TO-263-5_TabPin6 is a surface-mount package commonly used for electronic components. It has a body size of approximately 16mmx11mm x5mm (L x W x H) with 5 pins and a tab pin configuration. The tab pin, labeled as Pin 6, is connected to the tab or heat sink of the package. The lead pitch between the other pins is typically P mm. The package is also known as D2PAK-5, DPAK-5, or DDPAK-5.

SOT-723 is a small surface-mount package commonly used for electronic components. It has a body size of approximately 1.1 mm x 0.8 mm x 0.4 mm (L x W x H) with 3 pins and a lead pitch of 0.65 mm. Pin 1 is located in the lower left corner when viewed from the flat side. The package is also known as SC-101, SMD101, or EMD6. #part #template

TO-218-3 is a through-hole package commonly used for high-power electronic components. It has a body size of approximately 21.4 mm x 13.5 mm x 4.7 mm (L x W x H) with 3 pins. The package features a metal tab for heat dissipation, which is often connected to the chassis or heat sink. Pin 1 is typically located on the left side when viewed from the flat side, with pins 2 and 3 on the right side. The lead pitch between the pins is typically 5.08 mm. The package is also known as TO-218AB or TO-3P. #part #template

HTSSOP-14-1EP is a small surface-mount package commonly used for electronic components. It has a body size of approximately 4.4 mm x 5 mm (L x W) with 14 pins. The lead pitch between the pins is typically 0.65 mm. The package features an exposed pad (EP) with a size of 3.4 mm x 5 mm. The solder mask opening on the EP is approximately 3 mm x 3.1 mm. #part #template

TO-263-3 TabPin4 is a surface-mount package commonly used for electronic components. It has a body size of approximately 10.4mm x 9.6mm x 4.6mm (L x W x H) with 3 pins and a tab pin configuration. Pin 1 is typically located in the lower left corner when viewed from the flat side, while the tab pin, labeled as Pin 4, is connected to the tab or heat sink of the package. The package is also known as D2PAK-3, DPAK-3, or DDPAK-3. #part #template

SOT-666 is a small surface-mount package commonly used for electronic components. It has a body size of approximately 1.2mm x 0.8mm x 0.4mm (L x W x H) with N pins and a lead pitch of 0.5mm. Pin 1 is located in the lower left corner when viewed from the flat side. #part #template

TSOT-23-8 is a small surface-mount package commonly used for electronic components. It has a body size of approximately 2.8 mm x 2.8 mm x 0.9 mm (L x W x H) with 8 pins. The lead pitch between the pins is typically 0.95 mm. The package is also known as Thin Small Outline Transistor 23-8 or TSOT-23-8. #part #template

SOT-523 is a small surface-mount package commonly used for electronic components. It has a body size of approximately 1.0 mm x 0.6 mm x 0.4 mm (L x W x H) with 3 pins and a lead pitch of 0.35 mm. Pin 1 is located in the lower left corner when viewed from the flat side. The package is also known as SC-89, SMD89, or EMD2. #part #template

TO-218-2 is a through-hole package commonly used for high-power electronic components. It has a body size of approximately 21.4 mm x 13.5 mm x 4.7 mm (L x W x H) with 2 pins. The package features a metal tab for heat dissipation, which is often connected to the chassis or heat sink. Pin 1 is typically located on the left side when viewed from the flat side, while pin 2 is on the right side. The lead pitch between the pins is typically 5.08 mm. The package is also known as TO-218AA or TO-3P. #part #template

TO-263-7 TabPin8 is a surface-mount package commonly used for electronic components. It has a body size of approximately 10.2 mm x 12.2 mm x 3.2 mm (L x W x H) with 7 pins and a tab pin configuration. Pin 1 is typically located in the lower left corner when viewed from the flat side, while the tab pin, labeled as Pin 8, is connected to the tab or heat sink of the package. The lead pitch between the other pins is typically 2.54 mm. The package is also known as D2PAK-7, DPAK-7, or DDPAK-7. #part #template

SO-14 is a small outline package commonly used for electronic components. It has a body size of approximately 3.9 mm x 8.65 mm (L x W) with 14 pins. The lead pitch between the pins is typically 1.27 mm. The package is also known as Small Outline 14 or SO-14. #part #template

SOT-553 is a small surface-mount package commonly used for electronic components. It has a body size of approximately 1.6 mm x 1.6 mm x 0.6 mm (L x W x H) with 5 pins and a lead pitch of 0.65 mm. Pin 1 is located in the lower left corner when viewed from the flat side. The package is also known as SC-89-5, SMD89-5, or EMD4. #part #template

SOT-665 is a small surface-mount package commonly used for electronic components. It has a body size of approximately 2.3 mm x 2 mm x 1 mm (L x W x H) with N pins and a lead pitch of P mm. Pin 1 is located in the lower left corner when viewed from the flat side. #part #template

LGA-12 is a small surface-mount package commonly used for electronic components. It has a body size of approximately 2 mm x 2 mm (L x W) with 12 pins. The lead pitch between the pins is typically 0.5 mm. The package is also known as Land Grid Array 12 or LGA-12. #part #template

SO-16 is a small outline package commonly used for electronic components. It has a body size of approximately 3.9 mm x 9.9 mm (L x W) with 16 pins. The lead pitch between the pins is typically 1.27 mm. The package is also known as Small Outline 16 or SO-16. #part #template

LFCSP-16-1EP is a small surface-mount package commonly used for electronic components. It has a body size of approximately 3 mm x 3 mm (L x W) with 16 pins. The lead pitch between the pins is typically 0.5 mm. The package features an exposed pad (EP) with a size of approximately 1.7 mm x 1.7 mm. #part #template

SOT-543 is a small surface-mount package commonly used for electronic components. It has a body size of approximately 1.6 mm x 1.2 mm x 0.55 mm (L x W x H) with 4 pins and a lead pitch of 0.5 mm. Pin 1 is located in the lower left corner when viewed from the flat side. The package is also known as SC-75, SMD75, or EMD3. #part #template

SOT-886 is a small surface-mount package commonly used for electronic components. It has a body size of approximately 1.3 mmx1.7mm x1mm (L x W x H) with 6 pins and a lead pitch of 0.5mm. Pin 1 is located in the lower left corner when viewed from the flat side #part #template

SOT-563 is a small surface-mount package commonly used for electronic components. It has a body size of approximately 1.6 mm x 1.6 mm x 0.55 mm (L x W x H) with 6 pins and a lead pitch of 0.65 mm. Pin 1 is located in the lower left corner when viewed from the flat side. The package is also known as SC-89-6, SMD89-6, or EMD5. #part #template

SOT-223-5 is a surface-mount package commonly used for electronic components. It features a body size of approximately 6.7 mm x 6.1 mm x 2.5 mm (L x W x H) with 5 pins and a lead pitch of 2.54 mm. Pin 1 is located in the lower left corner when viewed from the flat side. The package is also known as TO-261-5, D2PAK-5, and SC-73. #part #template