• LW18-S

    LW18-S

    I2C to dual PWM controller. The LED-Warrior18, manufactured by Code Mercenaries, is an I2C to dual channel PWM LED driver specifically designed to provide seamless brightness control for LED applications. This component, available in SOIC8 package (LW18-S) and as a ready-to-use module (LW18-01MOD), offers dual 16-bit PWM outputs with a dimming range from 0.001% to 100% and operates at a PWM frequency of 730 Hz. It supports programmable period lengths for higher-frequency or lower-resolution operation and includes an 8-bit data to logarithmic mapping feature for smoother dimming operations with just 256 steps. The LED-Warrior18 is engineered for minimal external circuitry with a 5V power supply requirement, offering ease of use in various lighting applications. It also features a sync mode for synchronized control of multiple units and customizable power-on status settings, making it highly versatile for standalone operations or integrated systems. Additionally, custom variants of both the chip and module are available, catering to specific application needs. The module version, LW18-01MOD, simplifies integration by including terminal blocks and supporting up to 4A load sink current for each output. The LED-Warrior18 stands out for its straightforward interface and operational flexibility, providing a comprehensive solution for advanced LED dimming and control projects.

    thebug

    1 Star


  • AD633 8-Pin SOIC

    AD633 8-Pin SOIC

    Welcome to your new project. Imagine what you can build here.

    djw4806

    1 Comment


  • SOIC-8 3.9x4.9mm P1.27mm

    SOIC-8 3.9x4.9mm P1.27mm

    SOIC-8 is an 8-pin Small Outline Integrated Circuit (SOIC) package with a rectangular 3.9mm x 4.9mm body size and a standard 1.27mm lead pitch. #part #template

    cesarzavaleta

    6 Comments


  • SOIC-20W_7.5x12.8mm_P1.27mm

    SOIC-20W_7.5x12.8mm_P1.27mm

    SOIC-20W is a 20-pin Small Outline Integrated Circuit (SOIC) package with a wide body size of approximately 7.5mm x 12.8mm and a standard lead pitch of 1.27mm. It has a lead count and pin configuration similar to a DIP-20 package, but with a smaller body size. The "W" in the package name refers to the wide body size. This package is commonly used for ICs such as microcontrollers and audio amplifiers. #part #template

    b1lrex

    1 Comment


  • CD4052BE

    CD4052BE

    Texas Instruments presents the CD4051B, CD4052B, and CD4053B series, a family of CMOS single 8-Channel, differential 4-Channel, and triple 2-Channel analog multiplexers or demultiplexers with logic-level conversion. Engineered for precise, reliable control of analog and digital signals, these components are characterized by their wide range of signal handling (3 V to 20 V for digital and up to 20 VP-P for analog signals), low ON resistance (125 Ω typical over 15 VP-P signal input range for VDD - VEE = 18 V), high OFF resistance (+100 pA typical channel leakage at VDD - VEE = 18 V), and minimal quiescent power dissipation (0.2 μW typical at VDD - Vss = VDD - VEE = 10 V). They come equipped with on-chip binary address decoding for easy integration and minimized system logic complexity. Available in a variety of package types, including CDIP, PDIP, SOIC, SOP, and TSSOP, these multiplexers/demultiplexers support a broad spectrum of analog to digital and digital to analog conversion applications, signal gating, factory automation, and other uses where reliable signal handling is crucial. With parametric ratings at 5 V, 10 V, and 15 V, and an operational temperature range of -55°C to 125°C, these components are also 100% tested for quiescent current at 20 V, assuring dependable performance across diverse environmental conditions.

    wkdiwalallawita

    &

    1 Comment


  • SOIC-20W_7.5x12.8mm_P1.27mm tGP1

    SOIC-20W_7.5x12.8mm_P1.27mm tGP1

    SOIC-20W is a 20-pin Small Outline Integrated Circuit (SOIC) package with a wide body size of approximately 7.5mm x 12.8mm and a standard lead pitch of 1.27mm. It has a lead count and pin configuration similar to a DIP-20 package, but with a smaller body size. The "W" in the package name refers to the wide body size. This package is commonly used for ICs such as microcontrollers and audio amplifiers. #part #template

    b1lrex


  • MAX6675ISA

    MAX6675ISA

    Sensor and Detector Interface 5.5V 0.7mA SPI Interface 8-Pin SOIC N T/R #CommonPartsLibrary #IntegratedCircuit #Interface #Sensor-Detector

    yongarcia


  • OPA2835ID c002

    OPA2835ID c002

    The OPA835 and OPA2835 from Texas Instruments are ultra-low-power, rail-to-rail output, voltage-feedback (VFB) operational amplifiers. Designed for high-performance applications, these single (OPA835) and dual (OPA2835) op-amps operate over a power supply range of 2.5 V to 5.5 V. Consuming a mere 250 µA per channel, they offer a remarkable balance of power efficiency and performance, boasting a unity-gain bandwidth of 56 MHz, a slew rate of 160 V/µs, and ultra-low THD of 0.00003% at 1 kHz. Key features include a large signal bandwidth, negative rail input, power-down mode reducing current to 0.5 µA, and input voltage noise of 9.3 nV/√Hz at 100 kHz. Packaged options such as SOT-23, QFN, SOIC, VSSOP, and UQFN are available, accommodating a range of design requirements. The devices are ideal for battery-powered and portable applications, offering superior performance-to-power ratios for high-frequency amplifiers.

    jbreidfjord-dev


  • Si8241 65cd

    Si8241 65cd

    The Si824x family from Skyworks Solutions, Inc. includes high-side/low-side isolated drivers specifically designed for high-power (>30 W) audio applications, providing versions with peak output currents of 0.5 A (Si8241) and 4.0 A (Si8244). These drivers operate with a maximum supply voltage of 24 V and feature an innovative isolation technology that offers up to 2500 V input-to-output isolation and up to 1500 Vrms output-to-output isolation, enabling level translations of signals without additional external circuits. Key features include a high-precision linear programmable dead-time generator ranging from 0.4 ns to 1 us, robust transient immunity of over 45 kV/us, a wide operational temperature range from -40 to +125 °C, and overlap protection to prevent shoot-through current damage. The Si824x components are RoHS-compliant and come in a 16-pin narrow body SOIC package, making them suitable for integration in space-constrained designs. These characteristics make the Si824x family ideal for use in Class D audio amplifiers and other high-side/low-side driving applications where high noise immunity and precise timing control are critical.

    jbreidfjord-dev


  • ADA4084-2ARZ

    ADA4084-2ARZ

    The ADA4084-1, ADA4084-2, and ADA4084-4, manufactured by Analog Devices, Inc., are a series of low-power, rail-to-rail input/output operational amplifiers designed to operate from a single supply voltage ranging from +3 V to +30 V (or ±1.5 V to ±15 V). These amplifiers are characterized by their low noise performance (3.9 nV/√Hz at 1 kHz typical), low offset voltage (100 uV maximum for the SOIC package), and low power consumption (0.625 mA typical per amplifier at +15 V). With a gain bandwidth product of 15.9 MHz and a slew rate of 4.6 V/μs typical, these amplifiers are suitable for a broad range of applications, including battery-powered instrumentation, high-side and low-side sensing, power supply control and protection, and telecommunications among others. The ADA4084 series is available in various package options, ensuring flexibility and compatibility for different design requirements. Notably, the long-term drift and temperature hysteresis are meticulously engineered for consistent performance over time and across temperature variations, making these amplifiers robust choices for applications demanding precision and stability.

    kriticalm4ss


  • OPA2835IRUNR 810f

    OPA2835IRUNR 810f

    The Texas Instruments OPA835 and OPA2835 are ultra-low-power, rail-to-rail output, negative-rail input, voltage-feedback (VFB) operational amplifiers designed for operation across a wide power supply range of 2.5 V to 5.5 V with a single supply or +1.25 V to +2.75 V with a dual supply. These components are notable for their industry-leading performance-to-power ratio, which features a quiescent current of just 250 µA per channel and a unity gain bandwidth of 56 MHz. They are ideal for battery-powered, portable applications where power efficiency is critical, without compromising on high-frequency performance. The OPAx835 series brings the added benefit of a power-savings mode, reducing current consumption to less than 1.5 µA, making them an attractive choice for high-frequency amplifiers in battery-powered systems. Their compact package options, including SOT-23, SOIC, VSSOP, UQFN, and QFN, cater to space-constrained applications, providing a versatile solution for low-power signal conditioning, audio ADC input buffers, low-power SAR and ΔΣ ADC drivers, portable systems, low-power systems, high-density systems, and ultrasonic flow meters.

    kerry


  • SOIC-16_3.9x9.9mm_P1.27mm

    SOIC-16_3.9x9.9mm_P1.27mm

    SOIC-16 (Small Outline Integrated Circuit 16) is a surface-mount integrated circuit (IC) package with 16 pins arranged in two rows, with a rectangular body size of 3.9 mm x 9.9 mm and a standard 1.27 mm lead pitch. It is commonly used for a variety of low to medium power applications, including microcontrollers, amplifiers, and voltage regulators. 16-SOIC #part #template

    innodire


  • LF398_SOIC8

    LF398_SOIC8

    Sample And Hold Unity Gain Follower, SOIC-8

    lwcassid

    1 Comment


  • Active Three-Way Crossover on NE5532

    Active Three-Way Crossover on NE5532

    TECHNICAL ASSIGNMENT AND DESIGN GUIDE Active Three-Way Crossover on NE5532 Powered by AM4T-4815DZ and Amplifiers TPA3255 (Updated Version) 1. GENERAL PURPOSE OF THE DEVICE The goal of the development is to create an active three-way audio crossover for one channel of a loudspeaker system, working with the following drivers: LF: VISATON W250 MF: VISATON MR130 HF: Morel MDT-12 Each frequency range is amplified by a separate power amplifier: LF: TPA3255 in PBTL mode (mono) MF + HF: second TPA3255 in stereo mode (one channel for MF, the other for HF) The crossover accepts a single linear audio signal (mono) and divides it into three frequency bands: Range Frequency Range LF 0 – 650 Hz MF 650 – 2500 Hz HF 2500 Hz and above Filter type: Linkwitz–Riley 4th order (24 dB/oct) at each crossover point (650 Hz and 2500 Hz). The crossover must provide: minimal self-noise; no audible distortion in the audible range; stable operation with NE5532 at ±15 V power supply; easy adjustment of the level for each band, as well as the overall level (via the input buffer). 2. FILTER TYPES AND BASIC OPERATING PRINCIPLES Each filter is implemented as two cascaded Sallen–Key 2nd order (Butterworth) stages, resulting in a final 4th order LR4 filter. Topology: non-inverting Sallen–Key, optimal for NE5532. For all stages: Cascade gain: K ≈ 1.586 This provides a Q factor of 0.707 (Butterworth), which in combination gives a Linkwitz–Riley 4th order. 3. COMPONENT VALUES FOR FILTERS 3.1 Universal Parameters RC chain capacitors: 10 nF, film capacitors, tolerance ≤ 5% Resistors: metal-film, tolerance ≤ 1% The gain of each stage is set by feedback resistors: Rf = 5.9 kΩ Rg = 10 kΩ K ≈ 1 + (Rf / Rg) ≈ 1.59 The circuit should allow for the installation of a small capacitor (10–47 pF) in parallel with Rf (footprint provided) for possible stability correction (not mandatory to install in the first revision). 3.2 650 Hz Filters (Low-frequency boundary for MF) These are used for the division between W250 and MR130. LP650 — Low-frequency Filter 2nd Order R1 = 24.9 kΩ R2 = 24.9 kΩ C1 = 10 nF C2 = 10 nF Two stages: LP650 #1 and LP650 #2. HP650 — MF High-frequency Filter 2nd Order Same values: R1 = 24.9 kΩ R2 = 24.9 kΩ C1 = 10 nF C2 = 10 nF Two stages: HP650 #1 and HP650 #2. 3.3 2500 Hz Filters (Upper boundary for MF) These are used for the division between MR130 → MDT-12. LP2500 — High-pass MF Filter R1 = 6.34 kΩ R2 = 6.34 kΩ C1 = 10 nF C2 = 10 nF Two stages: LP2500 #1 and LP2500 #2. HP2500 — High-frequency Filter Same values: R1 = 6.34 kΩ R2 = 6.34 kΩ C1 = 10 nF C2 = 10 nF Two stages: HP2500 #1 and HP2500 #2. 4. OPERATIONAL AMPLIFIERS The NE5532 (dual op-amp, DIP-8 or SOIC-8) is used. A minimum of 4 packages (8 channels) for filters: NE5532 Function U1A, U1B LP650 #1, LP650 #2 (LF) U2A, U2B HP650 #1, HP650 #2 (Lower MF cut-off) U3A, U3B LP2500 #1, LP2500 #2 (Upper MF cut-off) U4A, U4B HP2500 #1, HP2500 #2 (HF) Additionally: U5 — input buffer / preamplifier (both channels) If necessary, an additional NE5532 (U6) for the balanced input (see section 6.2). All NE5532 should have local decoupling for power supply (see section 5.1). 5. CROSSOVER POWER SUPPLY AM4T-4815DZ DC/DC module is used: Input: 36–72 V, connected to the 48 V power supply for TPA3255 amplifiers. Output: +15 V / –15 V, up to 0.133 A per side. Maximum output capacitance: ≤ 47 µF per side (according to the datasheet). 5.1 Power Filtering Input (48 V): RC variant (simpler, acceptable for the first revision): R = 1–2 Ω / 1–2 W C = 47–100 µF (for 63 V or higher) LC variant (preferred for improved noise immunity): L = 10–22 µH C = 47–100 µF The developer may implement LC if confident in choosing the inductance and its parameters. Output +15 V and –15 V (general filtering): Electrolytic capacitor 10–22 µF per side 100 nF (X7R) per side to GND Local decoupling for NE5532 (REQUIRED): For each NE5532 package: 100 nF between +15 V and GND 100 nF between –15 V and GND Place as close as possible to the op-amp power pins (short traces). Additional local filtering for power lines: For each NE5532, decouple from the ±15 V main rails: Either 4.7–10 Ω resistor in series with +15 V and –15 V, Or ferrite bead in each rail. After this component, place local capacitors (100 nF + 1–4.7 µF) to ground. 6. INPUT TRACT: INPUTS, BUFFER, ADJUSTMENT 6.1 Unbalanced Input (RCA / Jack / Linear) The main mode is the unbalanced linear input, for example, RCA. Input tract structure: RF-filter and protection: Signal → series resistor Rin_series = 100–220 Ω After resistor — capacitor Cin_RF = 470–1000 pF to GND This forms a low-level RF filter and reduces high-frequency noise. DC-block (low-pass HP-filter): Capacitor Cin_DC = 2.2–4.7 µF film in series Resistor to ground Rin_to_GND = 47–100 kΩ Cut-off frequency — negligible in the audio range but removes DC. Input buffer / preamplifier (NE5532, U5): Non-inverting configuration. Input — after DC-block. Gain: adjustable, e.g., Rg_fixed = 10 kΩ (to GND through trimmer) Rf = 10–20 kΩ + footprint for trimmer (e.g., 20 kΩ) The gain should be in the range of 0 dB to +10…+12 dB. Possible configuration: Rg = 10 kΩ fixed Rf = 10 kΩ + 10 kΩ trimmer in series. This allows adjusting the overall level of the crossover according to the source and amplifier levels. Buffer output: A low-impedance output (after NE5532) This signal is simultaneously fed to the inputs of all filters: LP650 (LF) HP650 → LP2500 (MF) HP2500 (HF) 6.2 Balanced Input (XLR / TRS) — Optional, but laid out on the board The board should allow for a balanced input, even if it’s not used in the first revision. Implementation requirements: XLR/TRS connector (L, R, GND) or separate 3-pin header. Simple differential receiver on NE5532 (extra U6 package or use one channel of U5 if sufficient). Circuit: classic instrumentation amplifier or differential amplifier: Inputs: IN+ and IN– Output — single-ended signal of the same level (or slightly amplified), fed to DC-block and buffer (or directly to the buffer if integrated). Switching between balanced/unbalanced mode: Implement using jumpers / bridges or adapters: Either switch before the buffer, Or use two separate pads, one of which is unused. All balanced input grounds must be connected to the same AGND point as the unbalanced input to avoid ground loops. 7. LEVEL ADJUSTMENT OF BANDS (BEST METHOD) The level adjustment of each band (LOW, MID, HIGH) is required to match the sensitivity of the speakers and amplifiers. Recommended method: After each full filter (after LP650×2, MID-chain HP650×2 → LP2500×2, HP2500×2), install: A passive attenuator: Series: Rseries (0–10 kΩ, adjustable) Shunt: Rshunt to GND (10–22 kΩ, fixed or adjustable) For simplicity and reliability: Implementation on the board: For each band (LOW, MID, HIGH) provide: Pad for multi-turn trimmer 10–20 kΩ as a divider (between signal and ground) in the "level adjustment" configuration. If adjustment is not needed — install a fixed divider (two resistors) or simply use a jumper. It is preferable to use: For setup: multi-turn trimmers 10–20 kΩ, available on the top side of the board. Nominals for the initial configuration can be selected through measurements, but the PCB should have flexibility. This provides: Accurate balancing of band volumes without interfering with the filters; Flexibility for fine-tuning to the specific characteristics of the speakers. 8. INPUTS AND OUTPUTS OF THE CROSSOVER (FINAL) 8.1 Inputs 1× Unbalanced linear input (RCA or 3-pin header) 1× Balanced input (XLR/TRS or 3-pin header) — optional, but space must be provided on the board. Input impedance (unbalanced after RF-filter): 22–50 kΩ. The input tract must be implemented using shielded cables. 8.2 Outputs Outputs to amplifiers: Output Signal LOW OUT After LP650×2 (LF) MID OUT After HP650×2 → LP2500×2 (MF) HIGH OUT After HP2500×2 (HF) Each output: Series resistor 100–220 Ω (prevents possible oscillations and simplifies cable management). A nearby own AGND pad (ground output), so the signal pair SIG+GND runs together. Outputs should be compactly placed on 2-pin connectors (SIG+GND) or 3-pin (SIG+GND+reserve). 9. PCB DESIGN REQUIREMENTS 9.1 Board Number of layers: 2 layers Bottom layer: solid analog ground (AGND). 9.2 Component Placement Key principles: RC chains of each filter (R1, R2, C1, C2, Rf, Rg) should form a compact "island" around the corresponding op-amp. If elements are placed too far apart, the filter will not work correctly (calculated frequency and Q will shift). Feedback tracks (Rf and Rg) should be as short and direct as possible. The AM4T-4815DZ module should be placed: Far from the input buffer, Far from the first filter stages, If necessary, make a "cutout" in the ground under it to limit noise propagation. Place the input connector, RF-filter, and buffer on one side of the board, and the output connectors on the opposite side. 9.3 Ground The entire audio circuit uses one analog ground: AGND. Connect AGND to the power ground (48 V and amplifiers) at one point ("star"). The star should be implemented as: One point/pad where: The ground of the input, The ground of the filters, The ground of the outputs, The ground of the DC/DC. Avoid long narrow "ground" jumpers — use wide polygons with a single connection point. 9.4 Placement of Output Connectors Group LOW/MID/HIGH compactly. Each should have its own GND pad nearby. Route the SIG+GND pairs as signal pairs, avoiding large loops. 10. ADDITIONAL ELEMENTS: PROTECTION, TEST POINTS 10.1 Test Points (TP) Be sure to provide test points (pads): TP_IN — crossover input (after buffer) TP_LOW — LF filter output TP_MID — MF filter output TP_HIGH — HF filter output TP_+15, TP_–15, TP_GND — power control This greatly simplifies debugging with an oscilloscope. 10.2 Power Protection On the 48 V input — it is advisable to provide: Diode/scheme for reverse polarity protection (if possible), TVS diode or varistor for voltage spikes (optional). 10.3 Possible Stability Correction Pads for small capacitors (10–47 pF) in parallel with Rf in buffers and, if necessary, in some stages — in case of stability issues (this can be not installed in the first revision, but footprints should be provided). 11. BILL OF MATERIALS (BOM) Operational Amplifiers: NE5532 — 4 pcs (filters) NE5532 — 1–2 pcs (input buffer and balanced input) Total: 5–6 NE5532 packages. Resistors (1%, metal-film): 24.9 kΩ — 8 pcs 6.34 kΩ — 8 pcs 10 kΩ — ≥ 12 pcs (feedback, buffers, etc.) 5.9 kΩ — 8 pcs 22 kΩ — 1–2 pcs (input, auxiliary chains) 47–100 kΩ — several pcs (DC-block, input) 100 kΩ — 1 pc (if needed) 100–220 Ω — 4–6 pcs (outputs, RF, protection) 4.7–10 Ω — 2 pcs for each op-amp or group of op-amps (power filtering) — quantity to be clarified during routing. Trimmer Resistors: 10–20 kΩ multi-turn — one for each band (LOW, MID, HIGH) 10–20 kΩ — 1–2 pcs for the input buffer (overall gain adjustment). Capacitors: 10 nF film — 16 pcs (RC filters) 2.2–4.7 µF film — 1–2 pcs (input DC-block) 10–22 µF electrolytic — 2–4 pcs (DC/DC outputs) 1–4.7 µF (X7R / tantalum) — 1 pc for local power filtering (optional). 100 nF ceramic X7R — 10–20 pcs (local decoupling for each op-amp) 470–1000 pF — 1–2 pcs (RF filter on the input) 10–47 pF — optional for stability correction (Rf). Power Supply: AM4T-4815DZ — 1 pc Inductor 10–22 µH (if LC filter) — 1 pc R 1–2 Ω / 1–2 W — 1 pc (if RC filter). Connectors: Input (RCA + 3-pin for internal input) Balanced (XLR/TRS or 3-pin header) Outputs LOW/MID/HIGH — 2-pin/3-pin connectors. 12. TESTING RECOMMENDATIONS 12.1 First Power-up Apply ±15 V without installed op-amps. Check with a multimeter: +15 V –15 V No short circuits in the power supply. Install the op-amps (NE5532). Apply a sine wave of 100–200 mV RMS (signal generator). Check with an oscilloscope at TP: LP650 — should pass LF and roll off everything above 650 Hz. HP650 — should roll off LF, pass everything above 650 Hz. LP2500 — should roll off above 2500 Hz. **HP250 0** — should pass everything above 2500 Hz. 12.2 Phase Check The Linkwitz–Riley 4th order should give a flat frequency response when summed at the crossover points. This can be verified with REW/Arta. 12.3 Noise Check If there is noticeable "shshsh" or whistling: Check: Grounding layout (star) Placement and filtering of AM4T-4815DZ Presence and proper installation of all 100 nF and local filters. 13. FINAL RECOMMENDATIONS FOR BEGINNERS Do not rush, build the circuit step by step: input → buffer → one filter → test, then continue. Check component values at least twice before soldering. Filters should be routed as compact "islands" around the op-amp, do not stretch R and C across the board. Always remember the rule: "The feedback trace should be as short as physically possible." Before ordering the PCB, make a "paper prototype": print at 1:1, cut it out, place real components to check everything fits.

    jin9000