EEPROM Memory IC 256Kbit I2C 1 MHz 450 ns 8-SO The M24256E-FMN6TP is a 256-Kbit (32 Kbyte) I²C-compatible serial EEPROM from STMicroelectronics. It is designed for reliable, non-volatile data storage in a wide range of electronic applications including consumer, industrial, and automotive systems. The device supports standard (100 kHz), fast (400 kHz), and fast-mode plus (1 MHz) I²C communication, enabling efficient data transfer. It features byte and page write operations, low power consumption, and a high endurance of write cycles, making it suitable for frequent data logging and configuration storage. Housed in a compact SO8 package, the device is optimized for space-constrained PCB designs while maintaining robust performance and data retention capabilities. Key Features Memory size: 256 Kbit (32 Kbyte) Interface: I²C (2-wire serial interface) Clock frequency: Standard mode: 100 kHz Fast mode: 400 kHz Fast-mode Plus: 1 MHz Supply voltage range: 1.7 V to 5.5 V Page write capability: up to 64 bytes Write cycle time: ~5 ms (typical) Data retention: > 200 years Endurance: > 4 million write cycles Hardware write protection available ESD protection and latch-up immunity Functional Description The device operates as a slave on the I²C bus and supports: Byte write and read Page write (up to 64 bytes) Random and sequential read operations Memory addressing is internally managed using a 16-bit address pointer, allowing access to the full 32 KB memory array. The device includes an internal write cycle controller, eliminating the need for external timing management. Pin Configuration (SO8 Package) A0, A1, A2: Device address inputs VSS: Ground SDA: Serial data line SCL: Serial clock line WC: Write control (hardware write protection) VCC: Supply voltage Absolute Maximum Ratings Supply voltage (VCC): -0.3 V to 6.5 V Input voltage: -0.3 V to VCC + 0.6 V Storage temperature: -65°C to +150°C Operating temperature (industrial grade): -40°C to +85°C Electrical Characteristics Low standby current: < 1 µA (typical) Operating current: < 1 mA Input/output compatible with CMOS logic levels Schmitt trigger inputs for noise immunity Timing Characteristics Write cycle time: 5 ms (typical) Fast-mode Plus support up to 1 MHz Sequential read supports continuous data streaming Package Information Package type: SO8 (8-lead Small Outline) Mounting: Surface-mount (SMD) Tape & reel packaging (TP suffix) Applications Configuration storage Calibration data storage Data logging systems Industrial control systems Consumer electronics Embedded systems requiring non-volatile memory Advantages High endurance and long data retention Wide voltage range (ideal for mixed-voltage systems) Compact footprint High-speed I²C compatibility (up to 1 MHz) #commonpartslibrary #integratedcircuit #memory

Buck Switching Regulator IC Positive Adjustable 0.8V 1 Output 3A 24-WFQFN Exposed Pad General Description: The RTQ2105GQWT-QA is an electronic component designed for integration into compact and efficiency-focused circuit applications. It is engineered to deliver stable performance under varying operating conditions, making it suitable for use in consumer electronics, embedded systems, and power management solutions. The device emphasizes reliability, low power consumption, and consistent signal or power regulation, depending on its intended application within a system. Its form factor supports space-constrained designs while maintaining thermal and electrical stability. Functional Overview: The component provides controlled operation within a defined electrical range, ensuring dependable interaction with surrounding circuitry. It is optimized for seamless compatibility with standard board layouts and commonly used electronic assemblies. The design supports continuous operation with minimal performance drift and is built to handle typical environmental and electrical stresses encountered in modern devices. Electrical Characteristics: The device operates within a specified voltage and current range appropriate for low-power or signal-level applications. It maintains stable output behavior across its operating conditions and includes internal features that support protection, regulation, or signal integrity as required by its functional role. Mechanical Characteristics: The component is housed in a compact package suitable for surface-mount technology. Its physical structure is designed to facilitate automated assembly and secure placement on printed circuit boards. The package ensures adequate heat dissipation and mechanical durability during normal operation. Environmental Considerations: The RTQ2105GQWT-QA is designed to function reliably across a standard range of environmental conditions, including variations in temperature and humidity. It complies with common industry expectations for durability and long-term use in electronic systems. Application Guidelines: This component is intended for use in systems requiring efficient, stable, and compact electronic solutions. Proper circuit design practices should be followed to ensure optimal performance, including appropriate layout, grounding, and thermal management considerations. Compliance and Standards: The device is manufactured in accordance with relevant industry standards for electronic components, supporting quality, safety, and environmental requirements. #commonpartslibrary #integratedcircuit #powermanagement

Connector Header Surface Mount 12 position 0.049" (1.25mm) 53398-1271 The 0533981271 is a board-to-wire connector assembly component designed to provide a reliable electrical and mechanical interface between a printed circuit board and discrete wire harnesses. It belongs to a compact connector system intended for applications requiring secure mating, efficient signal transmission, and ease of assembly. The component is engineered to support consistent electrical contact performance while maintaining a small footprint suitable for space-constrained designs. Its construction ensures dependable connectivity under typical operating conditions encountered in consumer electronics, industrial equipment, and embedded systems. Functional Description This connector component serves as part of a modular interconnect system, enabling termination of wires and subsequent mating to a corresponding board-mounted header. It provides stable retention and alignment during mating and unmating operations, ensuring consistent electrical continuity. The design supports straightforward integration into automated or manual assembly processes, facilitating efficient production workflows. Contact geometry and housing features are optimized to maintain reliable engagement and minimize the risk of intermittent connections. Electrical Characteristics The component is designed to support low-voltage signal and power transmission in compact electronic systems. It provides low contact resistance to ensure efficient current flow and stable signal integrity. Insulation materials are selected to maintain dielectric performance and prevent leakage under normal operating conditions. The connector system is suitable for typical electronic applications where consistent and reliable electrical performance is required. Mechanical Characteristics The connector features a durable housing constructed from engineered thermoplastic material, providing mechanical strength and resistance to environmental stress. Contact elements are formed from conductive alloys and finished to enhance conductivity and corrosion resistance. The design includes features that promote secure mating retention and proper alignment, reducing wear and ensuring longevity over repeated use. Its compact form factor supports high-density layouts on printed circuit boards. Environmental Characteristics The component is designed to operate reliably within standard environmental conditions encountered in electronic equipment. Materials used in the housing and contacts are selected for thermal stability and resistance to common environmental factors such as humidity and mechanical vibration. The connector system maintains performance over typical temperature ranges associated with consumer and industrial applications. Applications This connector is intended for use in electronic systems requiring compact and reliable wire-to-board interconnection. Common applications include consumer devices, industrial control systems, embedded modules, and communication equipment where dependable signal or power connectivity is essential. Summary The 0533981271 from Molex is a compact and reliable connector solution for board-to-wire applications. It offers consistent electrical performance, robust mechanical design, and ease of integration, making it well suited for modern electronic assemblies requiring dependable interconnect solutions. #commonpartslibrary #connector #header

Mass Air Flow Sensor, Open-drain, 10 Pin The FS3000-1005 is a fully integrated, MEMS-based air velocity (flow) sensor designed for precise and reliable measurement of gas flow in compact systems. It utilizes a thermal transfer principle and includes onboard signal conditioning, calibration, and digital output, making it suitable for direct interface with microcontrollers. This sensor is optimized for low-flow air or gas applications such as HVAC systems, environmental monitoring, airflow detection in consumer electronics, and industrial process control. Its compact surface-mount package allows easy integration into space-constrained designs. Key Features MEMS thermal-based air velocity sensing Fully calibrated and temperature compensated Digital I²C output interface High sensitivity for low airflow detection Fast response time Compact surface-mount package Low power consumption Electrical Characteristics Supply Voltage: 3.0 V to 3.6 V (typ. 3.3 V) Current Consumption: ~10 mA (typical during operation) Interface: I²C (up to 400 kHz) Output Type: Digital (flow velocity data) Performance Characteristics Flow Range: 0 to 7.23 m/s (air velocity) Accuracy: ±5% of reading (typical) Response Time: <10 ms Repeatability: High precision with low drift Mechanical Characteristics Package Type: Surface Mount (SMD) Dimensions: Approx. 4 mm × 4 mm × 1 mm Port Type: Top-port airflow sensing Environmental Specifications Operating Temperature Range: -20°C to +85°C Storage Temperature Range: -40°C to +125°C Pin Configuration (Typical) VDD – Power supply GND – Ground SCL – I²C clock line SDA – I²C data line ADDR/SEL – I²C address select (if applicable) Applications HVAC airflow monitoring Air purifiers and smart home systems Industrial gas flow measurement Medical airflow sensing devices Consumer electronics thermal management Compliance & Reliability RoHS compliant Factory calibrated Long-term stability with minimal recalibration required #commonpartslibrary #integratedcircuit #sensor

17 Position FFC, FPC Connector Contacts, Bottom 0.020" (0.50mm) Surface Mount, Right Angle The F300-1B7H1-11017-E100 is a board-to-board / mezzanine connector designed for high-density interconnections in compact electronic assemblies. It is typically used in applications requiring reliable signal transmission between stacked PCBs, offering precise alignment, robust mechanical retention, and consistent electrical performance. This type of connector is commonly found in industrial electronics, embedded systems, communication devices, and compact consumer electronics where space-saving and high pin-count connectivity are critical. Key Features High-density board-to-board connection Compact form factor for space-constrained designs Reliable contact system for stable signal integrity Precision alignment for accurate mating Durable construction for repeated mating cycles Suitable for high-speed and low-power signal transmission Electrical Characteristics Rated Voltage: Typically 30–100 V (application dependent) Current Rating: Typically 0.3–1.0 A per contact Contact Resistance: Low (typically < 50 mΩ) Insulation Resistance: High (≥ 100 MΩ) Dielectric Withstanding Voltage: ~250–500 VAC Mechanical Characteristics Mounting Type: Surface Mount (SMT) Mating Type: Board-to-board / mezzanine Contact Configuration: High pin-count array Pitch: Typically fine pitch (e.g., 0.3 mm – 0.8 mm range) Mating Cycles: 30–100 cycles (typical) Housing Material: High-temperature thermoplastic Contact Material: Copper alloy with gold plating Environmental Characteristics Operating Temperature Range: -40°C to +85°C (typical) RoHS Compliant: Yes Moisture Sensitivity Level: Standard SMT classification Applications Embedded systems Industrial control electronics Communication devices Portable and compact consumer electronics PCB stacking architectures Packaging Supplied in tape and reel for automated SMT assembly Notes Exact electrical and mechanical values may vary depending on manufacturer specifications and variant configuration Recommended to verify mating connector compatibility and stack height before design implementation Follow manufacturer PCB footprint guidelines for optimal performance #commonpartslibrary #connector

Connector Header Surface Mount, Right Angle 3 position 0.047" (1.20mm) The BM03B-ACHSS-GAN-TF(LF)(SN) is a compact surface-mount (SMD) right-angle header connector from JST’s ACH series. It is designed for wire-to-board connections in space-constrained electronic devices. This component features a 3-position (3-pin) male header with a 1.2 mm pitch, making it suitable for high-density PCB layouts where small size and reliable connectivity are required. It is commonly used in consumer electronics, embedded systems, and industrial devices where compact interconnections are needed. Key Features Connector Type: Rectangular header (male pins) Mounting Type: Surface-mount (SMD), right-angle orientation Number of Positions: 3 pins Pitch: 1.2 mm (fine pitch for compact designs) Current Rating: Up to 2 A Voltage Rating: 50 V Contact Plating: Gold-plated contacts (good conductivity & corrosion resistance) Material: Heat-resistant thermoplastic, UL94V-0 rated Operating Temperature: −25 °C to +85 °C Locking Mechanism: Detent lock for secure mating Design: Shrouded (3-wall) for alignment and protection Packaging: Tape & reel (ideal for automated assembly)

SMB, Fakra Connector Plug, Male Pin 50 Ohms Through Hole, Right Angle Solder The FA1-NDRP-PCB-8 is a PCB-mounted connector component typically used for reliable board-to-board or cable-to-board electrical interconnections in electronic systems. It is designed to provide stable mechanical retention and dependable signal or power transfer in compact PCB assemblies. Components in this series are commonly used in industrial equipment, consumer electronics, embedded systems, and communication devices. Key Features PCB-mount connector design for easy integration into electronic assemblies Supports secure electrical and mechanical connection Compact form factor suitable for space-constrained designs Durable housing and contact structure for repeated mating cycles Designed for stable signal and/or power transmission Typically used in control boards, interface modules, and embedded electronics Compatible with automated PCB assembly processes depending on package style Typical Applications Industrial control equipment Consumer electronics Embedded and IoT devices Communication hardware Interface and expansion boards #Connector #RF-connector #Coaxial

36.5 kOhms ±0.1% 0.063W, 1/16W Chip Resistor 0603 (1608 Metric) Anti-Sulfur, Automotive AEC-Q200 Thin Film The RGT1608P-3652-B-T5 is a precision surface-mount thick film chip resistor in a 0603 (1608 metric) package. It is designed for applications requiring tight tolerance and stable temperature performance. The component is suitable for high-accuracy circuits such as instrumentation, signal conditioning, and precision voltage division. Key Features Compact 0603 (1608 metric) SMD package High precision ±0.1% tolerance Low temperature coefficient Stable performance over wide temperature range Compatible with standard reflow soldering RoHS compliant and lead-free Electrical Characteristics Resistance Value: 36.5 kΩ Resistance Tolerance: ±0.1% (B) Temperature Coefficient: ±25 ppm/°C (typical) Rated Power: 0.1 W (1/10 W) Maximum Working Voltage: 75 V Maximum Overload Voltage: 150 V Mechanical Characteristics Package Size: 0603 (1608 Metric) Length: 1.6 mm Width: 0.8 mm Height: ~0.45 mm Environmental Specifications Operating Temperature Range: -55°C to +155°C Moisture Sensitivity Level: MSL 1 Thermal Shock: Meets standard IEC requirements Packaging Information Packaging Type: Tape and Reel (T5) Reel Quantity: Typically 5,000 pieces per reel Applications Precision analog circuits Voltage dividers Signal conditioning Measurement and instrumentation systems Industrial and consumer electronics #CommonPartsLibrary #Resistor

3 Position Wire to Board Terminal Block Horizontal with Board 0.138" (3.50mm) Through Hole The EBWA-03-A is typically identified as a 3-position board-to-wire connector (wafer/header type) used for making compact and reliable electrical connections between a PCB and external wiring harnesses. It is commonly used in consumer electronics, industrial control boards, and embedded systems, especially where a small, low-profile connector is required for signal or low-power connections. Note: The exact manufacturer and series naming for “EBWA-03-A” can vary depending on supplier, so slight differences in mechanical or electrical specs may exist across sources. 01x03 terminal block 3.50mm #CommonPartsLibrary #Connector #Terminal block

NAND Flash 3.3V 2Gb 24nm SLC NAND (EEPROM) FLASH - NAND (SLC) Memory IC 2Gbit Parallel 25 ns 67-VFBGA (6.5x8) The TC58NVG1S3HBAI6 is a 2-Gbit (256M × 8) SLC NAND flash memory device originally developed by Toshiba (now Kioxia). It is a CMOS-based, electrically erasable and programmable read-only memory (EEPROM) used to store data even when power is removed. This device uses Single-Level Cell (SLC) NAND technology, which offers high reliability, fast access time, and long endurance, making it suitable for industrial and embedded systems. Key Characteristics Memory Type: NAND Flash (Non-volatile) Technology: SLC (Single-Level Cell) Density: 2 Gbit (256M × 8 organization) Interface: Parallel I/O Supply Voltage: 2.7 V – 3.6 V Access Time: ~25 ns Package: 67-ball VFBGA (compact surface-mount) Functional Overview Organized into pages and blocks (typical NAND structure) Supports operations such as: Read Page program (write) Block erase Copy-back operations Uses shared I/O pins for address, data, and command input/output Internally, data is transferred between the memory array and internal registers in page-sized chunks (~2176 bytes including spare area). Typical Applications Embedded systems storage Firmware and boot memory Industrial control systems Data logging devices Consumer electronics (e.g., cameras, audio storage) #CommonPartsLibrary #IntegratedCircuit #memory #TC58NVG1