Datasheet identified by Flux OCR: EC21 Series Hardware Design, version 1.9, released 2021-08-17.
Project Metadata Review
Table
Field
Project value
Datasheet cross-check
Status
Manufacturer Part Number
EC21AUVFA512STD
Datasheet covers EC21 series and EC21-AU / EC21-AUX variants; OCR note says EC21-AUV-related information was deleted in this v1.9 revision.
Needs caution
Manufacturer
Quectel
Datasheet is Quectel EC21 Series Hardware Design.
OK
Part Type
Cellular Module
LTE/UMTS/GSM wireless communication module.
OK
Package or Case Code
Module
SMD module, 144 pins: 80 LCC + 64 LGA.
OK but could be more specific
Pin count / pads
Project has 132 schematic terminal components and 132 PCB pads
Datasheet module has 144 physical pins, but pins 73-84 are explicitly marked as a keepout area that should not be designed in schematic or PCB decal.
OK if intentional; document as 144 physical / 132 exposed pads
Datasheet property
Set
Existing URL is usable. No update required.
OK
Key Datasheet Specs
Cellular module series: LTE Cat 1 EC21 series.
Variant relevant to part naming: EC21-AU family; note that the exact AUV variant may not be fully described in this v1.9 datasheet because the OCR text states EC21-AUV-related information was deleted in this revision.
LTE bands for EC21-AU: FDD B1/B2/B3/B4/B5/B7/B8/B28; TDD B40.
WCDMA bands for EC21-AU: B1/B2/B5/B8.
GSM bands for EC21-AU: 850/900/1800/1900 MHz.
GNSS support listed for EC21-AU: GPS, GLONASS, BeiDou/COMPASS, Galileo, QZSS.
Supply voltage: 3.3 V min, 3.8 V typ, 4.3 V max on VBAT_BB and VBAT_RF.
Absolute maximum VBAT_RF/VBAT_BB: -0.3 V to 4.7 V.
Peak current: VBAT_BB up to 0.8 A; VBAT_RF up to 1.8 A; IVBAT peak current max 2.0 A during transmission slot.
USB_VBUS: 3.0 V min, 5.0 V typ, 5.25 V max; absolute max -0.3 V to 5.5 V.
Digital pins: absolute max -0.3 V to 2.3 V; most digital interfaces are 1.8 V domain unless otherwise noted.
USB 2.0 differential pair: 90 ohm differential impedance required.
Antenna interfaces: ANT_MAIN, ANT_DIV, ANT_GNSS are 50 ohm RF interfaces.
Mechanical size: 29.0 ±0.15 mm × 32.0 ±0.15 mm × 2.4 ±0.2 mm.
Weight: approximately 4.9 g.
Operating temperature: -35 °C to +75 °C; extended range -40 °C to +85 °C; storage -40 °C to +90 °C.
Package: SMD module with 144 pins total, including 80 LCC pins and 64 LGA pins.
Symbol / Terminal Cross-Check
The project represents the part as 132 terminal components. Pin names, pin numbers, and functional sections match the datasheet for the exposed pins reviewed. Examples:
Project intentionally omits pins 73-84. The datasheet explicitly says these pins should not be designed in the schematic or PCB decal and should serve as a keepout area. Therefore the 132 project pads are acceptable if the intent is to expose only solderable/designed pads. The project metadata or description should ideally say 144 physical pins; 132 exposed schematic/PCB pads; pins 73-84 are keepout / not designed.
Footprint / Mechanical Cross-Check
The project layout contains 132 pad nodes, consistent with omitting pins 73-84.
The footprint includes an associated STEP model reference.
The datasheet recommended footprint notes that the pin 73-84 area is a keepout and should not be designed, and recommends about 3 mm clearance between the module and nearby motherboard components for maintenance.
The layout inspection showed pad coordinates and sizes in very small numeric values while rule overrides show text placement in mm; this appears to be an internal unit/display convention. I did not flag it as a mismatch solely from the readout, but the footprint should still be visually/mechanically verified against Figure 46 before release.
Mismatches / Risks Flagged
Variant documentation risk: The MPN contains AUV, but the available EC21 Series Hardware Design v1.9 OCR states EC21-AUV-related information was deleted in this revision. The datasheet covers EC21-AU and EC21-AUX family data, so electrical/mechanical information is likely applicable, but exact ordering-code / regional certification details for EC21AUVFA512STD should be confirmed from Quectel ordering documentation.
Pin-count wording risk: Project context says Pads: 132, while datasheet says 144 physical pins. This is not necessarily wrong because pins 73-84 should not be designed, but the distinction should be documented in metadata.
Footprint precision risk: The recommended footprint is figure-based in the datasheet. I confirmed pad count and keepout rule conceptually, but a final mechanical verification should compare every pad size/location and keepout against Figure 46 or an official CAD footprint.
Description supply-voltage mismatch: The project description says 3.0 V to 3.6 V supply. Datasheet Table 43 / key features specify VBAT 3.3 V min, 3.8 V typ, 4.3 V max. This should be corrected in the description/properties if this project is meant to reflect the Quectel EC21 datasheet.
Recommended Follow-Up
Update project description supply range from 3.0-3.6 V to 3.3-4.3 V, typical 3.8 V.
Add a metadata note or implementation detail: 144 physical pins; 132 designed pads; pins 73-84 are keepout / not in schematic or PCB decal per datasheet.
Obtain Quectel ordering-code documentation for EC21AUVFA512STD to confirm exact variant bands, GNSS, voice/data feature, and regulatory SKU details.
Perform a footprint-by-footprint measurement audit against Figure 46 or import/compare the official Quectel footprint if available.