Part Datasheet Review
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Created a project doc
Part Review - TE Connectivity 2292838-3
Reviewed available part information for the published Flux part project 2292838-3, searched for the official datasheet when none was present...
I created the detailed part review file with the source links, footprint comparison, and mismatch notes: Part Review - TE Connectivity 2292838-3.
Thought for 41 sec
Updated the part’s Datasheet URL to the official TE Connectivity datasheet and completed the symbol/footprint review. Full details are in Part Review - TE Connectivity 2292838-3.
Open items:
- Symbol has two passive terminals for what TE documents as one conductive spring contact body; pin descriptions are missing.
- Pad
1_2height should be visually rechecked against TE’s customer drawing because it may use the 1.0 mm body width rather than the 0.78 mm land/metal-mask dimension.
Suggested next steps:
- Add clear pin descriptions for
1_1and1_2. - Verify pad
1_2against the official drawing image. - Add structured ratings: 1.5 A, 10 VDC, −40 °C to +85 °C.
Fix symbol and ratings
Fix pin descriptions
Verify pad geometry
Add structured ratings
Run part review
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Ask about this doc
Part Review - TE Connectivity 2292838-3
Scope
Reviewed available part information for the published Flux part project
2292838-3, searched for the official datasheet when none was present, updated the part metadata with the official datasheet URL, and cross-checked the schematic terminals, footprint geometry, and pin descriptions against TE Connectivity source documents.Project metadata observed
Table
| Field | Current value |
|---|---|
| Project / part name | 2292838-3 |
| Manufacturer | TE Connectivity |
| Manufacturer Part Number | 2292838-3 |
| Part Type | Connector |
| Designator Prefix | J |
| Datasheet URL | https://www.te.com.cn/chn-zh/product-2292838-3.datasheet.pdf |
| Published Part UID | 42f85592-9b59-44ed-bda5-97e3b1555db7 |
Official source documents used
Table
| Source | URL | Notes |
|---|---|---|
| TE product page | https://www.te.com/en/product-2292838-3.html | Official high-level product data and document index |
| TE product datasheet | https://www.te.com.cn/chn-zh/product-2292838-3.datasheet.pdf | Official generated datasheet URL added to the part |
| TE customer drawing C-2292838 | https://www.te.com/commerce/DocumentDelivery/DDEController?Action=srchrtrv&DocFormat=pdf&DocLang=English&DocNm=2292838&DocType=Customer+Drawing&PartCntxt=2292838-3 | Most authoritative source for footprint/mechanical validation |
| TE product specification 108-115104 | https://www.te.com/commerce/DocumentDelivery/DDEController?Action=srchrtrv&DocFormat=pdf&DocLang=English&DocNm=108-115104&DocType=Specification+Or+Standard&PartCntxt=2292838-3 | Source for voltage/current/environmental ratings |
Key official specifications
Table
| Spec | Official value |
|---|---|
| Product family | PCB Spring Contacts |
| Description | Ultra Small C-Clip PCB Spring Contact, side protected |
| Internal TE description | PLATED SPRING FINGER WITH PACKAGING |
| Uncompressed height | 1.1 mm |
| Overall length | 2.7 mm |
| Overall width | 1.0 mm |
| Contact working range | 0.4 mm to 0.75 mm |
| Current rating | 1.5 A max |
| Voltage rating | 10 VDC |
| Operating temperature | -40 °C to +85 °C |
| Base material | Stainless steel |
| Underplating | Nickel |
| Contact / solder area plating | Gold |
| Termination | Printed circuit board, SMD solder attachment |
| Packaging | Tape and reel, 10,000 per reel |
| Circuit application | Signal / grounding spring contact use case |
Current schematic symbol / terminal model
The current part symbol is represented by two terminal components:
Table
| Terminal | Current properties |
|---|---|
1::440234f6 | Part Type: Terminal; Pin Type: Passive; Pin Number: 1_2; no Pin Description |
1::930d728c | Part Type: Terminal; Pin Type: Passive; Pin Number: 1_1; no Pin Description |
Symbol findings
- TE’s drawing does not define two independent electrical contacts. It shows a single spring contact body with two solder/land regions.
- The current two-terminal model can be valid as a CAD implementation only if
1_1and1_2are understood as two solder lands for the same conductive spring contact. - The absence of Pin Description is a mismatch/caveat: users may incorrectly infer two independent connector pins.
- Recommended clarification: add pin descriptions such as:
1_1: Spring contact solder land; same conductive contact body as1_2.1_2: Spring contact solder land; same conductive contact body as1_1.
- If the platform supports it, a cleaner model would be one logical schematic contact mapped to two footprint pads.
Current footprint model
Current footprint asset:
TE_2292838-3.kicad_mod.Table
| Feature | Current footprint value | Datasheet/drawing comparison |
|---|---|---|
| Mounting style | SMD | Matches official PCB termination / solder attachment |
| Pad count | 2 SMD pads | Matches the two recommended land regions shown in TE drawing |
Pad 1_1 | center x = -0.8 mm, y = 0; size 1.1 mm × 0.78 mm | Longitudinal span aligns with left-edge references 0.0 to 1.1 mm; 0.78 mm dimension aligns with extracted land/metal-mask height |
Pad 1_2 | center x = +0.5 mm, y = 0; size 0.9 mm × 1.0 mm | Longitudinal span aligns with left-edge references 1.4 to 2.3 mm; y-size should be visually rechecked against TE drawing because 1.0 mm may be body width rather than recommended land/metal-mask height |
| Fab outline | 2.7 mm × 1.0 mm | Matches official overall length × width |
| Courtyard | 3.2 mm × 1.5 mm | Reasonable library courtyard; not explicitly validated as TE-defined |
| Pad numbering | 1_1, 1_2 | CAD convention only; TE drawing does not label pad numbers |
Footprint geometry derivation
Using the current fab outline left edge as x = -1.35 mm:
- Pad
1_1spans x = -1.35 mm to -0.25 mm, equivalent to 0.0 mm to 1.1 mm from TE’s left-edge datum. - Gap spans 1.1 mm to 1.4 mm from the left edge.
- Pad
1_2spans x = +0.05 mm to +0.95 mm, equivalent to 1.4 mm to 2.3 mm from the left-edge datum. - Right edge is x = +1.35 mm, equivalent to 2.7 mm from the left-edge datum.
This matches the extracted TE drawing references 1.1, 1.4, 2.3, and 2.7 REF. Therefore, the longitudinal pad placement appears consistent.
Mismatches and caveats flagged
- Schematic terminal ambiguity: Current symbol exposes two passive terminals (
1_1,1_2) even though the physical part is a single conductive spring contact. This should be documented so users do not route separate nets to the two pads. - Missing pin descriptions: Both terminals lack Pin Description. This is the main symbol metadata gap.
- Pad names are not official TE pin numbers: The TE drawing shows two unnumbered land regions.
1_1and1_2are implementation names, not datasheet pin names. - Potential footprint y-size ambiguity on pad
1_2: Pad1_2is 0.9 mm × 1.0 mm. The extracted TE drawing data includes a 0.78 mm land/metal-mask height and a 1.0 mm overall body width. Verify visually against the official customer drawing whether1_2should remain 1.0 mm tall or use 0.78 mm like1_1. - Ratings not fully represented as structured properties: The project now has the datasheet URL, MPN, manufacturer, part type, and prefix. It does not appear to have structured fields for 1.5 A current rating, 10 VDC voltage rating, -40 °C to +85 °C operating range, 0.4 mm to 0.75 mm working range, or plating/material details.
- Footprint source should cite customer drawing: The datasheet URL is appropriate for general specs, but the official customer drawing C-2292838 is the better source for mechanical/land-pattern verification.
Overall assessment
The part metadata is now tied to an official TE datasheet URL. The footprint’s overall outline and longitudinal pad placement appear consistent with the TE customer drawing. The main risks are symbol semantics and documentation: the two exposed terminals represent two solder lands of one conductive spring contact, not two independent connector contacts. The only footprint dimension requiring further visual verification is pad
1_2 y-size, because the available extracted drawing data distinguishes 0.78 mm land/metal-mask height from the 1.0 mm overall body width.Scope
Project metadata observed
Official source documents used
Key official specifications
Current schematic symbol / terminal model
Symbol findings
Current footprint model
Footprint geometry derivation
Mismatches and caveats flagged
Overall assessment
