Official SCHURTER domain and document; already set, so no required insertion. HTTPS is preferable: https://www.schurterinc.com/bundles/snceschurter/epim/_ProdPool_/newDS/en/typ_OGN-SMD.pdf
Key manufacturer specifications
Product: OGN-SMD open-design PCB fuseholder for 5 × 20 mm fuse links
Rated current: 10/16 A (VDE), 16 A (UL/CSA), subject to fuse and thermal derating
Rated power acceptance: 4 W / 16 A at 23 °C; cover-dependent limits include 4 W / 10 A with black cover and 2.5 W / 10 A with transparent cover
Ambient temperature: −40 °C to +85 °C
Contact resistance: ≤ 10 mΩ at 100 mA
Dielectric strength: > 3 kV between live parts
Impulse withstand voltage: > 4 kV
Insulation resistance: ≥ 10 MΩ at 500 VDC
Socket material: UL 94 V-0 thermoplastic
Terminals: tin-plated copper alloy
Reflow: JEDEC J-STD-020; peak approximately 245–260 °C, maximum 30 s depending on stated condition
Packaging: blister tape, 400 pieces per reel
Approvals: VDE, UL recognition, CE declaration
Schematic symbol cross-check
The symbol contains two terminals numbered 1 and 2. This is electrically correct for a single-circuit fuseholder, and the terminal numbers correspond to footprint pads 1 and 2.
Symbol issues
Both terminal pin types are Unspecified. Passive is the more accurate electrical classification.
No functional pin descriptions are present. Suggested descriptions: Fuse terminal 1 and Fuse terminal 2.
The symbol is represented as two terminal primitives; confirm that the rendered graphic clearly communicates a fuseholder/fuse path rather than two unrelated pins.
Designator prefix U is unconventional. F or FH would make BOM and schematic intent clearer.
The holder is non-polarized, so swapping terminal 1 and terminal 2 has no electrical effect.
Footprint cross-check
Verified matches
Two SMD rectangular pads: correct.
Pad size: 6.0 mm × 6.0 mm: matches the recommended soldering pads.
Pad centers: −8.5 mm and +8.5 mm, giving 17.0 mm center-to-center spacing.
With 6 mm pads, the inner pad gap is 11.0 mm: matches the datasheet layout.
Fabrication outline: 22.7 mm × 9.6 mm: matches the principal body dimensions shown in the datasheet.
Footprint has a STEP model and pad numbering is consistent with the symbol.
Footprint concerns
The silkscreen geometry has a project-level position override of approximately +1.8009 mm X and −14.4806 mm Y. This appears to displace the silkscreen far away from the footprint body and should be visually inspected/corrected.
The reference text also has a large Y offset (~11.4 mm). This may be intentional for visibility, but is unusually distant from the body.
The courtyard is asymmetric (approximately X −13.4 to +12.5 mm). It may reflect installation/handling clearance, but should be checked against the intended assembly courtyard convention.
The footprint includes degenerate zero-length silk line/arc artifacts from import. They are not electrically harmful but reduce asset cleanliness.
The datasheet’s full height and installation geometry cannot be completely validated from 2D copper alone; the STEP model should be visually checked against 22.7 mm length, 10.8 mm maximum width, and 13.2 mm overall height.
Overall verdict
The critical manufacturing geometry—two pads, 6 × 6 mm pad size, 11 mm inner gap, 17 mm pad-center spacing, and 22.7 × 9.6 mm body outline—matches the datasheet. The main issues are metadata quality and asset presentation rather than copper geometry: blank Part Type, generic manufacturer classification, unconventional U prefix, unspecified pin types/descriptions, and apparently displaced silkscreen/reference graphics.
Recommended corrections
Change Part Type to Fuse Holder / Fuse Block.
Change designator prefix to FH (or F if required by the project convention).
Set both terminals to Passive and add functional descriptions.
Replace the stored HTTP datasheet link with the HTTPS equivalent when convenient.
Re-center the silkscreen and review the reference text/courtyard placement.
Visually compare the STEP model dimensions and seating to the manufacturer mechanical drawing.