SDRAM - Mobile LPDDR4X Memory IC 8Gbit Parallel 2.133 GHz 200-FBGA (10x15) The IM8G32L4JCBG-046I is an 8Gb (1GB) LPDDR4X SDRAM memory device designed for high-performance, low-power embedded applications. Organized as 256M × 32 bits, it delivers data rates up to 4266 MT/s, making it suitable for industrial computing, AI edge devices, networking equipment, automotive systems, and other memory-intensive applications. The LPDDR4X architecture reduces power consumption while maintaining high bandwidth and reliable operation across industrial temperature ranges. Key Features 8Gb (Gigabit) LPDDR4X SDRAM Memory organization: 256M × 32 bits High-speed operation up to 4266 MT/s Low-power LPDDR4X interface for reduced energy consumption 32-bit data bus width Industrial operating temperature range: –40°C to +95°C 200-ball FBGA package (10 mm × 15 mm) High bandwidth for demanding embedded applications Optimized for low-power and thermally constrained designs Suitable for industrial, automotive, networking, and edge AI systems #LPDDR4X #SDRAM #MemoryIC #EmbeddedSystems #IndustrialElectronics #EdgeComputing #AIoT #HighSpeedMemory #LowPowerDesign #AutomotiveElectronics #NetworkingHardware #FBGA #HardwareDesign #ElectronicsEngineering #PCBDesign #IntelligentMemory

Board to Board & Mezzanine Connectors .050\" SEARAY High-Speed High-Density Open-Pin-Field Array Terminal 400 Position Connector High Density Array, Male Surface Mount, Right Angle Gold SEAM-40-01-L-10-2-RA-K-TR is a high-speed, high-density board-to-board mezzanine connector from the Samtec SEARAY™ series. It features a right-angle, surface-mount design with 400 positions arranged in a 10-row open-pin-field array on a 1.27 mm (0.050") pitch. The connector utilizes Samtec's Edge Rate® contact system, providing excellent signal integrity, durability, and support for high-speed differential pair routing in demanding communication, networking, and embedded computing applications. Key Features High-density 400-position open-pin-field array connector 1.27 mm (0.050") contact pitch for compact board-to-board interconnects Right-angle, surface-mount termination Rugged Edge Rate® contact system for reliable high-speed performance Supports high-speed serial protocols and differential pair routing Suitable for power, ground, and signal connections within the same connector Gold-plated contacts for enhanced reliability and corrosion resistance Board-guide feature for improved mating alignment Current rating up to 1.9 A per contact Voltage rating up to 240 VAC / 339 VDC Tape-and-reel packaging for automated assembly processes RoHS compliant and designed for high-reliability applications #Samtec #SEARAY #SEAM4001L102RAKTR #BoardToBoardConnector #MezzanineConnector #HighSpeedConnector #HighDensityInterconnect #EdgeRate #SurfaceMount #RightAngleConnector #EmbeddedSystems #TelecomEquipment #NetworkingHardware #IndustrialElectronics #PCBDesign