Bluetooth, WiFi 802.11b/g/n, Bluetooth v5.0 Transceiver Module 2.4GHz PCB Trace Surface Mount The ESP32-S3-WROOM-1-N16R8 is a high-performance Wi-Fi + Bluetooth Low Energy (BLE) module developed by Espressif Systems. It is built around the ESP32-S3 SoC, featuring a dual-core Xtensa LX7 32-bit processor running up to 240 MHz. This module integrates 16 MB Flash memory and 8 MB PSRAM, making it suitable for memory-intensive applications such as AI, image processing, and advanced IoT systems. It also includes an onboard PCB trace antenna, RF circuitry, crystal oscillator, and power management components—allowing designers to quickly integrate wireless connectivity into compact embedded designs. Key Features Processing & Memory Dual-core Xtensa LX7 CPU, up to 240 MHz 384 KB ROM, 512 KB SRAM + 16 KB RTC SRAM 16 MB Flash (Quad SPI) 8 MB PSRAM (Octal/Quad SPI) Connectivity 2.4 GHz Wi-Fi (802.11 b/g/n) Bluetooth 5 (LE) + Mesh support Integrated PCB antenna Peripherals & Interfaces Up to 36 GPIOs Interfaces: UART, SPI, I2C, I2S, PWM, ADC, USB OTG Built-in USB Serial/JTAG support Supports touch sensors, timers, watchdogs, CAN (TWAI) Electrical Characteristics Supply voltage: 3.0 V – 3.6 V TX power: up to ~20.5 dBm RX sensitivity: ~-103.5 dBm Operating temp: −40 °C to +65 °C (typical) Advanced Capabilities Optimized for AI acceleration (vector instructions) Suitable for voice recognition, image processing, and edge AI Low-power modes for battery-operated devices| Typical Applications IoT devices and sensor hubs Smart home & home automation AIoT (voice/image recognition) Industrial automation & monitoring Wearables and health devices USB-connected embedded systems #Module #RF-Transceiver #ESP32-S3

Thermal Image Sensor 32H x 24V TO-39 #camera #IR #

CCD Image Sensor 5.5µm x 64µm 16-GLCC (15.2x6) #sensor #CCD #image

CMOS Image Sensor 1280H x 800V 3µm x 3µm 69-ODCSP (5.55x5.57) #CommonPartsLibrary #IntegratedCircuit #sensor #Transducer #Optical-Sensor #Image-Sensor #Camera #AR0144

Image Sensors AR0135CS2C00SUEA0-DPBR IBGA-63_L9.0-W9.0-P1.00_AR0135 LCSC Part Number: C606295 JLCPCB Part Class: undefined Manufactured by onsemi(安森美)

CMOS with Processor Image Sensor 1920H x 1080V 1.4µm x 1.4µm 34-CSP5 (3.85x2.92)

System On Chip (SOC) IC It integrates multiple processing units including CPUs, DSPs, AI accelerators, and GPU into a single chip to handle vision processing, deep learning, sensor fusion, and real-time control in automotive and industrial systems. • C7x floating point, vector DSP, up to 1.0GHz, 80 GFLOPS, 256 GOPS • Deep-learning matrix multiply accelerator (MMA), up to 8 TOPS (8b) at 1.0GHz • Vision Processing Accelerators (VPAC) with Image Signal Processor (ISP) and multiple vision assist accelerators • Depth and Motion Processing Accelerators (DMPAC) • Dual 64-bit Arm® Cortex®-A72 microprocessor subsystem at up to 2.0GHz – 1MB shared L2 cache per dual-core Cortex®- A72 cluster – 32KB L1 DCache and 48KB L1 ICache per Cortex®-A72 core • Six Arm® Cortex®-R5F MCUs at up to 1.0GHz – 16K I-Cache, 16K D-Cache, 64K L2 TCM – Two Arm® Cortex®-R5F MCUs in isolated MCU subsystem – Four Arm® Cortex®-R5F MCUs in general compute partition • Two C66x floating point DSP, up to 1.35GHz, 40GFLOPS, 160GOPS • 3D GPU PowerVR® Rogue 8XE GE8430, up to 750MHz, 96GFLOPS, 6Gpix/sec • Custom-designed interconnect fabric supporting near max processing entitlement Memory subsystem: • Up to 8MB of on-chip L3 RAM with ECC and coherency – ECC error protection – Shared coherent cache – Supports internal DMA engine • External Memory Interface (EMIF) module with ECC – Supports LPDDR4 memory types – Supports speeds up to 4266MT/s – 32-bit data bus with inline ECC • General-Purpose Memory Controller (GPMC) • 512KB on-chip SRAM in MAIN domain, protected by ECC #CommonPartsLibrary #IntegratedCircuit

CCD LINEAR IMAGE SENSOR CCD(Charge Coupled Device) #CommonPartsLibrary #IntegratedCircuit

The onsemi AR2020 is a stacked 1/1.8-inch back side illuminated (BSI) CMOS active-pixel digital image sensor with a pixel array of 5120H x 3840V (5136H x 3856V including border pixels). The AR2020 has enhanced NIR response. It incorporates sophisticated on-chip camera functions such as Wake on Motion (WOM), context switching and multiple subsampling modes. It is programmable through a simple I2C interface and has very low power consumption. The AR2020 digital image sensor features onsemi's breakthrough low-noise CMOS imaging technology. The AR2020 sensor can generate full resolution image at up to 60 frames per second (fps) in 10-bit linear mode. AR2020 can achieve 30 fps in line interleaved high dynamic range (LI-HDR) and enhanced Dynamic Range (eDR) modes. #sensor #Transducer #Optical-Sensor #Image-Sensor #Hyperlux™ LP

ARM® Cortex®-M0+ - Microcontroller IC 32-Bit Dual-Core 133MHz External Program Memory 56-QFN (7x7) Part Description The RP2040 by Raspberry Pi is an ARM® Cortex®-M0+ microcontroller featuring a 32-Bit Dual-Core processor capable of running at 133MHz. It supports external program memory and integrates a comprehensive set of peripherals including I2C, IrDA, QSPI, SPI, UART/USART, USB, and more. This IC is packaged in a 56-pin QFN (7x7) with exposed pads, making it ideal for surface-mount applications and high-density designs. Additional features include integrated data converters (4x12b SAR A/D), 264K x 8 RAM, and robust connectivity along with peripherals like brown-out detection, DMA, I2S, LCD control, POR, PWM, and Watchdog Timer. Note that the image is a representation only; exact specifications must be confirmed via the product datasheet. Manufacturer Lead Time: 8 Weeks Packaging Options: Tape & Reel (TR) Cut Tape (CT) Digi-Reel® Hashtags #RP2040 #ARM #CortexM0Plus #DualCore #133MHz #Microcontroller #Embedded #RaspberryPi #56QFN #SurfaceMount #ExternalMemory #TapeAndReel #CutTape #DigiReel