22 (20 + 2 Power) Position Connector Header, Outer Shroud Contacts Surface Mount Gold The BM24-20DP/2-0.35V(51) is a board-to-board and board-to-FPC header connector manufactured by Hirose Electric. It belongs to the BM24 series, a family of fine-pitch hybrid power and signal connectors designed for applications that require both data signaling and supplementary power delivery within the same compact interconnect, eliminating the need for a separate dedicated power connector alongside the signal interface. The connector functions as the plug (header) half of a mating pair, intended to mate with a corresponding BM24 receptacle to join two printed circuit boards, or a printed circuit board and a flexible printed circuit, in a low-profile board-to-board arrangement. This part number designates a configuration with a defined signal contact count supplemented by additional dedicated power contacts, reflecting the series' hybrid design philosophy in which the majority of positions handle signal or data lines while a smaller subset of positions is reserved for carrying higher current to support onboard power rails. This arrangement is particularly useful in compact consumer devices such as smartphones, wearables, and camera modules, where both data interfaces and local power distribution must be routed across a board-to-board junction without dedicating separate connectors to each function. The series is positioned by Hirose as supporting high-speed signaling standards including USB interfaces, making it suitable for applications that combine high-speed data transmission with power delivery in a single compact connector footprint. The connector's fine contact pitch and low mated height make it well suited to thin, space-constrained form factors where minimizing both footprint area and stack height is a priority. As with other Hirose board-to-board offerings, the connector is non-polarized in its base mechanical design, and it is supplied on embossed carrier tape for automated pick-and-place assembly, with construction compliant to RoHS material restrictions. Mechanically, the header is built to withstand the repeated mating cycles typical of consumer electronics manufacturing, rework, and field service, while maintaining stable, low-resistance contact across both its signal and power contact paths under realistic vibration and thermal conditions. As a header-style connector, it is intended to be soldered directly to a host PCB, with its mating receptacle counterpart soldered to the opposing board or FPC, allowing the assemblies to be joined and separated as needed throughout the product lifecycle. Spec Sheet Identification Part Number: BM24-20DP/2-0.35V(51) Series: BM24 Connector Style: Hybrid power/signal board-to-board and board-to-FPC connector Connector Type / Configuration Type: Header (plug) Gender: Male Orientation: Straight, surface mount Contact Arrangement: Hybrid configuration combining signal contacts and dedicated power contacts Polarization: Non-polarized Electrical Ratings Applicable High-Speed Protocols: USB2.0, USB3.0, USB3.1 (series capability) Transmission Rate: High-speed, multi-gigabit class (series capability) Power Contacts: Dedicated higher-current contacts integrated alongside signal contacts Mechanical Specifications Contact Pitch: Fine pitch Mounting Pitch: Matches contact pitch Mated Height: Low-profile Mounting Method: Surface mount technology (SMT) Mating Cycles: Rated for repeated mate/unmate cycles typical of consumer electronics assembly and rework Contact & Material Properties Contact Plating (Mating Area): Gold Insulator Material: High-temperature engineering resin suitable for SMT reflow Environmental Ratings RoHS Compliance: Yes Packaging Packaging Format: Embossed carrier tape, reel format Packaging Code Meaning: Suffix denotes embossed tape packaging at a standard reel quantity Mating Compatibility Mates With: Corresponding BM24 series receptacle connector Application Note: Intended for hybrid power and signal board-to-board or board-to-FPC interconnection in compact consumer electronics #BM24 #Hirose #HiroseElectric #BoardToBoard #BoardToFPC #HybridConnector #PowerAndSignal #Connector #SMTConnector #FinePitchConnector #USB #HighSpeedConnector #ConsumerElectronics #PCBDesign #HardwareEngineering #ConnectorDatasheet #EngineeringSpec #RoHSCompliant #ComponentLibrary #CommonPartsLibrary

100 Position Connector Receptacle, Center Strip Contacts Surface Mount Gold The DF40C-100DS-0.4V(51) is a board-to-board and board-to-FPC receptacle connector manufactured by Hirose Electric. It belongs to the DF40 series, a family of fine-pitch stacking connectors intended for compact, high-density interconnect applications such as mobile devices, cameras, wearables, and other space-constrained electronics. The connector functions as the receptacle (socket) half of a mating pair, designed to stack with a corresponding DF40 plug header to join two printed circuit boards, or a printed circuit board and a flexible printed circuit, in a low-profile vertical arrangement. This particular part number represents the full-position, low-profile variant within the series, configured without a reinforcing metal fitting and without a locating boss or mechanical holddown feature, meaning it relies on the contact array itself rather than additional structural hardware for mechanical retention during reflow and handling. The connector is supplied in straight, surface-mount form and is non-polarized, so it can be inserted in either orientation relative to its mating counterpart. Contacts are arranged in parallel rows along the connector body, with gold plating in the contact mating area to ensure reliable signal continuity and resistance to oxidation over repeated use. The series is positioned by Hirose as a general-purpose, high-speed-capable interconnect, suitable for a range of differential and single-ended signaling standards used in consumer and industrial electronics, with the broader DF40 family supporting interfaces such as USB, MIPI, SATA, and PCIe. Its low stacking height and fine contact pitch make it well suited to applications where board-to-board spacing must be minimized, such as camera modules, display modules, or stacked daughterboard architectures in handheld and wearable products. The connector is packaged on embossed carrier tape for automated pick-and-place assembly, and its construction is compliant with RoHS material restrictions. Mechanically, the connector body is built to support repeated mating cycles typical of consumer electronics assembly and rework, while maintaining stable electrical contact under vibration and thermal cycling across its rated environmental range. As a stacking-style connector rather than a card-edge or cable-mount type, it is intended to be soldered directly to a host PCB pad pattern, with the mating plug soldered to the corresponding board or FPC, allowing the two assemblies to be joined and separated as needed during manufacturing, test, or service operations. Spec Sheet Identification Part Number: DF40C-100DS-0.4V(51) Series: DF40 Variant: "C" type — without reinforcing metal fitting Connector Type / Configuration Type: Receptacle (socket), board-to-board / board-to-FPC Gender: Female Orientation: Straight Row Arrangement: Dual row Polarization: Non-polarized Locking/Retention Feature: None (no metal holddown or locating boss) Electrical Ratings Current Rating: Low-current signal class Voltage Rating: Standard signal-level rating typical of fine-pitch board-to-board connectors Applicable High-Speed Protocols: USB, MIPI, SATA, PCIe (series capability) Transmission Rate: High-speed, multi-gigabit class (series capability) Mechanical Specifications Contact Pitch: Fine pitch Mounting Pitch: Matches contact pitch Stacking/Mated Height: Low-profile Mounting Method: Surface mount technology (SMT) Mating Cycles: Rated for repeated mate/unmate cycles typical of consumer electronics rework Contact & Material Properties Contact Material: Phosphor bronze Contact Plating (Mating Area): Gold Insulator Color: Black Insulator Material: High-temperature engineering resin suitable for SMT reflow Environmental Ratings Operating Temperature Range: Extended consumer/industrial range RoHS Compliance: Yes Packaging Packaging Format: Embossed carrier tape, reel format Packaging Code Meaning: Suffix denotes embossed tape packaging at a standard reel quantity Mating Compatibility Mates With: Corresponding DF40 series plug/header connector Application Note: Intended for mezzanine-style stacking between two PCBs or between a PCB and FPC #DF40 #Hirose #HiroseElectric #BoardToBoard #BoardToFPC #StackingConnector #CommonPartsLibrary #Connector #SMTConnector #FinePitchConnector #MezzanineConnector #ElectronicComponents #PCBDesign #HardwareEngineering #ConnectorDatasheet #EngineeringSpec #ConsumerElectronics #HighSpeedConnector #RoHSCompliant #ComponentLibrary