Connector Header Through Hole 4 position 0.118" (3.00mm) 2068320401 is a 4-position vertical PCB header from the Micro-Fit+ series by Molex. It is a shrouded, through-hole wire-to-board power connector designed for applications requiring compact size, secure mating, and high current capability. The connector features a 3.00 mm pitch, locking ramp retention, and robust construction suitable for industrial, telecommunications, medical, and general-purpose power distribution systems. Key Features 4-position (2×2) vertical header 3.00 mm pitch (Micro-Fit+ family) Through-hole PCB mounting Shrouded design with locking ramp for secure mating Current rating up to 12.5 A per contact Voltage rating up to 600 VAC/DC Tin-plated copper alloy contacts Operating temperature range: -40°C to +105°C Glass-filled LCP housing with UL94 V-0 flammability rating Board guide feature for improved PCB assembly alignment Suitable for wire-to-board power and signal applications Hashtags #Molex #MicroFitPlus #2068320401 #WireToBoard #PowerConnector #PCBHeader #ThroughHoleConnector #IndustrialElectronics #TelecomEquipment #MedicalDevices #ConnectorDesign #ElectronicComponents

Board to Board & Mezzanine Connectors .050\" SEARAY High-Speed High-Density Open-Pin-Field Array Terminal 400 Position Connector High Density Array, Male Surface Mount, Right Angle Gold SEAM-40-01-L-10-2-RA-K-TR is a high-speed, high-density board-to-board mezzanine connector from the Samtec SEARAY™ series. It features a right-angle, surface-mount design with 400 positions arranged in a 10-row open-pin-field array on a 1.27 mm (0.050") pitch. The connector utilizes Samtec's Edge Rate® contact system, providing excellent signal integrity, durability, and support for high-speed differential pair routing in demanding communication, networking, and embedded computing applications. Key Features High-density 400-position open-pin-field array connector 1.27 mm (0.050") contact pitch for compact board-to-board interconnects Right-angle, surface-mount termination Rugged Edge Rate® contact system for reliable high-speed performance Supports high-speed serial protocols and differential pair routing Suitable for power, ground, and signal connections within the same connector Gold-plated contacts for enhanced reliability and corrosion resistance Board-guide feature for improved mating alignment Current rating up to 1.9 A per contact Voltage rating up to 240 VAC / 339 VDC Tape-and-reel packaging for automated assembly processes RoHS compliant and designed for high-reliability applications #Samtec #SEARAY #SEAM4001L102RAKTR #BoardToBoardConnector #MezzanineConnector #HighSpeedConnector #HighDensityInterconnect #EdgeRate #SurfaceMount #RightAngleConnector #EmbeddedSystems #TelecomEquipment #NetworkingHardware #IndustrialElectronics #PCBDesign