CoolSiC™ 1200 V SiC MOSFET G2 : Silicon Carbide MOSFET with .XT interconnection technology Features • VDSS = 1200 V at Tvj = 25°C • IDDC = 34 A at TC = 100°C • RDS(on) = 40 mΩ at VGS = 18 V, Tvj = 25°C • Very low switching losses • Overload operation up to Tvj = 200°C • Short circuit withstand time 2 µs • Benchmark gate threshold voltage, VGS(th) = 4.2 V • Robust against parasitic turn on, 0 V turn-off gate voltage can be applied • Robust body diode for hard commutation • .XT interconnection technology for best-in-class thermal performance • Suitable Infineon gate drivers can be found under https://www.infineon.com/gdfinder Potential applications • General purpose drives (GPD) • EV Charging • Online UPS/Industrial UPS • Solar power optimizer • String inverter • Energy Storage Systems (ESS) • Welding #CommonPartsLibrary #Transistor #FET #Mosfet #CoolSiC™ G2 IMZC120R040M2H

IC RF TxRx + MCU Cellular CDMA, GSM, HSPA, LTE, TD-SCDMA, WCDMA 100kHz ~ 3.8GHz 261-SMD Module The LMS7002M is a Field Programmable RF (FPRF) transceiver that can both transmit and receive radio signals over a very wide frequency range. It integrates most of the RF front-end and baseband processing functions into a single chip, minimizing the need for external components. Frequency range: 100 kHz to 3.8 GHz Architecture: Dual transceiver (2 TX + 2 RX) supporting 2×2 MIMO Bandwidth: Up to ~120–160 MHz RF bandwidth depending on configuration Technology: CMOS-based for low cost and power consumption Integrated blocks: ADCs & DACs (12-bit) LNAs and PA drivers Mixers, PLL synthesizers Filters and gain control On-chip DSP and microcontroller Transmit path: Digital baseband → DAC → filtering → RF upconversion → output Receive path: RF input → LNA → downconversion → filtering → ADC → digital processing This zero-IF (direct conversion) architecture simplifies design and supports wideband operation. #CommonPartsLibrary #IntegratedCircuit #LMS7002

240 Position Connector High Density Array, Male Surface Mount Gold The ADM6-60-01.5-L-4-2-A-TR is a compact board-to-board (BTB) mezzanine connector designed for high-density, low-profile interconnections between printed circuit boards (PCBs). It is commonly used in applications where space is limited but reliable multi-pin connectivity is required. Connector Type: Surface-mount, dual-row board-to-board connector Pitch: 1.5 mm Number of Positions: 60 pins Rows: 2 (30 pins per row) Mounting Style: SMT (Surface Mount Technology) Orientation: Typically vertical (mezzanine stacking) Contact Type: Female receptacle (usually mates with a corresponding male header) Compact Design: Optimized for space-constrained PCB layouts High Pin Density: 60 contacts in a small footprint Reliable Contact: Designed for stable electrical and mechanical connection Tape & Reel Packaging (TR): Suitable for automated assembly processes Stack Height: Fixed (around 4 mm, depending on variant) #CommonPartsLibrary #Connector #AcceleRate® ADM6

RF System on a Chip - SoC Cortex-M55 250MHz, 2.5D GPU, 4MB MRAM, 3.75MB SRAM, BLE5.4, -20 to +70 C, BGA , 1.71 V to 2.2 V -20C ~ 70C ARM® Cortex®-M55 System On Chip (SOC) IC Apollo510B 250MHz The AP510BFA-CBR is an ultra-low-power MCU System-on-Chip (SoC) designed for advanced embedded and edge-AI applications. It belongs to the Apollo510B series and integrates a powerful ARM Cortex-M55 processor optimized for both performance and energy efficiency. It combines processing, memory, and multiple peripherals into a single BGA package, making it suitable for compact and power-sensitive designs. Key Characteristics Core: ARM Cortex-M55 Max CPU Speed: 250 MHz Architecture: MCU / SoC Flash Memory: 4 MB RAM: ~3.75 MB Connectivity: I2C, SPI, UART, USB Wireless Support: Bluetooth 5.4 (variant dependent) Package: 153-BGA (compact high-density package) Key Features Built on Ambiq’s ultra-low-power SPOT technology Designed for battery-powered and energy-sensitive devices High computational performance for edge AI and DSP workloads Integrated peripherals for embedded system development Typical Applications Wearables (smartwatches, fitness bands) Smart home and IoT devices Edge AI / machine learning nodes Industrial sensors and monitoring systems Wireless communication modules #CommonPartsLibrary #IntegratedCircuit #SoC #Apollo510B

Pressure Sensor -0.07PSI ~ 0.07PSI (-0.5kPa ~ 0.5kPa) Differential Male - 0.08" (2.00mm) Tube, Dual 16b 16-SMD Module, Dual Top Ports The SDP31-500PA belongs to the SDP3x series and uses Sensirion’s CMOSens® technology to deliver accurate and stable pressure measurements. It is optimized for applications where small size, fast response, and high accuracy are critical. This sensor measures bidirectional differential pressure up to ±500 Pa, making it suitable for airflow and gas flow monitoring systems. It provides a fully calibrated, temperature-compensated digital output via I²C, simplifying integration with microcontrollers. Pressure type: Differential (±500 Pa range) High accuracy: حوالي ±3% of measured value Digital output: I²C interface with 16-bit resolution Fast response time: suitable for real-time measurements No zero-point drift: ensures long-term stability Compact size: ~8.5 × 5.5 × 5.15 mm Low voltage operation: typically 3.0–3.6 V Temperature compensated: reliable from −40°C to +85°C #CommonPartsLibrary #Sensor #SDP3x

70 Position Connector Receptacle, Center Strip Contacts Surface Mount Gold It is a 70-position, surface-mount receptacle connector with a 0.4 mm pitch, intended for stacking two PCBs with a 3.0 mm mated height. The connector belongs to the DF40 series, which is optimized for miniaturized, high-speed, and reliable interconnections in space-constrained applications. Connector type: Receptacle (female), board-to-board / mezzanine Number of contacts: 70 pins (2 rows) Pitch: 0.4 mm (fine pitch, high density) Mounting: Surface Mount Technology (SMT) Stacking height: 3.0 mm Contact plating: Gold (ensures reliable conductivity and durability) Rated current: ~0.3 A per contact Rated voltage: up to 50 V AC/DC Operating temperature: approx. –55 °C to +85 °C Durability: ~30 mating cycles Compact, low-profile design for thin devices High-speed signal capability (supports interfaces like USB, MIPI, PCIe) Self-alignment feature to improve mating accuracy Strong contact force with wipe action for stable electrical connection Shock absorption and solder wicking prevention for reliability #CommonPartsLibrary #Connector #DF40