2-Channel Isolated Blast Gate Controller with Automotive-Grade Field IO and XIAO ESP32C3 Central Control
Properties
Internal Layer 2, Internal Layer 3
Microcontroller
5V pin from 5V rail as supply
Standard 4 Layer
Copper fill on Top and Bottom layers connected to GND net
right-angle
Diagram
Define no-copper keepout zones around all connector pins and each test point. Ensure a minimum exclusion area of sufficient size to mitigate vibration-induced solder joint stress and to preserve ground plane continuity wherever possible. Intent: Enhance mechanical reliability and maintain EMI integrity by preventing copper flood encroachment under and around connectors/test pads.