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ASM330LHHXTR Part Review
Date: 2026-06-29
Updates completed
  • Datasheet URL set to official STMicroelectronics datasheet: https://www.st.com/resource/en/datasheet/asm330lhhx.pdf
  • Package metadata corrected by removing the non-datasheet Package or Case Code = 14-VFLGA project property and adding Implementation Details = Package: LGA-14L, 2.5 x 3.0 x 0.86 mm max height.
  • Detailed datasheet-based Pin Description properties were added to all 14 terminal pins.
  • Footprint dimensions were re-verified against ST datasheet package data and TN0018-derived land recommendations.
Key datasheet specs
  • Function: 6-axis automotive IMU with 3-axis accelerometer + 3-axis gyroscope, embedded machine-learning core, dual operating modes.
  • Qualification/application: AEC-Q100 qualified; automotive non-safety applications; Android Auto and CarPlay compliant.
  • Supply voltage: VDD 1.71–3.6 V; VDD_IO 1.62–3.6 V.
  • Operating temperature: -40 to +105 °C.
  • Accelerometer full scales: ±2, ±4, ±8, ±16 g.
  • Gyroscope full scales: ±125, ±250, ±500, ±1000, ±2000, ±4000 dps.
  • Interfaces: I²C, MIPI I3C SDR, SPI 3-/4-wire; SPI modes 0 and 3 up to 10 MHz.
  • Recommended decoupling: VDD_IO 100 nF; VDD 100 nF + 10 µF.
Package / footprint verification
Datasheet package: LGA-14L, 14-lead plastic land grid array, 2.50 ±0.10 mm × 3.00 ±0.10 mm body, 0.86 mm max height.
Footprint asset inspected: XDCR_ASM330LHHXTR.kicad_mod.
Observed footprint data:
  • Pad count: 14 SMD rectangular pads — matches datasheet.
  • Copper pad sizes: 0.575 × 0.350 mm or 0.350 × 0.575 mm depending on side/orientation — matches derived ST TN0018 recommendation from 0.475 × 0.250 mm package pads plus 0.1 mm land growth.
  • Solder mask openings: 0.675 × 0.450 mm — matches TN0018 recommendation of PCB land + 0.1 mm mask opening.
  • Fab/body outline: 3.0 × 2.5 mm — matches package body dimensions, with axis orientation swapped relative to drawing view but correct physical size.
  • Courtyard: 3.5 × 3.0 mm — reasonable clearance around 3.0 × 2.5 mm body.
  • Pin-1 marker: present near pin 1 — acceptable.
Result: Footprint dimensions are consistent with the datasheet and ST LGA soldering guidance.
Note: layout tree computed-rule display shows pad sizes/positions as meter-scale numeric values while labeling unit as mm; the embedded KiCad footprint payload itself confirms the intended dimensions in millimeters.
Pin descriptions added

Table

PinTerminalDescription added
1SDO/SA0SPI 4-wire serial data output; I²C/MIPI I3C least significant address bit.
2MSDAMode 1 connect to VDD_IO or GND; Mode 2 I²C master serial data.
3MSCLMode 1 connect to VDD_IO or GND; Mode 2 I²C master serial clock.
4INT1Programmable interrupt output; sampled at power-up for I²C/I3C coexistence behavior.
5VDD_IOI/O power supply, 1.62–3.6 V; 100 nF recommended.
6NCMay be connected to VDD_IO/GND or left unconnected.
7GNDGround / 0 V supply return.
8VDDMain supply, 1.71–3.6 V; 100 nF + 10 µF recommended.
9INT2Programmable interrupt 2 / DEN; Mode 2 MDRDY.
10NCLeave electrically unconnected and solder pad to PCB.
11NCLeave electrically unconnected and solder pad to PCB.
12CSI²C/MIPI I3C/SPI mode selection.
13SCLI²C/MIPI I3C SCL; SPI SPC.
14SDAI²C/MIPI I3C SDA; SPI SDI; 3-wire SPI SDO.
Remaining notes
  • The project-level properties available through the metadata tool do not include a dedicated standard Package or Case Code field; the corrected package is therefore stored in Implementation Details and the old non-standard Package or Case Code entry was removed.
  • Symbol pin numbering and names match the datasheet.
  • Footprint geometry is verified as correct against the datasheet/TN0018-derived dimensions.

  • Updates completed

  • Key datasheet specs

  • Package / footprint verification

  • Pin descriptions added

  • Remaining notes