12MHz 20pF ±10ppm -40℃~+85℃ SMD3225-4P Crystals ROHS #crystal #oscillator #components #parts

TO-220 is a through-hole mount package for high-power electronic components. It has a rectangular body with dimensions of approximately 15.87 mm x 10.67 mm x 4.83 mm (L x W x H) and 3 pins with 2.54 mm lead spacing. Pin 1 is in the lower left corner when viewed from the front. The package is also known as TO-220AB or TO-220. #part #template

SOT-223-8 is a surface-mount package commonly used for electronic components. It features a body size of approximately 6.7 mm x 6.1 mm x 2.5 mm (L x W x H) with 8 pins and a lead pitch of 2.54 mm. Pin 1 is located in the lower left corner when viewed from the flat side. The package is also known as TO-261-8, D2PAK-8, or SC-73. #part #template

SOT-223-6 is a surface-mount package commonly used for electronic components. It has a body size of approximately 6.7 mm x 6.1 mm x 2.5 mm (L x W x H) with 6 pins and a lead pitch of 2.54 mm. Pin 1 is located in the lower left corner when viewed from the flat side. The package is also known as TO-261-6, D2PAK-6, or SC-73. #part #template

TO-263-5_TabPin6 is a surface-mount package commonly used for electronic components. It has a body size of approximately 16mmx11mm x5mm (L x W x H) with 5 pins and a tab pin configuration. The tab pin, labeled as Pin 6, is connected to the tab or heat sink of the package. The lead pitch between the other pins is typically P mm. The package is also known as D2PAK-5, DPAK-5, or DDPAK-5.

SOT-223-5 is a surface-mount package commonly used for electronic components. It features a body size of approximately 6.7 mm x 6.1 mm x 2.5 mm (L x W x H) with 5 pins and a lead pitch of 2.54 mm. Pin 1 is located in the lower left corner when viewed from the flat side. The package is also known as TO-261-5, D2PAK-5, and SC-73. #part #template

The ESD5Z Series is designed to protect voltage sensitive components from ESD and transient voltage events. Excellent clamping capability, low leakage, and fast response time, make these parts ideal for ESD protection on designs where board space is at a premium. SOD-523

The Chip-LED Taping is much smaller than lead frame type components, thus enable smaller board size, higher packing density, reduced storage space and finally smaller equipment to be obtained.