USB-C (USB TYPE-C) USB 2.0 Receptacle Connector 24 (16+8 Dummy) Position Surface Mount, Right Angle; Through Hole USB Type-C receptacle 16 pin USB2.0 The USB4215-03-A is a USB Type-C receptacle connector designed for USB 2.0 applications. It features a 16-pin configuration supporting reversible plug orientation with standard USB 2.0 differential data lines and configuration channel (CC) pins. The connector is intended for surface-mount PCB assembly with through-hole shell stakes for enhanced mechanical strength. It is widely used in compact embedded systems for power delivery, charging interfaces, and basic data communication. Key Features USB Type-C receptacle (USB 2.0 compliant) 16 functional pins (no SuperSpeed support) Reversible plug orientation Surface-mount contacts with through-hole shell tabs Compact, low-profile design High insertion cycle durability Suitable for automated assembly Electrical Characteristics Rated Current: VBUS: up to 5.0 A (depending on PCB design and cable) Signal pins: 0.25 A max Rated Voltage: 20 V DC max Contact Resistance: ≤ 40 mΩ Insulation Resistance: ≥ 100 MΩ Dielectric Withstanding Voltage: 100 V AC Mechanical Characteristics Mounting Type: Surface Mount (SMT) with Through-Hole Shield Tabs Number of Positions: 16 Mating Cycles: 10,000 cycles (typical) Insertion Force: 5–20 N Extraction Force: 8–20 N Material Specifications Contacts: Copper Alloy Contact Plating: Gold over Nickel Housing: High-temperature thermoplastic (UL94V-0) Shell: Stainless Steel Environmental Characteristics Operating Temperature Range: -25°C to +85°C Storage Temperature Range: -40°C to +85°C RoHS Compliant: Yes Halogen Free: Yes Pin Configuration (USB 2.0 Type-C) VBUS (Power) GND (Ground) D+ / D− (USB 2.0 differential pair) CC1 / CC2 (Configuration channel) SBU pins (optional/unused in USB 2.0 designs) Applications USB power input (5 V / USB-C PD trigger designs) Embedded systems and development boards Consumer electronics Charging interfaces Low-speed USB communication devices Packaging Tape & Reel for automated pick-and-place assembly Compliance & Standards USB Type-C Specification (USB 2.0 interface) RoHS / REACH compliant UL recognized materials #CommonPartsLibrary #Connector #USB-C

4/4 Transceiver Full MII, RMII 32-VQFN (5x5) ## Engineering Specification ## General Description The **LAN8770M-I/PRA** is a Microchip Technology single-port **100BASE-T1 Ethernet physical layer transceiver** designed for automotive, industrial, and embedded networking applications. It provides Ethernet communication over a single balanced twisted pair and is suitable for compact systems requiring reliable network connectivity, low-power operation, and standard MAC interface support. The device is commonly used in automotive electronic control units, infotainment systems, telematics modules, sensor nodes, industrial control systems, and embedded Ethernet hardware. ## Device Identification Manufacturer Part Number: **LAN8770M-I/PRA** Manufacturer: **Microchip Technology** Product Family: **LAN8770** Device Category: **Integrated Circuit** Device Type: **Ethernet PHY Transceiver** Ethernet Standard: **100BASE-T1** Interface Type: **MII and RMII** Mounting Type: **Surface Mount** Package Type: **VQFN** ## Functional Description The device functions as an Ethernet physical layer transceiver that connects a host controller or microcontroller MAC interface to a single-pair Ethernet physical medium. It handles the analog and digital PHY functions required for 100BASE-T1 communication, allowing embedded systems to transmit and receive Ethernet data over a single twisted pair cable. ## Network and Interface Description The **LAN8770M-I/PRA** supports 100 Mb/s single-pair Ethernet communication and provides MII and RMII host interface options. This allows integration with microcontrollers, processors, gateways, and network controllers that support standard Ethernet MAC interfaces. The device is intended for applications where compact Ethernet connectivity and reduced cabling complexity are required. ## Electrical Description The device is designed for low-voltage operation and supports multiple supply domains according to the manufacturer’s recommended operating conditions. Proper power sequencing, decoupling, reset handling, clocking, and reference layout should be implemented to maintain stable PHY operation and signal integrity. ## Package and Mechanical Description The component is supplied in a compact surface-mount **VQFN package**, suitable for dense printed circuit board assemblies. The package supports automated assembly and is appropriate for space-constrained automotive and industrial electronic designs. ## Control and Diagnostic Description The PHY supports management and configuration through standard control interfaces used in Ethernet designs. It provides status monitoring and configuration capability for link management, operating mode selection, and system-level diagnostics. These features allow the host controller to configure and monitor Ethernet link behavior during operation. ## Automotive and Industrial Suitability The **LAN8770M-I/PRA** is suitable for embedded systems requiring robust single-pair Ethernet communication. It is applicable to automotive networking, telematics, infotainment, advanced driver assistance systems, industrial Ethernet nodes, building automation, control modules, and other connected embedded platforms. ## Mounting and Assembly Description The component is intended for surface-mount PCB assembly using standard reflow soldering processes. PCB layout should follow Microchip’s hardware design guidance, including proper power supply decoupling, controlled impedance routing, short signal paths, grounding, and separation of sensitive analog and digital sections where applicable. ## Design Considerations The design should account for Ethernet signal integrity, single-pair cable interface requirements, common-mode noise control, EMC performance, supply filtering, oscillator or clock source requirements, reset timing, thermal performance, and package solderability. The device should not be operated beyond the manufacturer’s specified electrical, thermal, or mechanical limits. ## Application Suitability The device is suitable for automotive Ethernet nodes, electronic control units, telematics modules, infotainment systems, sensor interfaces, industrial controllers, embedded gateways, connected equipment, and compact network-enabled hardware requiring 100BASE-T1 Ethernet PHY functionality. ## Hashtags #commonpartslibrary #integratedcircuit #ethernetphy #microchip #microchiptechnology #lan8770 #lan8770mipra #singlepairethernet #100baset1 #automotiveethernet #ethernettransceiver #phytransceiver #embeddednetworking #mii #rmii #vqfnpackage #smdcomponent #surfacemount #automotiveelectronics #industrialethernet #telematics #infotainment #embeddedhardware #pcbdesign #hardwaredesign #electronicscomponents #electronicparts #componentlibrary #engineeringparts #electronicsengineering

Mobile Communications PMIC 30-WLP (2.62x3.07) The MAX77958EWV+ is a highly integrated USB Type-C and USB Power Delivery (USB PD) controller designed for portable and battery-powered electronic systems. Manufactured by Analog Devices/Maxim Integrated, the device provides complete USB Type-C Configuration Channel (CC) detection, USB PD protocol management, and power path control functionality within a compact wafer-level package. It is optimized for applications requiring flexible USB charging, power negotiation, and accessory support while minimizing external component count and system complexity. The device integrates a USB Type-C Port Controller (TCPC), Power Delivery Policy Engine, BC1.2 charger detection, VCONN management, dead battery support, and integrated protection features. It supports both sink and dual-role power operation, enabling intelligent power negotiation between connected devices and external power adapters. The controller communicates with the host processor through an I²C interface, allowing firmware-based configuration and monitoring. The MAX77958EWV+ is intended for smartphones, tablets, wearable devices, portable computing platforms, docking stations, embedded systems, and other USB Type-C enabled consumer electronics requiring reliable power delivery and advanced USB connectivity management. Electrical Characteristics The device operates from a low-voltage supply optimized for portable electronic systems. It supports USB Type-C and USB Power Delivery specifications with integrated CC line monitoring and protocol handling. The controller includes internal voltage regulation and protection mechanisms to ensure reliable operation during attachment, detachment, and fault conditions. The integrated USB Power Delivery engine supports multiple power profiles and dynamic voltage negotiation. The device supports sink functionality for charging applications and can be configured for dual-role operation depending on system requirements. Low standby current operation enables efficient battery-powered system implementation while maintaining USB attach detection capability. Functional Features Integrated USB Type-C Port Controller compliant with USB Type-C standards USB Power Delivery protocol engine supporting power negotiation and role management Support for sink and dual-role power configurations Integrated BC1.2 charger detection capability Dead battery support for autonomous attachment detection Integrated VCONN switch and cable orientation detection Automatic CC pin monitoring and cable attach detection I²C interface for host processor communication and configuration Integrated interrupt generation for event handling Support for programmable power profiles and policy management Internal fault monitoring and protection features Compact wafer-level package suitable for space-constrained applications Protection Features Overvoltage monitoring on USB Type-C interface lines Short-circuit protection support Thermal protection and fault detection mechanisms Integrated VCONN current limiting ESD protection for external USB interface connections Safe attach and detach handling during cable insertion events Interface Characteristics USB Type-C CC interface compliant with USB Type-C specifications I²C serial communication interface for host control Interrupt output for event notification Integrated support for orientation detection and cable identification Programmable configuration registers accessible through I²C Package Information Package type is wafer-level package optimized for compact portable designs RoHS compliant and suitable for lead-free manufacturing processes Designed for automated surface-mount assembly Applications Smartphones and mobile devices Tablet computers Wearable electronics Portable battery-powered equipment USB Type-C charging systems Embedded USB PD controllers Docking stations and accessories Consumer electronic products requiring USB Type-C connectivity #commonpartslibrary #integratedcircuit #powermanagement #mobilecommunications

2 MP MIPI® CSI-2 FPD-Link III serializer for 2MP/60fps cameras & radar The DS90UB953-Q1 is an automotive-grade high-speed serializer designed to convert parallel image sensor data into a high-speed serial stream for transmission over a single differential pair using FPD-Link III technology. It is intended for use in camera-based systems where compact cabling, high data integrity, and low latency are required. The device interfaces directly with image sensors through a MIPI CSI-2 input and transmits video, control, and GPIO data over a single coaxial or shielded twisted pair cable. Integrated clocking and control features allow synchronization with remote deserializers, enabling robust communication in electrically noisy environments typical of automotive and industrial applications. Functional Description The device receives image data from a connected sensor through a MIPI CSI-2 interface and serializes this data for transmission over a high-speed differential link. In addition to video data, bidirectional control communication is supported through an embedded control channel, allowing configuration and monitoring of remote devices using an I²C interface. The serializer incorporates programmable GPIO functionality that can be used for control signaling or sensor monitoring, with the ability to transport these signals across the link. Internal clock generation and phase-locked loop circuitry support multiple clocking modes, enabling flexible system design with either local or remote reference clocks. The device also includes pattern generation capabilities for system testing and validation. Electrical Characteristics The component operates from multiple power domains supporting core logic, I/O, and phase-locked loop functions. It is designed to provide stable high-speed signal transmission with controlled impedance outputs and low jitter characteristics. The differential serial output supports reliable long-distance communication over coaxial or twisted-pair media. Input interfaces are optimized for compatibility with standard MIPI CSI-2 signaling, ensuring seamless integration with modern image sensors. The control interface uses an open-drain I²C protocol for configuration and communication. Mechanical Characteristics The device is provided in a compact quad flat no-lead package suitable for high-density PCB designs. The package includes an exposed thermal pad that serves both as a heat dissipation path and a low-impedance electrical ground connection. The small footprint and low profile make it well suited for space-constrained applications such as camera modules and embedded vision systems. Environmental Characteristics The DS90UB953-Q1 is qualified for automotive applications and is designed to operate reliably over extended temperature ranges and under conditions of electrical noise, vibration, and mechanical stress. The device is compatible with standard surface-mount assembly processes, including lead-free reflow soldering. Materials and construction comply with relevant environmental and reliability standards for automotive-grade electronic components. Materials and Construction The package body is constructed from high-temperature thermally stable materials suitable for reflow soldering. Electrical contacts are formed from copper-based alloys with plated finishes to ensure long-term conductivity, corrosion resistance, and mechanical durability. The exposed pad is designed to interface directly with the PCB ground plane for improved thermal and electrical performance.