key specifications
  • High-performance STM32H5 microcontroller with an Arm Cortex-M33 CPU, FPU, DSP instructions, and MPU.
  • Maximum CPU frequency: 250 MHz; published performance: 375 DMIPS and 1023 CoreMark.
  • Memory: 128 Kbytes dual-bank Flash with ECC, 32 Kbytes SRAM with ECC, 2 Kbytes backup SRAM, and 2 Kbytes OTP.
  • Main application/I/O supply: 1.71–3.6 V.
  • Package/order code: C = 48 pins, B = 128-Kbyte Flash, T = LQFP, 7 = extended temperature grade, TR = tape and reel.
  • External clocks: HSE crystal/ceramic resonator range 4–50 MHz; LSE nominal 32.768 kHz.
  • Two VCAP pins are present. With the internal LDO enabled, each requires a 2.2 µF ±20%, ESR < 100 mΩ capacitor.
  • Absolute maximum external main supply: −0.3 to 4.0 V; maximum output current per I/O/control pin: 20 mA; total VDD/VSS current limit: 200 mA.
Symbol and pin cross-check
Pin numbers and names
All 48 symbol terminals match the LQFP48 top-view pinout in the datasheet. The sequence is correct from pin 1 VBAT through pin 48 VDD, including:
  • Pins 1–9: backup, oscillator, reset, and analog supply/reference pins.
  • Pins 10–21: PA0–PA7, PB0–PB2, PB10.
  • Pins 22–24: VCAP, VSS, VDD.
  • Pins 25–34: PB12–PB15, PA8–PA13.
  • Pins 35–36: VSS, VDD.
  • Pins 37–45: PA14, PA15, PB3–PB8, BOOT0.
  • Pins 46–48: VCAP, VSS, VDD.
The _1, _2, and _3 suffixes used on duplicate supply/power pad names are acceptable internal disambiguation and retain the correct physical pin numbers.
Symbol quality mismatches
  1. Every terminal has Pin Type = Unspecified. This loses useful ERC behavior. Supply pins should be typed as power/supply, BOOT0 as input, NRST as bidirectional reset, and GPIO pins as bidirectional.
  2. Pin Description is absent for all terminals. The datasheet provides pin type, I/O structure, reset behavior, alternate functions, and additional analog/wakeup/debug functions; none are captured.
  3. The rendered symbol is visually defective/illegible. Pin labels overlap heavily and extend beyond the body, making the symbol difficult to use despite the underlying pin-number mapping being correct.
  4. No sections, pin groups, orientations, or terminal ordering metadata are populated beyond absolute symbol positions. Functional grouping (power, clocks/reset, Port A, Port B, debug/boot) would substantially improve readability.
Footprint cross-check
Correct items
  • Exactly 48 copper pads are present and each is bound to the correct terminal number/name.
  • Pad pitch is 0.50 mm, matching the LQFP48 datasheet.
  • Fabrication body outline is 7 × 7 mm, matching the package body dimensions.
  • Overall nominal lead-span representation is 9 × 9 mm, matching datasheet dimensions D and E.
  • Package height encoded in the footprint name is 1.60 mm, matching the datasheet maximum.
  • Pin-1 marking and counterclockwise numbering are consistent with the package top view.
Footprint observations
  • The copper lands are 0.30 × 1.475 mm. They are plausible IPC-style LQFP lands and align correctly with the 0.50 mm pitch. The ST datasheet provides package mechanical dimensions rather than a unique mandatory PCB land pattern, so no footprint mismatch was identified from the available evidence.
  • The 3D model is attached and appears nominally unrotated/unscaled. A mechanical STEP-overlay inspection was not available in this audit, so seating/alignment is not independently confirmed.
High priority
  • Change the semantic classification from Logic / AND to Microcontroller (or equivalent MCU classification). The current values are objectively incorrect and may corrupt search/filter behavior.
  • Populate terminal electrical types and pin descriptions from the STM32H503xx pin-definition table.
  • Rebuild or reorganize the schematic symbol to eliminate overlapping labels and provide functional grouping.
Medium priority
  • Change the broad Part Type from Integrated Circuits to Microcontroller, if supported by the part taxonomy.
  • Add package metadata explicitly: LQFP48 / 7 × 7 mm / 0.50 mm pitch / package code 5B.
  • Add useful parametric properties such as operating voltage, maximum frequency, Flash, SRAM, and operating temperature.
Overall verdict
The MPN, manufacturer, datasheet, description, 48-pin mapping, and LQFP48 footprint geometry are consistent with the official datasheet. The part is electrically risky to use in its current schematic form because all pin electrical types and descriptions are missing, the semantic classification says “Logic / AND,” and the rendered symbol is severely cluttered. The footprint itself shows no confirmed dimensional or pin-number mismatch.

  • Scope

  • Available part information

  • Key specifications

  • Symbol and pin cross-check

  • Pin numbers and names

  • Symbol quality mismatches

  • Footprint cross-check

  • Correct items

  • Footprint observations

  • Mismatches and recommended corrections

  • High priority

  • Medium priority

  • Overall verdict