Discover the benefits of the HC32L110 microcontroller with our compact and versatile breakout board, designed to streamline development and testing for various applications. This user-friendly solution offers essential components like decoupling capacitors, a 32MHz crystal oscillator, and accessible power supply connections. The breakout board also features 0.1" pitch connectors, allowing for easy integration of I/O pins into any project. Unlock the full potential of the HC32L110B6YA-CSP16 microcontroller for rapid prototyping and smooth deployment with our ingeniously designed breakout board.
This is a recreation of the [EV5920-5048-V-00A](https://www.monolithicpower.com/en/ev5920-5048-v-00a.html) from MPS which demonstrates a MP5920 Hot-Swap controller commanding 5 MP5048 e-fuses in parallel.
WIP Items:
-Routing
In flux, this project demonstrates hierarchal design through the use of modules. Additionally, parametric symbols are used extensively to improve schematic cleanliness. Components in the canvas are locked because their positions correspond to the same positions as the original layout.
Changelog from Original MPS Design:
- Not including GPIO2 or GPIO3 as included in the original board due to NC pin name on the IC.
- PC1 and PC2 footprints are 5mm in pitch and 12.5mm in diameter rather than the 16mm diameter in the original layout. This change corresponds with the selected part more accurately.
-Renamed Designators to be More Verbose
SOT-23-5 is a small 5-pin Surface Mount Device (SMD) package with a body size of 3mm x 1.4mm and a lead pitch of 0.95mm. The package has a low profile and is commonly used for small signal transistors and diodes. #part #template
This is a recreation of the [EV5920-5048-V-00A](https://www.monolithicpower.com/en/ev5920-5048-v-00a.html) from MPS which demonstrates a MP5920 Hot-Swap controller commanding 5 MP5048 e-fuses in parallel.
WIP Items:
-Routing
In flux, this project demonstrates hierarchal design through the use of modules. Additionally, parametric symbols are used extensively to improve schematic cleanliness. Components in the canvas are locked because their positions correspond to the same positions as the original layout.
Changelog from Original MPS Design:
- Not including GPIO2 or GPIO3 as included in the original board due to NC pin name on the IC.
- PC1 and PC2 footprints are 5mm in pitch and 12.5mm in diameter rather than the 16mm diameter in the original layout. This change corresponds with the selected part more accurately.
-Renamed Designators to be More Verbose
This is a recreation of the [EV5920-5048-V-00A](https://www.monolithicpower.com/en/ev5920-5048-v-00a.html) from MPS which demonstrates a MP5920 Hot-Swap controller commanding 5 MP5048 e-fuses in parallel.
In Flux, this project demonstrates hierarchical design through the use of modules. Additionally, parametric symbols are used extensively to improve schematic cleanliness. Components in the canvas are locked because their positions correspond to the same positions as the original layout.
Changelog from Original MPS Design:
- Not including GPIO2 or GPIO3 as included in the original board due to NC pin name on the IC.
- PC1 and PC2 footprints are 5mm in pitch and 12.5mm in diameter rather than the 16mm diameter in the original layout. This change corresponds with the selected part more accurately.
-Renamed Designators to be More Verbose
SOIC-8 is an 8-pin Small Outline Integrated Circuit (SOIC) package with a rectangular 3.9mm x 4.9mm body size and a standard 1.27mm lead pitch. #part #template
TO-263-7 TabPin8 is a surface-mount package commonly used for electronic components. It has a body size of approximately 10.2 mm x 12.2 mm x 3.2 mm (L x W x H) with 7 pins and a tab pin configuration. Pin 1 is typically located in the lower left corner when viewed from the flat side, while the tab pin, labeled as Pin 8, is connected to the tab or heat sink of the package. The lead pitch between the other pins is typically 2.54 mm. The package is also known as D2PAK-7, DPAK-7, or DDPAK-7. #part #template
LQFP-32 is a surface-mount package for integrated circuits (ICs) with 32 leads arranged in a 7x7 mm square grid. The lead pitch is 0.8 mm, and the body size is approximately 7.0 mm x 7.0 mm x 1.4 mm (L x W x H). LQFP-32 is commonly used for microcontrollers, digital signal processors, and other complex ICs that require a high pin count. It provides a low-profile solution that is well-suited for space-constrained applications. 32-LQFP #part #template
SOIC-20W is a 20-pin Small Outline Integrated Circuit (SOIC) package with a wide body size of approximately 7.5mm x 12.8mm and a standard lead pitch of 1.27mm. It has a lead count and pin configuration similar to a DIP-20 package, but with a smaller body size. The "W" in the package name refers to the wide body size. This package is commonly used for ICs such as microcontrollers and audio amplifiers. #part #template
HTSSOP-14-1EP is a small surface-mount package commonly used for electronic components. It has a body size of approximately 4.4 mm x 5 mm (L x W) with 14 pins. The lead pitch between the pins is typically 0.65 mm. The package features an exposed pad (EP) with a size of 3.4 mm x 5 mm. The solder mask opening on the EP is approximately 3 mm x 3.1 mm. #part #template
Wi-Fi LED strip controller made with few goals:
Dual voltage support 12V and 24V
2 independent channels for color temperature adjustments
No high pitch noise in all modes
Powerful enough to handle current up to 17.5A (in total, limited by connectors)
Control buttons on the device body
Connectors for external buttons
Can be used with already installed LED strips
Support of open source firmware, like https://esphome.io/
Wi-Fi LED strip controller made with few goals:
Dual voltage support 12V and 24V
2 independent channels for color temperature adjustments
No high pitch noise in all modes
Powerful enough to handle current up to 17.5A (in total, limited by connectors)
Control buttons on the device body
Connectors for external buttons
Can be used with already installed LED strips
Support of open source firmware, like https://esphome.io/
SOT-89-3 is a small surface-mount package commonly used for electronic components. It has a body size of approximately 4.5 mm x 4.5 mm x 1.6 mm (L x W x H) with 3 pins. The lead pitch between the pins is typically 1.27 mm. The package is also known as Small Outline Transistor 89-3 or SOT-89-3. #part #template