Implemented the requested fixes: supply-cap pins are now VDDPLL_CAP, VDDDRV_CAP, and VDDD_CAP with passive/internal-regulator descriptions; 1.8 V rails are VDDPLL, VDDDRV, and VDDD; exposed pad is DAP_GND with a thermal pad/GND description. The RHB-32 footprint was corrected to TI land-pattern dimensions: 0.5 mm pitch, 0.25 × 0.6 mm perimeter pads, and 3.7 × 3.7 mm exposed pad.
Open items:
- Full review reports one remaining issue: project documentation is missing.
- No component/pin/footprint review errors were returned in the focused checks I ran.
Suggested next steps:
- Add a short project specification/design-notes document to clear the documentation review error.
- Re-run review after documentation is added.
- Optionally add TI package-source notes to the part properties for traceability.