Connector Header Through Hole 4 position 0.100" (2.54mm) UART header 1x4 2.54mm Single-row, through-hole male pin header with 4 positions and 2.54 mm pitch. Designed for board-to-wire or board-to-board interconnect applications such as UART interfaces. Mechanical Specifications Number of Positions: 4 Number of Rows: 1 Pitch: 2.54 mm (0.100") Mounting Style: Through Hole Mounting Angle: Straight (Vertical) Contact Gender: Male (Pin) Termination Type: Solder Pin Housing Material: Polybutylene Terephthalate (PBT) Housing Color: Black Electrical Specifications Current Rating: 4.3 A – 6.3 A (per pin, depending on conditions) Voltage Rating: 450 VAC – 550 VAC Contact Resistance: (Typical for series, not specified exact) Insulation Resistance: (Not specified) Material & Plating Contact Material: Phosphor Bronze Contact Plating: Gold Flammability Rating: UL94 V-0 Environmental & Compliance RoHS Compliance: Yes Country of Origin: USA Packaging Packaging Type: Bulk Factory Pack Quantity: 1 Series Information Series: TSW (Samtec Pin Strip Header Series) Product Type: Headers & Wire Housings Typical Applications UART / Serial communication headers Microcontroller programming interfaces General-purpose 2.54 mm interconnects Prototyping and development boards #commonpartslibrary #connector

Connector Header Through Hole 6 position 0.100" Pin Header 1x06 2.54mm PinHeader 1x6 2.54mm The TSW-106-07-G-S is a through-hole vertical header designed for board-to-board and board-to-wire interconnection in electronic systems. It is part of a precision connector series known for high reliability, consistent mechanical alignment, and excellent electrical performance. The component is commonly used in applications requiring modular connectivity, prototyping flexibility, and secure signal routing between printed circuit boards or peripheral interfaces. Its design supports repeated mating cycles while maintaining stable contact integrity, making it suitable for both development and production environments. Functional Description This component functions as a single-row header that provides a direct electrical interface between a printed circuit board and a mating connector or cable assembly. It enables straightforward signal or power routing through plated pins that are soldered into the PCB. The vertical orientation allows perpendicular mating, supporting compact and efficient board layouts. The connector is designed to ensure proper alignment and retention during mating, reducing the risk of intermittent connections. Electrical Characteristics The header supports low-voltage signal transmission and moderate current levels typical of board-level interconnects. It offers low contact resistance to maintain signal integrity and efficient current flow. The contact system is designed to provide consistent electrical performance across repeated insertions, ensuring reliability in both signal and power applications. Mechanical Characteristics The component features a robust insulating housing that maintains pin alignment and structural integrity during handling and operation. The contact pins are fabricated from conductive material and plated to enhance durability, conductivity, and مقاومت to corrosion. The through-hole mounting style provides strong mechanical anchoring to the printed circuit board, improving resistance to mechanical stress and vibration. The design supports reliable mating with compatible connectors and ensures long service life. Environmental Characteristics The TSW-106-07-G-S is constructed using materials that provide stable performance under typical environmental conditions encountered in electronic assemblies. It is designed to withstand standard temperature ranges and environmental stresses such as humidity and mechanical handling, maintaining electrical and mechanical reliability over time. Applications This header is widely used in embedded systems, industrial electronics, development platforms, communication equipment, and general-purpose PCB interconnect applications. It is especially suited for designs requiring modular connectivity, easy assembly, and dependable signal transfer. Summary The TSW-106-07-G-S from Samtec is a reliable through-hole header solution that combines mechanical durability with stable electrical performance. Its straightforward design, compatibility with standard interconnect systems, and suitability for a wide range of applications make it a common choice for board-level connectivity in modern electronic designs. #CommonPartsLibrary #Connector #Header #TSW

Connector Header Through Hole 6 position 0.100" (2.54mm) The TSW-103-07-G-D is a through-hole, dual-row (2×3) male pin header from the TSW series of Samtec. It is designed for board-to-board or cable-to-board interconnections, using a standard 2.54 mm (0.1″) pitch, making it widely compatible with common PCB layouts and prototyping systems. This connector features gold-plated square posts for reliable electrical contact and durability, and is commonly used in embedded systems, development boards, and general electronics applications. Key Features Connector Type: Male pin header (unshrouded) Number of Positions: 6 pins (2 rows × 3 pins) Pitch: 2.54 mm (0.100″) standard spacing Mounting Type: Through-hole soldering Contact System: 0.025″ (0.635 mm) square post Contact Material: Phosphor bronze with gold plating Orientation: Vertical (straight) Row Spacing: 2.54 mm Operating Temperature: −55 °C to +125 °C Insulator Material: PBT (UL94 V-0 rated) Typical Use: Board-to-board or cable interface AVR ISP 2x3 2.54mm header #commonpartslibrary #connector #header

Connector Header Through Hole 40 position 0.100" (2.54mm) Raspberry Pi 40 pin header The TSW-120-07-G-D is a through-hole, double-row vertical header manufactured by Samtec. It features 40 total positions (2 rows of 20 pins) with a standard 2.54 mm pitch. This connector is widely used for board-to-board connections, prototyping, and general-purpose signal routing in embedded and electronic systems. It is designed for reliable mechanical and electrical performance with gold-plated contacts for enhanced conductivity and corrosion resistance. Manufacturer Samtec Inc. Manufacturer Part Number TSW-120-07-G-D Product Type Through-Hole Pin Header Number of Positions 40 (2 × 20) Number of Rows 2 Pitch 2.54 mm (0.100") Row Spacing 2.54 mm (0.100") Mounting Type Through Hole Orientation Vertical Contact Material Phosphor Bronze Contact Plating Gold (Au) over Nickel Plating Thickness Typically 10 µin (0.25 µm) Gold Insulator Material Black Liquid Crystal Polymer (LCP) Current Rating Typically 3.0 A per contact (depending on application conditions) Voltage Rating Typically 250 VAC Operating Temperature Range -55°C to +125°C Termination Type Solder Contact Style Square Post Post Length Standard Samtec “-07” tail length (approx. 2.92 mm tail, varies slightly per datasheet) Applications Embedded systems (e.g., Raspberry Pi GPIO headers) Development boards and expansion modules Board-to-board interconnects Prototyping and test setups Compliance RoHS Compliant Lead-Free Notes Compatible with standard 2.54 mm female headers and sockets Commonly used in stacking or mezzanine configurations Available in various plating options and pin lengths under the TSW series #commonpartslibrary #connector

20 Position Receptacle Connector 0.100" (2.54mm) Through Hole Tin The SSW-120-01-T-S is a single-row, 20-position female (receptacle) socket strip with a 2.54 mm (0.1") pitch, intended for through-hole PCB mounting. It uses Samtec’s Tiger Buy™ contact system, providing reliable electrical performance and durability for repeated mating cycles. It is commonly used in embedded systems, development boards, and general PCB interconnections, especially where standard 0.1" headers are required. Female header 1x20 2.54mm Key Features Standard 2.54 mm Pitch Industry-standard spacing compatible with most pin headers and prototyping systems 20 Positions, Single Row Ideal for compact signal connections and header interfaces Tiger Buy™ Contact System Provides low insertion force and reliable electrical contact Available in standard or low insertion force variants Through-Hole Mounting Ensures strong mechanical retention and durability on PCBs Tin-Plated Contacts (T option) Cost-effective plating suitable for general-purpose applications High-Speed Capability Supports signals up to ~8 Gbps, depending on application and layout Wide Operating Temperature Range Typically −55 °C to +105 °C, suitable for industrial environments Material Construction Contacts: Phosphor bronze Insulator: High-temperature plastic (e.g., LCP) Versatile Mating Compatibility Mates with common Samtec header series (TSW, MTSW, etc.) and standard 0.025" square posts #CommonPartsLibrary #Connector #SSW-120

Samtec, FTSH, 14 Way, 2 Row, Vertical Pin Header Connector Header Surface Mount 14 position 0.050" (1.27mm) #CommonPartsLibrary #Connector #Header #FTSH

Connector Header Through Hole 22 position 0.100" (2.54mm) PinHeader_1x22_P2.54mm_Vertical General Description The TSW-122-07-G-S is a through-hole vertical pin header manufactured by Samtec. It is part of the TSW series, designed for board-to-board or wire-to-board interconnections. This component features a single-row configuration with standard 2.54 mm pitch spacing, making it widely compatible with common prototyping and production PCB designs. It is commonly used in embedded systems, development boards, and general-purpose electronic assemblies requiring reliable and cost-effective connectivity. Key Features Single-row vertical pin header Through-hole mounting style Standard 2.54 mm pitch spacing Tin-plated contacts for reliable electrical connection Black thermoplastic insulator housing Designed for board-to-board or cable interfacing Compatible with standard mating connectors and sockets Electrical Characteristics Current rating suitable for signal-level and low-power applications Contact resistance designed for stable electrical performance Insulation resistance suitable for typical PCB environments Mechanical Characteristics Number of positions: twenty-two Row configuration: single row Mounting type: through-hole Orientation: vertical Contact material: copper alloy Contact plating: tin Housing material: high-temperature thermoplastic Environmental Characteristics Operating temperature range suitable for industrial and commercial electronics RoHS compliant Designed for durability under normal handling and soldering conditions Applications Microcontroller and development boards Prototyping platforms Board-to-board interconnections Embedded systems General electronic assemblies #commonpartslibrary #connector #header

Connector Header Through Hole 10 position 0.100" (2.54mm) The TSW-105-07-G-D is part of the Samtec TSW series, which consists of 0.100″ (2.54 mm) pitch PCB header strips. It is a dual-row, 10-position (2×5) male pin header intended for through-hole mounting on printed circuit boards. This connector provides a simple and reliable way to connect PCBs or interface with cables and other connectors (e.g., female sockets or IDC connectors). Key Features Connector Type: Rectangular header (male pin) Mounting Type: Through-hole (THT) Pitch: 2.54 mm (0.100″ standard spacing) Number of Positions: 10 pins Rows: Dual-row (2×5 configuration) Contact Style: 0.025″ (0.635 mm) square posts Orientation: Vertical (straight header) Plating: Gold (indicated by “G”) for reliable contact Electrical & Mechanical Highlights Current Rating: up to ~6.3 A per contact (series typical) Voltage Rating: up to ~400–550 VAC Operating Temperature: approx. -55 °C to +125 °C High durability: supports multiple mating cycles (extended-life design) Typical Applications Microcontroller and development boards Board-to-board connections Prototyping systems (breadboard-compatible headers) Industrial and embedded electronics Cable-to-board interfaces #CommonPartsLibrary #Connector #Header #TSW

60 Position Connector Socket, Outer Shroud Contacts Surface Mount Gold The ERF8-030-05.0-S-DV-L-K-TR is a high-speed board-to-board mezzanine socket connector from the Samtec Edge Rate™ ERF8 series. It is designed for reliable high-density interconnection in compact embedded, industrial, communication, and high-speed digital systems. The connector features a rugged dual-row surface-mount design with outer shield contacts to improve signal integrity and reduce EMI in high-speed applications. Key features: 60-position dual-row mezzanine socket connector 0.80 mm pitch for high-density PCB layouts Surface-mount termination Edge Rate™ contact system optimized for high-speed signaling Gold-plated contacts for improved durability and conductivity Supports multiple stacking heights (7 mm, 10 mm, 13 mm, 14 mm, 20 mm) Includes board guide, latch, and pick-and-place features Operating temperature range: -55°C to +125°C Rated current up to 2.2 A per pin Designed for rugged board-to-board applications with enhanced signal integrity #CommonPartsLibrary #Connector #ERF8-030

16 Position Receptacle Connector 0.100" (2.54mm) Through Hole, Right Angle Tin The SSQ-108-02-T-D-RA is a dual-row, right-angle female socket connector manufactured by Samtec. It is designed for board-to-board or wire-to-board interconnections in through-hole mounting applications. This connector features a 2.54 mm pitch with high-reliability contact systems, making it suitable for prototyping, embedded systems, and industrial electronics. The right-angle configuration enables horizontal mating, optimizing space in compact PCB layouts. Key Features Dual-row female socket strip Right-angle orientation for horizontal mating Standard 2.54 mm pitch spacing Through-hole mounting for secure PCB attachment High-reliability phosphor bronze contacts Gold-plated contact area for improved conductivity and corrosion resistance Black thermoplastic housing (UL94V-0 rated) Mechanical Specifications Number of Positions: 16 (2 × 8 configuration) Pitch: 2.54 mm Row Spacing: 2.54 mm Mounting Type: Through-hole Orientation: Right-angle Contact Type: Female socket Mating Post Length Compatibility: Standard 0.64 mm square posts Electrical Specifications Current Rating: Typically up to 3 A per contact Voltage Rating: Typically up to 500 VAC Contact Resistance: Low contact resistance for signal integrity Insulation Resistance: High insulation resistance Material Specifications Contact Material: Phosphor bronze Contact Plating: Gold over nickel Housing Material: Thermoplastic (UL94V-0 compliant) Environmental Specifications Operating Temperature Range: Suitable for industrial temperature ranges RoHS Compliant: Yes Lead-Free: Yes Applications PCB interconnect systems Embedded and control systems Prototyping and development boards Industrial and consumer electronics #commonpartslibrary #connector