I’ll correct the part metadata and pin data first, then rebuild/scale the LGA footprint from the Telit land-pattern evidence and verify sampled pads afterward.
Metadata is updated with corrected supply range, AP variant band notes, and Telit form-factor details. I’m now applying the full pin-table descriptions and type corrections.
The pin table metadata is now updated, including SIMVCC as module-generated outputs, USB_VBUS as a sense input, ground pins as Ground, and reserved pins as no-connect. Next I’m replacing the imported mis-scaled footprint with a 15 x 15 LGA grid using the Telit 1.8 mm pitch / 0.7 mm pad evidence.
Completed the footprint, pin metadata, and description cleanup. I updated the detailed fix log in LE910C1-AP Part Review.
Open items:
The detailed Telit hardware guide source is still from mirrored/FCC/Arrow copies; the project uses the official public Telit product brief as the Datasheet URL.
If the published library index lags behind project metadata, re-publish/re-index the part.
Suggested next steps:
Re-publish the component so downstream projects pick up the corrected footprint and pin metadata.
Run a visual footprint check against Telit Figure 24 before release.
Add controlled-impedance defaults for RF/USB/SGMII pins if this part will be reused in routed designs.