Part Datasheet Audit

flux

I’ll correct the part properties and pad geometry to TI’s recommended land pattern, then perform a fresh symbol/footprint audit.

flux

I’m reading the current pad rules and pin metadata now; after that I’ll apply only datasheet-backed changes.

flux

The project is a part definition: nine terminal objects form the symbol. I’m now resolving the exact pad nodes and authoritative TI pin/land-pattern data before editing.

flux

The part-level manufacturer and datasheet fields are present; the MPN remains the non-orderable base name. I’m confirming the exact DSG drawing and recommended solder-land dimensions before changing it.

flux

Metadata, pin roles, and all nine lands are updated. I’m doing the final read-back now to verify dimensions, pin numbering, and stored properties.

flux

Updated and re-checked the part against TI’s DSG0008A data.
  • Corrected MPN to DRV8231DSGR, package to 8-WSON, and added operating, temperature, and descriptive metadata.
  • Corrected signal lands to 0.50 × 0.25 mm, centered at X = ±0.70 mm, with 0.50 mm pitch.
  • Corrected exposed pad to 0.90 × 1.60 mm.
  • Added datasheet-backed descriptions and electrical types for all nine terminals.
  • Verified pin names, numbering, pad positions, package body, and footprint orientation; no remaining pinout or effective-geometry mismatches found.
Sign up to send

Files

Pins

Symbol

Layout

3D View

VREF
Pin Number
4
Thermal_Pad
Pin Number
9
GND
Pin Number
1
IN1
Pin Number
3
OUT2
Pin Number
8
ISEN
Pin Number
7
IN2
Pin Number
2
VM
Pin Number
5
OUT1
Pin Number
6
Name
Pin #
Type
Section
Pin Group
Orientation
Order
Sub-symbol
Pin Description
GND
1
Ground
Logic ground; connect to board ground.
IN2
2
Input
Logic input controlling the H-bridge output; internal pulldown.
IN1
3
Input
Logic input controlling the H-bridge output; internal pulldown.
VREF
4
Input
Analog current-regulation reference input; 0 V to 5 V.
VM
5
Power In
Motor power supply input; bypass to ground with 0.1 uF and bulk capacitance.
OUT1
6
Output
H-bridge output; connect to motor or other inductive load.
ISEN
7
Ground
High-current ground and current-sense path; connect through sense resistor or directly to ground.
OUT2
8
Output
H-bridge output; connect to motor or other inductive load.
Thermal_Pad
9
Ground
Exposed thermal pad; solder to board ground with a large copper area and thermal vias.

DRV8231DSG