Stereo Audio Interface 24 b Serial 28-TSSOP #commonpartslibrary #integratedcircuit #audiointerface #codecs #stereo

Audio Interface 32 b I2C, SPI 48-QFN (6x6) #commonpartslibrary #integratedcircuit #codecs #audiointerface

VOIP Interface 16 b Serial 48-LQFP (7x7) #CommonPartsLibrary #IntegratedCircuit #Interface #CODECS #TLV320

Stereo Audio Interface 32 b I2C, Serial, SPI™ 40-WQFN (5x5) #commonpartsLibrary #integratedcircuit #codecs

The TS3008-C Bluetooth module, manufactured by Tinysine Electronics. This module utilizes the QCC3008 QFN chipset. Key features include support for various Bluetooth profiles such as A2DP, AVRCP, HFP, HSP, SPP, and more, alongside advanced music enhancements like aptX, aptX Low Latency, SBC, and AAC audio codecs. The module also supports Qualcomm TrueWireless Stereo for stereo pairing and offers configurable signal detection, multiple EQ banks, and audio processing enhancements.

Through‑Hole Breakout Board for Tinysine TS3008 Bluetooth Audio Module