JST XH Connector Header Through Hole 2 position 0.098" (2.50mm) B2B-XH-A(LF)(SN) is a 2-position, 2.50 mm pitch, through-hole shrouded male PCB header from the JST XH Series. It is designed for reliable wire-to-board connections in consumer electronics, industrial equipment, power supplies, battery packs, and embedded systems. The connector features a polarized shrouded housing to prevent incorrect mating and supports secure, dependable electrical connections with easy PCB assembly. Key Features: 2-position wire-to-board header 2.50 mm contact pitch Through-hole (THT) PCB mounting Straight vertical orientation Shrouded housing with polarization to prevent misalignment Rated for up to 3 A current and 250 V AC/DC Tin-plated brass contacts for reliable conductivity Operating temperature range: -25°C to +85°C Compatible with JST XH Series crimp housings and terminals Ideal for power and signal connections in compact electronic assemblies. #JST #XHSeries #PCBHeader #WireToBoard #Connector #ThroughHole #THT #ShroudedHeader #2Position #25mmPitch #Electronics #EmbeddedSystems #IndustrialElectronics #PowerConnector #PCBDesign

MAX-M10 RF Receiver BeiDou, Galileo, GLONASS, GPS, GNSS 1.561GHz, 1.575GHz, 1.602GHz -167dBm 921.6kbps Not Included Module The MAX-M10S-00B is a professional-grade, ultra-low-power GNSS positioning module from u-blox based on the u-blox M10 platform. It is designed for battery-powered applications such as asset trackers, wearables, IoT devices, and navigation systems. The module supports simultaneous reception of multiple GNSS constellations, providing high positioning availability, fast acquisition times, and excellent sensitivity even in challenging urban or weak-signal environments. It integrates a TCXO, LNA, and SAW filter to improve RF performance while maintaining very low power consumption. Key Features Multi-constellation GNSS receiver: GPS Galileo GLONASS BeiDou QZSS SBAS support (WAAS, EGNOS, MSAS, GAGAN) Concurrent tracking of up to four GNSS constellations for improved position availability and accuracy. Ultra-low power consumption: Approximately 25 mW in continuous tracking mode, making it ideal for battery-powered devices. High RF sensitivity: Tracking sensitivity up to −167 dBm for reliable operation in weak-signal conditions. High positioning accuracy: Typical position accuracy of approximately 1.5 m CEP under suitable conditions. Navigation update rate: Up to 10 Hz for responsive tracking applications. Integrated RF front-end: Built-in LNA (Low Noise Amplifier) Built-in SAW filter Integrated TCXO for stable operation. Supports Assisted GNSS services: AssistNow Online AssistNow Offline AssistNow Autonomous CloudLocate support for low-power IoT positioning. Communication interfaces: UART I²C NMEA and UBX protocols supported. Wide operating temperature range: −40°C to +85°C. Supply voltage: 1.76 V to 3.6 V. Typical Applications Asset tracking devices Wearable electronics Fleet management systems Industrial IoT Smart meters Drone and robotics navigation Personal navigation devices Timing and synchronization systems Package Information Package Type: Surface-mount LCC module Dimensions: 9.7 mm × 10.1 mm × 2.5 mm (typical module size) #Commonpartslibrary #RF #Wireless #RFreceivers #MAXM10S #uBlox #GNSS #GPS #Galileo #GLONASS #BeiDou #QZSS #NavigationModule #GNSSModule #GPSTracking #AssetTracking #IoT #IndustrialIoT #WearableTech #FleetManagement #DroneNavigation #EmbeddedSystems #ElectronicsDesign #PCBDesign #HardwareEngineering #LowPowerDesign #LocationTracking #Geolocation #RFDesign #LNA #SMTModule

Bluetooth, WiFi 802.11b/g/n/ax, Bluetooth v5.4 Transceiver Module 2.4GHz Integrated, Chip Surface Mount Silicon Labs SiWG917 module is our lowest power Wi-Fi 6 plus Bluetooth LE 5.4, ideal for ultra-low power IoT wireless devices using Wi-Fi®, Bluetooth, Matter, and IP networking for secure cloud connectivity. It is optimal for developing battery operated devices that need long battery life. SiWG917 module includes an ultra-low power Wi-Fi 6 plus Bluetooth Low Energy (LE) 5.4 wireless CPU subsystem, and an integrated micro-controller (MCU) application subsystem, security, peripherals and power management subsystem all in a single 16 x 21.1 x 2.3 mm package. The wireless subsystem consists of a multi-threaded Network Wireless Processor (NWP) running up to 160 MHz, baseband digital signal processing, analog front end, 2.4 GHz RF transceiver and integrated power amplifier. The application subsystem consists of an ARM® Cortex®-M4 running up to 180 MHz, embedded SRAM, flash, ultra-low power sensor hub, and matrix vector processor. The ARM® Cortex®-M4 is dedicated for peripheral and application-related processing, while the NWP runs the wireless and networking stacks on independent threads, thus providing a fully integrated solution that is ready for a wide range of embedded wireless IoT applications. The modules come with modular radio type approvals for various countries, including USA (FCC), Canada (IC/ISED) and Japan (MIC), and are in compliance with the relevant EN standards (including EN 300 328 v2.2.2) for the conformity with the directives and regulations in EU and UK. KEY FEATURES • Wi-Fi 6 Single Band 2.4 GHz 20 MHz 1x1 stream IEEE 802.11 b/g/n/ax • Bluetooth LE 5.4 • Single chip Matter Over Wi-Fi Solution • ARM® Cortex® M4 Processor with FPU subsystem up to 180 MHz with rich set of Digital and Analog Peripherals. • Wi-Fi 6 Benefits: TWT for improved efficiency and longer battery life, MUMIMO/OFDMA for Higher Throughput, network capacity and low latency • Best in Class Device and Wireless Security • WLAN Tx power up to +17.5 dBm with integrated PA • Bluetooth LE Tx power up to +17 dBm with integrated PA • WLAN Rx sensitivity as low as -95.5 dBm • Wi-Fi 4 Standby Associated mode current: 71 μA @ 1-second listen interval • Embedded Flash option up to 8 MB/ optional external Flash up to 16 MB • Embedded PSRAM option up to 2 MB/ optional external PSRAM option up to 16 MB • Ultra-low power sensor hub peripherals • Matrix Vector Processor (MVP) • Embedded Wi-Fi, Bluetooth LE, Matter, and networking stacks supporting wireless coexistence • Three software-configurable MCU application memory options for sharing the RAM between the wireless, system, and application (192/256/320 KB) • Operating temperature: -40 to +85 ºC • Operating supply range: 3.0 to 3.63 V • Supply voltage for GPIOs: 1.71 to 3.63 V #WiFi6 #BluetoothLE54 #IoTModule #WirelessSoC #SiliconLabs #EmbeddedSystems #SmartHome #IndustrialIoT #LowPowerDesign #RFModule #ConnectedDevices #EdgeComputing #MatterReady #PCBDesign #ElectronicsEngineering

Red, Green, Blue (RGB) 624nm Red, 525nm Green, 470nm Blue LED Indication - Discrete 2V Red, 3.3V Green, 3.3V Blue 4-SMD, No Lead # 150080M153000 ## General Description The 150080M153000 is a compact surface-mount full-color RGB LED manufactured by Würth Elektronik as part of the WL-SFCD series. The device integrates red, green, and blue light-emitting elements within a single package, enabling the generation of a wide spectrum of colors for status indication, user interfaces, backlighting, visual notifications, and decorative lighting applications. Its diffused lens design provides uniform light distribution and wide viewing visibility, making it suitable for industrial equipment, consumer electronics, communication devices, instrumentation systems, control panels, and embedded electronic products. The component is optimized for automated assembly processes and offers reliable optical performance, low power consumption, and long operational life. ## Key Features ### Optical Characteristics * Full-color RGB light output * Integrated red, green, and blue emitters * Diffused lens design for uniform illumination * Wide viewing angle * High-visibility indication capability * Consistent color performance ### Electrical Characteristics * Low-power operation * Stable optical output * Suitable for indicator and backlighting applications * Reliable performance across operating conditions * Optimized for embedded electronic systems ### Mechanical Characteristics * Surface-mount package construction * Compact footprint * Low-profile package design * Compatible with automated assembly processes * Reflow-soldering compatible ### Package Construction * Common-anode configuration * Integrated multi-die LED architecture * Rectangular lens geometry * Lead-free package design * Industrial-grade construction ### Material Characteristics * High-quality encapsulation materials * Diffused optical lens * RoHS-compliant construction * Environmentally compliant materials ### Environmental Characteristics * Suitable for commercial and industrial applications * Long operational service life * Reliable operation under standard environmental conditions * Resistant to normal assembly and handling processes ### Application Areas * Status Indicators * User Interface Displays * Industrial Control Panels * Consumer Electronics * Home Appliances * Telecommunications Equipment * Instrumentation Systems * Backlighting Applications * Smart Devices * Embedded Electronic Products * Safety and Security Equipment * Human-Machine Interface Systems ### Compliance * RoHS Compliant * REACH Compliant * Lead-Free Compatible * Industry-Standard Surface-Mount Technology ## Manufacturer Würth Elektronik ## Product Family WL-SFCD SMD Full-Color Chip LED Series #150080M153000 #WurthElektronik #RGBLED #SMDLED #WLSFCD #FullColorLED #LEDIndicator #Backlighting #Optoelectronics #EmbeddedSystems #IndustrialElectronics #ConsumerElectronics #PCBDesign #ElectronicsEngineering #SMTAssembly #commonpartslibrary #optoelectronic #ledindication

2 Position Wire to Board Terminal Block Horizontal with Board 0.150" (3.81mm) Through Hole ## Engineering Specification ## General Description The **1727010** is a Phoenix Contact **MKDS series PCB terminal block** designed for secure wire-to-board electrical connection in printed circuit board assemblies. It provides a compact screw-clamp termination interface for connecting external conductors to PCB circuitry. The component is suitable for industrial electronics, automation equipment, control modules, power interfaces, instrumentation, and general electronic assemblies requiring reliable field wiring termination. ## Device Identification Manufacturer Part Number: **1727010** Manufacturer: **Phoenix Contact** Product Name: **MKDS 1/ 2-3,81** Product Series: **MKDS** Product Line: **COMBICON Terminals** Device Category: **Connector and Interconnect Component** Device Type: **PCB Terminal Block** Connection Type: **Wire-to-Board Terminal Block** Termination Method: **Screw Connection with Tension Sleeve** Mounting Type: **Through-Hole PCB Mount** ## Functional Description The device functions as a fixed PCB terminal block that allows external wires to connect directly to the printed circuit board. The screw-clamp mechanism provides both mechanical conductor retention and electrical continuity between the field wiring and PCB circuit. This makes the component suitable for applications where wiring must be secure, serviceable, and accessible during installation or maintenance. ## Mechanical Description The terminal block uses a compact housing with side-entry conductor access and through-hole solder pins for stable PCB attachment. Its construction supports organized wire routing and practical access for conductor insertion and screw tightening. The design is suitable for compact board layouts where reliable field wiring connection is required. ## Electrical Description The component is intended for signal and low-voltage power connection applications within the manufacturer’s specified electrical ratings. It provides stable electrical contact when used with compatible conductor sizes, correct wire preparation, and proper screw tightening torque. ## Material and Contact Description The terminal block uses an insulating housing with internal conductive contact elements that transfer current from the inserted conductor to the soldered PCB pins. The screw connection with tension sleeve helps maintain reliable contact pressure and secure conductor retention during normal operating conditions. ## Mounting and Assembly Description The **1727010** is intended for through-hole solder mounting on a printed circuit board. The PCB layout should follow the manufacturer’s recommended hole size, pad pattern, spacing, and soldering guidance. The component should be positioned to allow safe wire insertion, screwdriver access, and adequate clearance from nearby components or enclosure walls. ## Application Suitability The device is suitable for industrial control boards, automation modules, power supply interfaces, relay boards, instrumentation equipment, sensor wiring interfaces, building control systems, communication hardware, and other electronic products requiring secure PCB wire termination. ## Design Considerations The design should account for conductor size compatibility, current requirement, voltage rating, tightening torque, creepage and clearance spacing, solder joint strength, wire routing, and service access. The terminal block should not be used beyond the manufacturer’s specified electrical, mechanical, or environmental limits. ## Hashtags #commonpartslibrary #terminalblock #pcbterminalblock #phoenixcontact #mkds #combicon #wiretoboard #screwterminal #fixedterminalblock #throughholecomponent #soldermount #connector #interconnect #fieldwiring #industrialelectronics #automationequipment #controlsystems #powerinterface #pcbdesign #hardwaredesign #electronicscomponents #electronicparts #engineeringparts #componentlibrary #electronicsengineering

Tactile Switch SPST-NO Top Actuated Surface Mount ## Engineering Specification ## General Description The **MSLPT5252AG2TR** is a TE Connectivity ALCOSWITCH low-profile tactile switch designed for compact electronic devices, printed circuit board assemblies, portable electronics, control panels, and user-input interface applications. It provides momentary tactile feedback when pressed and returns to its normal open state when released. The device is suitable for applications requiring a small surface-mount switch with reliable actuation, compact board footprint, and low-profile mechanical construction. ## Device Identification Manufacturer Part Number: **MSLPT5252AG2TR** Manufacturer: **TE Connectivity** Brand Series: **ALCOSWITCH** Product Family: **LPT Low-Profile Tactile Switches** Device Category: **Electromechanical Component** Device Type: **Tactile Switch** Switch Function: **Single Pole Single Throw, Normally Open** ## Functional Description The device functions as a momentary user-input switch. When the actuator is pressed, the internal contacts close and allow an electrical signal path. When the actuator is released, the switch returns to its normally open condition. This makes the component suitable for button input, menu control, reset functions, mode selection, and general human-machine interface designs. ## Mechanical Description The switch uses a compact low-profile construction with a top-actuated flush actuator. It is intended for surface-mount installation on printed circuit boards and is suitable for space-constrained designs where low height and small board area are required. ## Electrical Description The MSLPT5252AG2TR is designed for low-current DC switching applications. It should be used within the manufacturer’s specified voltage and current ratings to ensure reliable operation and long service life. The switch is intended for signal-level control applications rather than high-power load switching. ## Contact and Material Description The switch includes stainless steel contact base material with silver contact plating. This construction supports reliable contact performance for tactile input applications and helps provide stable electrical switching behavior during normal operation. ## Mounting and Assembly Description The component is supplied as a surface-mount tactile switch suitable for automated PCB assembly. Proper land pattern design, soldering profile control, and mechanical clearance should be followed according to the manufacturer’s recommended layout and assembly guidelines. ## Application Suitability The device is suitable for portable electronic devices, consumer electronics, handheld equipment, control buttons, reset switches, interface panels, communication devices, instrumentation, remote controls, and compact PCB-based user-input systems. ## Design Considerations The switch should be placed in a location that allows direct actuator access without excessive mechanical side loading. PCB layout should provide proper solder pad support and mechanical stability. The design should avoid overtravel, excessive actuation force, contamination, and use beyond the rated electrical limits. ## Hashtags #commonpartslibrary #electromechanicalcomponent #tactileswitch #pushbuttonswitch #momentaryswitch #spstswitch #normallyopen #teconnectivity #alcoswitch #mslpt5252ag2tr #lptseries #smtcomponent #surfacemount #pcbdesign #electronicscomponents #electronicparts #switchcomponent #hardwaredesign #userinterface #embeddedhardware #consumer electronics #portableelectronics #componentlibrary #engineeringparts #electronicsengineering

0.5 mOhms ±1% 5W Chip Resistor Nonstandard Automotive AEC-Q200, Current Sense Metal Element # Engineering Specification ## Product Name CSS4J-4026R-L500F ## General Description CSS4J-4026R-L500F is a precision four-terminal Kelvin current sense shunt resistor designed for accurate current measurement in high-performance electronic and power management systems. The device is intended for use in applications requiring low resistance sensing, high measurement accuracy, and stable thermal performance under varying electrical loads. The component utilizes a metal element resistive structure optimized for minimal resistance drift, reduced temperature effects, and consistent long-term stability. Its four-terminal Kelvin configuration separates current flow and voltage sensing paths, enabling improved measurement accuracy by eliminating errors caused by PCB trace and connection resistance. The device is widely used in power conversion systems, battery monitoring systems, motor control circuits, and industrial power electronics where precise current feedback is essential for control, protection, and monitoring functions. Its surface-mount construction supports compact PCB layouts and automated assembly processes while maintaining robust mechanical and electrical reliability. The design emphasizes efficient heat dissipation, stable electrical characteristics, and compatibility with demanding industrial and automotive environments. It is suitable for integration into systems requiring continuous current monitoring and high measurement fidelity. ## Functional Requirements ### Current Measurement The device shall provide accurate current sensing through a low-resistance conductive path designed for minimal measurement error. ### Kelvin Sensing Operation The device shall support four-terminal Kelvin sensing to improve measurement accuracy by separating current and voltage sensing paths. ### Signal Stability The device shall maintain stable sensing characteristics under varying load and thermal conditions. ### System Integration The component shall support integration into power electronics and embedded control systems requiring precise current feedback. ## Electrical Requirements ### Low Resistance Operation The device shall exhibit very low resistance to minimize power loss and maintain measurement accuracy. ### Thermal Stability The resistor shall maintain consistent electrical behavior under elevated operating temperatures and thermal cycling conditions. ### Power Handling The device shall support operation in high-current environments typical of power conversion and motor control systems. ### Measurement Accuracy The design shall support precise voltage drop measurement proportional to current flow for control and monitoring applications. ## Mechanical Requirements ### Surface Mount Construction The device shall be provided in a surface mount package suitable for automated PCB assembly. ### Structural Integrity The component shall maintain mechanical stability during assembly, operation, and thermal cycling. ### PCB Integration The device shall support direct integration into multilayer printed circuit board designs with optimized current path layout. ## Environmental Requirements ### Operating Conditions The device shall operate reliably under industrial and automotive environmental conditions. ### Thermal Performance The component shall maintain performance stability under continuous electrical loading and heat generation. ### Storage and Handling The device shall maintain physical and electrical integrity during storage, transport, and handling procedures. ## Quality Requirements ### Reliability The device shall provide long-term stability in resistance value and sensing accuracy under continuous operation. ### Verification Electrical, thermal, and mechanical characteristics shall be validated through appropriate testing and qualification procedures. ### Compliance The product shall conform to applicable standards for current sensing resistors used in industrial and automotive electronics. ## Documentation Requirements Technical documentation shall include application guidelines, layout recommendations for Kelvin sensing, thermal considerations, electrical characteristics, and integration practices for power electronics systems. ## Classification Tags #CSS4J4026RL500F #CurrentSenseResistor #ShuntResistor #KelvinSensing #FourTerminalResistor #PowerElectronics #BatteryManagement #MotorControl #PowerSupplyDesign #AnalogSensing #ElectricalEngineering #PCBDesign #EmbeddedSystems #IndustrialElectronics #AutomotiveElectronics #CommonPartsLibrary #ComponentLibrary #EngineeringSpecification #TechnicalDocumentation #HighCurrentSensing #PrecisionMeasurement #CircuitDesign

24 MHz ±20ppm Crystal 18pF 60 Ohms 4-SMD, No Lead The ABM8G-24.000MHZ-18-D2Y-T is a compact 24.000 MHz surface-mount quartz crystal from Abracon's ABM8G series, designed to provide a stable and accurate clock reference for digital electronic systems. Housed in a miniature 3.2 × 2.5 mm, 4-pad SMD package, it is optimized for space-constrained applications while delivering reliable frequency performance over a wide operating temperature range. This crystal is commonly used in microcontrollers, wireless modules, communication equipment, networking devices, industrial electronics, and precision timing circuits. It operates in the fundamental mode with an 18 pF load capacitance, making it suitable for a broad range of oscillator circuits. Key Features 24.000 MHz fundamental-mode quartz crystal Compact 3.2 × 2.5 × 1.0 mm 4-pad SMD package 18 pF load capacitance ±20 ppm frequency tolerance ±30 ppm frequency stability Maximum 60 Ω ESR Wide operating temperature range: −40°C to +85°C Glass-sealed ceramic package for high reliability Compatible with standard IR reflow soldering processes Low-profile design suitable for compact PCB layouts Ideal for embedded systems, communications, wireless devices, and clock generation applications. #Abracon #QuartzCrystal #24MHz #ABM8G #SMDCrystal #TimingDevice #ClockSource #EmbeddedSystems #WirelessElectronics #IndustrialElectronics #PCBDesign #ElectronicsComponents

1.5µH Shielded Molded Inductor 9.1A 15.8mOhm Max 1616 (4040 Metric) The XFL4020-152MEC is a metal-composite core, shielded surface-mount power inductor with an inductance value of 1.5 µH and a current rating of 9.1 A. Its low DCR of 15.8 mΩ maximum helps reduce conduction losses, making it suitable for efficient power conversion designs. The component is rated for automotive-grade reliability (AEC-Q200) and operates over a wide temperature range of -40°C to +125°C. Key Features Inductance: 1.5 µH Tolerance: ±20% Maximum Current Rating: 9.1 A Saturation Current (Isat): Approximately 4.6 A Low DC Resistance (DCR): 15.8 mΩ max Shielded molded construction for reduced EMI radiation Metal composite core for high efficiency and compact size Surface-mount package: 1616 / 4040 metric Dimensions: approximately 4.0 mm × 4.0 mm × 2.1 mm Self-resonant frequency: 59 MHz AEC-Q200 qualified for automotive applications Operating temperature: -40°C to +125°C Typical Applications DC/DC switching converters Power supply filtering Voltage regulator modules (VRM) Battery-powered devices Automotive power electronics Embedded power management systems Hashtags #Coilcraft #XFL4020 #PowerInductor #ShieldedInductor #SMTInductor #DC_DCConverter #PowerElectronics #AutomotiveElectronics #AECQ200 #PCBDesign #ElectronicComponents #commonpartslibrary #inductor

ARM® Cortex®-M7 S32K3 Microcontroller IC 32-Bit Tri-Core 240MHz 8MB (8M x 8) FLASH 289-LFBGA (14x14) ## Engineering Specification ## General Description The **S32K358GHT1MJBST** is an NXP Semiconductors **S32K3 series automotive microcontroller** designed for high-performance embedded control applications in automotive, industrial, and electrically harsh environments. It is built around an **Arm Cortex-M7 architecture** and provides high processing capability, large embedded flash memory, automotive-grade qualification, security support, and a broad set of communication interfaces. The device is suitable for body control, gateway systems, vehicle networking, motor control, domain control, safety-related embedded systems, and general-purpose automotive electronic control units. ## Device Identification Manufacturer Part Number: **S32K358GHT1MJBST** Manufacturer: **NXP Semiconductors** Product Family: **S32K3** Device Category: **Integrated Circuit** Device Type: **Automotive Microcontroller** Core Architecture: **Arm Cortex-M7** Processing Class: **Thirty-Two-Bit MCU** Qualification: **Automotive Grade, AEC-Q100** ## Functional Description The device functions as a high-performance automotive microcontroller for embedded control and communication systems. It provides processing resources for real-time control, communication management, diagnostics, security handling, and system-level application logic. The microcontroller is designed for scalable automotive platforms where software reuse, safety capability, and peripheral integration are important. ## Core and Processing Description The **S32K358GHT1MJBST** uses an Arm Cortex-M7 based processing architecture with tri-core capability and high-speed operation. The core architecture supports digital signal processing, floating-point operation, interrupt handling, and real-time embedded software execution. This makes the device suitable for control systems that require strong computing performance and deterministic response. ## Memory Description The device includes large embedded flash memory for application firmware storage and integrated RAM for runtime operation, data buffering, communication stacks, and control algorithms. The memory architecture is suitable for complex embedded applications requiring large program space, diagnostics, bootloader support, and over-the-air update capability. ## Security and Safety Description The microcontroller includes hardware security support through **HSE-B security** and is intended for automotive applications where secure boot, cryptographic services, protected firmware operation, and system integrity are important. The S32K3 family also supports automotive safety-oriented development through features such as error correction, monitoring, and diagnostic capability. ## Communication and Interface Description The device supports multiple embedded communication interfaces suitable for vehicle and industrial networks. Supported interface types include CAN, Ethernet, I²C, SPI, UART, LIN, QSPI, SAI, SENT, and FlexIO. These interfaces allow the device to communicate with sensors, actuators, transceivers, memory devices, network controllers, and other electronic control units. ## Analog and Peripheral Description The microcontroller includes analog-to-digital conversion capability, timers, watchdog functions, direct memory access, serial audio support, and general-purpose input and output resources. These peripherals support sensing, control, timing, supervision, communication, and system management functions in embedded hardware designs. ## Electrical Description The device is designed for automotive low-voltage operation and supports use across a wide supply voltage range. It is intended for applications requiring reliable operation in automotive and industrial temperature environments. Proper power supply design, decoupling, reset control, clock configuration, and grounding should follow the manufacturer’s hardware design recommendations. ## Package and Mechanical Description The **S32K358GHT1MJBST** is supplied in a **surface-mount LFBGA package** with a compact ball-grid-array footprint. The package is intended for dense printed circuit board layouts requiring careful routing, controlled assembly process, thermal management, and proper solder joint reliability. ## Mounting and Assembly Description The component is intended for automated surface-mount PCB assembly using BGA-compatible manufacturing processes. PCB layout should follow the recommended footprint, ball escape routing, power-plane design, decoupling capacitor placement, thermal design, and inspection requirements for high-density automotive microcontroller assemblies. ## Application Suitability The device is suitable for automotive electronic control units, body control modules, gateway controllers, vehicle networking systems, motor control platforms, battery-related control systems, industrial controllers, safety-oriented embedded systems, and high-performance general-purpose control applications. ## Design Considerations The design should account for supply voltage range, clocking requirements, flash and RAM usage, thermal limits, package routing density, communication interface requirements, EMC performance, boot configuration, security provisioning, debugging access, software safety requirements, and compliance with automotive design guidelines. The device should not be operated beyond the manufacturer’s specified electrical, thermal, or mechanical limits. ## Hashtags #commonpartslibrary #integratedcircuit #microcontroller #automotivemcu #nxp #nxpsemiconductors #s32k3 #s32k358 #s32k358ght1mjbst #armcortexm7 #cortexm7 #thirtytwobit #automotiveelectronics #aecq100 #hsesecurity #canfd #ethernet #vehicleelectronics #embeddedhardware #embeddeddesign #ecu #gatewaycontroller #bodycontrolmodule #pcbdesign #hardwaredesign #electronicscomponents #electronicparts #componentlibrary #engineeringparts #electronicsengineering

100 Position Connector Receptacle, Center Strip Contacts Surface Mount Gold The DF40C-100DS-0.4V(51) is a board-to-board and board-to-FPC receptacle connector manufactured by Hirose Electric. It belongs to the DF40 series, a family of fine-pitch stacking connectors intended for compact, high-density interconnect applications such as mobile devices, cameras, wearables, and other space-constrained electronics. The connector functions as the receptacle (socket) half of a mating pair, designed to stack with a corresponding DF40 plug header to join two printed circuit boards, or a printed circuit board and a flexible printed circuit, in a low-profile vertical arrangement. This particular part number represents the full-position, low-profile variant within the series, configured without a reinforcing metal fitting and without a locating boss or mechanical holddown feature, meaning it relies on the contact array itself rather than additional structural hardware for mechanical retention during reflow and handling. The connector is supplied in straight, surface-mount form and is non-polarized, so it can be inserted in either orientation relative to its mating counterpart. Contacts are arranged in parallel rows along the connector body, with gold plating in the contact mating area to ensure reliable signal continuity and resistance to oxidation over repeated use. The series is positioned by Hirose as a general-purpose, high-speed-capable interconnect, suitable for a range of differential and single-ended signaling standards used in consumer and industrial electronics, with the broader DF40 family supporting interfaces such as USB, MIPI, SATA, and PCIe. Its low stacking height and fine contact pitch make it well suited to applications where board-to-board spacing must be minimized, such as camera modules, display modules, or stacked daughterboard architectures in handheld and wearable products. The connector is packaged on embossed carrier tape for automated pick-and-place assembly, and its construction is compliant with RoHS material restrictions. Mechanically, the connector body is built to support repeated mating cycles typical of consumer electronics assembly and rework, while maintaining stable electrical contact under vibration and thermal cycling across its rated environmental range. As a stacking-style connector rather than a card-edge or cable-mount type, it is intended to be soldered directly to a host PCB pad pattern, with the mating plug soldered to the corresponding board or FPC, allowing the two assemblies to be joined and separated as needed during manufacturing, test, or service operations. Spec Sheet Identification Part Number: DF40C-100DS-0.4V(51) Series: DF40 Variant: "C" type — without reinforcing metal fitting Connector Type / Configuration Type: Receptacle (socket), board-to-board / board-to-FPC Gender: Female Orientation: Straight Row Arrangement: Dual row Polarization: Non-polarized Locking/Retention Feature: None (no metal holddown or locating boss) Electrical Ratings Current Rating: Low-current signal class Voltage Rating: Standard signal-level rating typical of fine-pitch board-to-board connectors Applicable High-Speed Protocols: USB, MIPI, SATA, PCIe (series capability) Transmission Rate: High-speed, multi-gigabit class (series capability) Mechanical Specifications Contact Pitch: Fine pitch Mounting Pitch: Matches contact pitch Stacking/Mated Height: Low-profile Mounting Method: Surface mount technology (SMT) Mating Cycles: Rated for repeated mate/unmate cycles typical of consumer electronics rework Contact & Material Properties Contact Material: Phosphor bronze Contact Plating (Mating Area): Gold Insulator Color: Black Insulator Material: High-temperature engineering resin suitable for SMT reflow Environmental Ratings Operating Temperature Range: Extended consumer/industrial range RoHS Compliance: Yes Packaging Packaging Format: Embossed carrier tape, reel format Packaging Code Meaning: Suffix denotes embossed tape packaging at a standard reel quantity Mating Compatibility Mates With: Corresponding DF40 series plug/header connector Application Note: Intended for mezzanine-style stacking between two PCBs or between a PCB and FPC #DF40 #Hirose #HiroseElectric #BoardToBoard #BoardToFPC #StackingConnector #CommonPartsLibrary #Connector #SMTConnector #FinePitchConnector #MezzanineConnector #ElectronicComponents #PCBDesign #HardwareEngineering #ConnectorDatasheet #EngineeringSpec #ConsumerElectronics #HighSpeedConnector #RoHSCompliant #ComponentLibrary

Mini 2.45 GHz Antenna The 2450AT18A100E is a high-frequency ceramic SMT antenna featuring a small 3.2 mm × 1.6 mm × 1.3 mm package, optimized for space-constrained RF designs. It operates from 2400 MHz to 2500 MHz with a 50 Ω impedance and provides a compact alternative to traditional PCB trace antennas while maintaining reliable RF performance. Key Features Operating Frequency: 2400 MHz – 2500 MHz (2.4 GHz ISM Band) Center Frequency: 2450 MHz Antenna Type: Mini Ceramic Chip Antenna / SMT RF Antenna Package Size: 3.2 mm × 1.6 mm × 1.3 mm Impedance: 50 Ω Peak Gain: Approximately +0.5 dBi (typical) Average Radiation Efficiency: Approximately 76% (based on Johanson evaluation board) Maximum Input Power: 2 W continuous wave (CW) Operating Temperature Range: -40 °C to +125 °C Mounting Type: Surface Mount Technology (SMT) Applications: Bluetooth / BLE devices Wi-Fi 2.4 GHz modules Zigbee / IEEE 802.15.4 systems IoT sensors and embedded wireless products #2450AT18A100E #JohansonTechnology #ChipAntenna #SMTAntenna #RFDesign #2GHzAntenna #Bluetooth #WiFi #Zigbee #IoT #WirelessCommunication #EmbeddedSystems #PCBDesign #RFAntenna #Antena #Chip #SurfaceMount

Battery Retainer Coin, 24.5mm 1 Cell SMD (SMT) Tab BAT-HLD-006-SMT is a surface-mount coin-cell battery holder designed for secure retention of a single CR2450 lithium coin battery in compact PCB applications. Manufactured by TE Connectivity, it provides a low-profile, reliable power solution for embedded systems, wireless sensors, IoT devices, medical electronics, and backup power circuits. The holder features a horizontal battery orientation, phosphor bronze construction, and nickel-plated contacts for durability and dependable electrical performance. Key Features Supports one CR2450 coin-cell battery Surface-mount (SMT) PCB installation Horizontal battery orientation for low-profile designs Nickel-plated contacts for reliable conductivity and corrosion resistance Phosphor bronze construction for mechanical durability Maximum contact current rating of 1 A Compact design with approximately 6.88 mm height above PCB Suitable for automated assembly and reflow soldering processes Ideal for RTC backup, wireless modules, portable electronics, and IoT devices #BatteryHolder #CR2450 #CoinCellHolder #SMT #SurfaceMount #TEConnectivity #PowerManagement #EmbeddedSystems #IoT #PCBDesign #Electronics #BatteryRetainer #HardwareDesign #ElectronicComponents