The Wio-WM1110 is a fusion positioning module for developing low-power, long-range IoT applications. It's embedded with Semtech LR1110 and Nordic nRF52840, features Semtech's LoRa technology for long-range wireless communication, GNSS, Wi-Fi, and Bluetooth for location tracking services.

WiFi 802.11b/g/n Transceiver Module 2.4GHz ~ 2.5GHz Integrated, Trace Surface Mount The ESP-12F is a compact WiFi module based on the ESP8266EX, widely used in IoT and embedded systems due to its low cost and built-in networking capabilities. Integrated WiFi (2.4 GHz) Supports 802.11 b/g/n Built-in TCP/IP stack (no external WiFi processor needed) Microcontroller + WiFi in one Powered by the ESP8266EX SoC Can run user applications directly (not just a WiFi modem) Flash Memory Typically 4 MB SPI flash (varies by version) GPIO Support Multiple multifunction pins: Digital I/O PWM I2C SPI UART ADC (1 channel) Size: ~16 mm × 24 mm Mounting: Castellated SMD module Antenna: Built-in PCB trace antenna (requires proper keepout zone) Power Requirements Operating Voltage: 3.0V – 3.6V (typical 3.3V) Current Consumption: Idle: ~70 mA Peak (TX): up to ~300 mA Common Interfaces UART – programming and debugging SPI – peripheral communication I2C (software-based) GPIO – general-purpose control #commonpartslibrary #transceiver #module #wireless #rf #wifi

GSM Quad-Band Communication Module, GPRS, Audio Engine, AT Command Set, Bluetooth is Optional #commonpartslibrary #GSM #Cellular #GPRS #Transceiver #RF #integratedcircuit

Connector Header Through Hole 6 position 0.100" Pin Header 1x06 2.54mm PinHeader 1x6 2.54mm The TSW-106-07-G-S is a through-hole vertical header designed for board-to-board and board-to-wire interconnection in electronic systems. It is part of a precision connector series known for high reliability, consistent mechanical alignment, and excellent electrical performance. The component is commonly used in applications requiring modular connectivity, prototyping flexibility, and secure signal routing between printed circuit boards or peripheral interfaces. Its design supports repeated mating cycles while maintaining stable contact integrity, making it suitable for both development and production environments. Functional Description This component functions as a single-row header that provides a direct electrical interface between a printed circuit board and a mating connector or cable assembly. It enables straightforward signal or power routing through plated pins that are soldered into the PCB. The vertical orientation allows perpendicular mating, supporting compact and efficient board layouts. The connector is designed to ensure proper alignment and retention during mating, reducing the risk of intermittent connections. Electrical Characteristics The header supports low-voltage signal transmission and moderate current levels typical of board-level interconnects. It offers low contact resistance to maintain signal integrity and efficient current flow. The contact system is designed to provide consistent electrical performance across repeated insertions, ensuring reliability in both signal and power applications. Mechanical Characteristics The component features a robust insulating housing that maintains pin alignment and structural integrity during handling and operation. The contact pins are fabricated from conductive material and plated to enhance durability, conductivity, and مقاومت to corrosion. The through-hole mounting style provides strong mechanical anchoring to the printed circuit board, improving resistance to mechanical stress and vibration. The design supports reliable mating with compatible connectors and ensures long service life. Environmental Characteristics The TSW-106-07-G-S is constructed using materials that provide stable performance under typical environmental conditions encountered in electronic assemblies. It is designed to withstand standard temperature ranges and environmental stresses such as humidity and mechanical handling, maintaining electrical and mechanical reliability over time. Applications This header is widely used in embedded systems, industrial electronics, development platforms, communication equipment, and general-purpose PCB interconnect applications. It is especially suited for designs requiring modular connectivity, easy assembly, and dependable signal transfer. Summary The TSW-106-07-G-S from Samtec is a reliable through-hole header solution that combines mechanical durability with stable electrical performance. Its straightforward design, compatibility with standard interconnect systems, and suitability for a wide range of applications make it a common choice for board-level connectivity in modern electronic designs. #CommonPartsLibrary #Connector #Header #TSW

802.15.4, Bluetooth, WiFi Bluetooth v5.0, Zigbee Transceiver Module 2.4GHz PCB Trace Surface Mount The ESP32-C6-WROOM-1-N8 integrates a 32-bit RISC-V single-core processor running up to 160 MHz, along with 8 MB of embedded SPI flash memory. It supports multiple wireless communication protocols, including: Wi-Fi 6 (802.11ax) in the 2.4 GHz band for improved efficiency and lower latency Bluetooth Low Energy (BLE 5) for short-range communication IEEE 802.15.4 for protocols such as Thread and Zigbee The module features a built-in PCB antenna, RF circuitry, crystal oscillator, and passive components, making it a complete solution that simplifies hardware design. It provides a wide range of GPIO pins and peripheral interfaces such as UART, SPI, I2C, PWM, ADC, and more, enabling flexible integration with sensors and external devices. Designed for low power consumption, it includes multiple power-saving modes, making it suitable for battery-powered applications. Typical Applications Smart home and IoT devices Wireless sensors and control systems Industrial automation Smart lighting and energy management Matter-compatible devices (via Thread support)

The ESP32-DEVKITC-VE evaluation kit from Espressif Systems is a high-performance development platform for RF, RFID, and wireless applications. It features the ESP32-WROVER-E with embedded Xtensa dual-core 32-bit LX6 microprocessor running up to 240 MHz, with 8MB Flash and 8MB PSRAM for efficient data processing. This board supports Wi-Fi 802.11 b/g/n and Bluetooth® Smart Ready 4.x (BLE) connectivity at 2.4GHz, offering wireless communication options. With 448KB ROM, 520KB SRAM, and 16KB SRAM in RTC, it provides ample memory for complex applications. It includes up to 24 GPIOs, SD card, UART, SPI, SDIO, I2C, LED and motor PWM, I2S, IR, pulse counter, capacitive touch sensor, ADC, DAC, and TWAI® (compatible with ISO 11898-1/CAN 2.0) #commonpartslibrary #ESP32-WROVER-E #evaluationboard

The Arduino Nano 33 IoT (ABX00027) is an advanced evaluation platform designed for IoT applications, featuring the 32 bit ARM® Cortex®-M0+ ATSAMD21G18A MCU. This board supports WiFi and Bluetooth connectivity by utilizing the Nina W102 uBlox module, making it ideal for wireless projects. It operates at a clock speed of 48MHz and uses a 3.3V logic level. The board is equipped with 22 digital I/O pins, 8 analog inputs, and supports PWM on 5 pins. It offers communication via UART, I2C and SPI. #Module #part #SAM D, Maker

100 Position Connector Receptacle, Center Strip Contacts Surface Mount Gold It is a 100-pin surface-mount receptacle connector used to connect two PCBs in a stacked configuration. The DF40HC series is known for ultra-fine pitch and high-speed signal capability, making it suitable for modern embedded and communication systems. Connector type: Board-to-board (mezzanine), receptacle Number of contacts: 100 positions (2-row layout) Pitch: 0.4 mm (very fine pitch for high-density routing) Stacking height: 3.0 mm (fixed mated height) Mounting: Surface-mount (SMT) Orientation: Straight Contact plating: Gold (for reliable conductivity and corrosion resistance) Rated current: 0.3 A per contact Rated voltage: 50 V AC/DC Contact resistance: ≤ 90 mΩ Withstanding voltage: 150 V max High-speed capability: up to 20 Gbps, supports interfaces like: USB 3.1 / USB 3.0 PCIe SATA MIPI Connector size: Length: ~22.6 mm Width: ~3.38 mm Height: ~2.9 mm Mating durability: ~30 cycles Operating temperature: -55°C to +85°C #CommonPartsLibrary #Connector #Mezzanine-connector #DF40

Seeed Studio CAN Bus Breakout Board is an expansion board compatible with all XIAO development boards. The integration of the MCP2515 controller and SN65HVD230 transceiver chips on the expansion board ensures seamless and efficient communication over the CAN Bus.

Solid State Photo-Coupled Relay (Photorelay) SPST-NO (1 Form A) 4-SOP (0.179", 4.55mm) The G3VM-61VY3(TR05) is a single-pole, single-throw normally open (SPST-NO) solid-state relay that uses an LED input and MOSFET output to switch AC or DC loads without mechanical contacts. It provides fast, silent, and highly reliable switching in a very small surface-mount package. Key Characteristics Relay Type: Solid State Relay (Photorelay) Contact Form: SPST-NO (1 Form A) Output Type: MOSFET Load Voltage: Up to 60 V AC/DC Load Current: Up to 700 mA On-Resistance: ~2 Ω max Input Control: LED-driven (low current DC input) Isolation Voltage: ~3.75 kV (input to output) Package: SOP-4 surface-mount (compact form factor) Packaging Option: TR = Tape & Reel for automated assembly How It Works The input LED is energized with a small DC current. It activates an internal photo-coupler. This drives a pair of MOSFETs, turning the load ON or OFF. No mechanical movement → no arcing or contact wear. Key Advantages Silent operation (no clicking sound) Very long life (no mechanical parts) Fast switching speed Compact size for dense PCB layouts Low leakage and stable performance Typical Applications Semiconductor test equipment Industrial control systems Battery-powered devices Data acquisition systems Communication and measurement circuits General-purpose signal switching #CommonPartsLibrary #Relay #SSR #G3VM

19 Position Header Connector 0.100" (2.54mm) Through Hole Tin This component is a single-row female header connector designed for general-purpose board-to-board and wire-to-board interconnections. It provides a reliable and cost-effective solution for standard pitch connectivity in electronic assemblies. The connector is commonly used in prototyping, development boards, and production systems where modular connections and ease of assembly are required. Its design supports compatibility with standard male pin headers, making it suitable for a wide range of applications in industrial, consumer, and embedded electronics. Key Features The connector features a single-row configuration with standard pitch spacing, enabling compatibility with widely used pin header systems. It is constructed with durable insulating material and conductive contacts that provide stable electrical performance. The contacts are designed to ensure consistent mating force and reliable signal transmission. The component supports through-hole mounting for strong mechanical retention and ease of soldering. Its construction allows repeated mating cycles while maintaining contact integrity. Electrical Characteristics The connector is designed to support typical signal and low-power applications in electronic circuits. It provides consistent electrical contact with low contact resistance and stable conductivity under normal operating conditions. The materials and plating are selected to ensure reliable performance over time, minimizing oxidation and degradation during use. Mechanical and Material Characteristics The housing is made from a high-temperature thermoplastic material suitable for standard soldering processes. The contacts are formed from conductive metal alloy and finished with a protective plating to enhance durability and conductivity. The connector is designed for vertical mounting orientation and aligns with standard printed circuit board layouts for through-hole components. Thermal Characteristics The component is suitable for typical operating temperature ranges encountered in electronic assemblies. The housing material is resistant to heat generated during soldering and normal operation, ensuring structural integrity and long-term reliability. Applications This connector is widely used in embedded systems, development platforms, consumer electronics, industrial control systems, and communication equipment. It is ideal for applications requiring modular connectivity, easy replacement, and reliable electrical interfacing between boards or components. Compliance and Standards The component is manufactured in accordance with industry standards for electronic connectors and is suitable for use in systems requiring dependable mechanical and electrical performance. It supports common environmental and material compliance requirements for modern electronic manufacturing. #commonpartslibrary #connector #header

2 Channel AFE 16 Bit 24-UQFN (4x4) The AFE881H1RRUR is a highly integrated analog front-end (AFE) designed for multi-channel data acquisition systems. It combines precision analog signal conditioning with high-speed analog-to-digital conversion, making it suitable for applications such as medical instrumentation, industrial measurement, and test and measurement equipment. The device integrates low-noise amplifiers, programmable gain stages, anti-aliasing filters, and high-resolution ADCs into a compact package, reducing system complexity and board space. Key Features Multi-channel analog front-end integration High-resolution analog-to-digital conversion Low-noise input stage for precision measurements Programmable gain amplifier (PGA) Integrated anti-aliasing filters High sampling rate capability Serial digital interface (SPI-compatible) Low power consumption for portable systems Compact surface-mount package Electrical Characteristics (Typical – refer to datasheet for exact values) Supply Voltage: ~1.8 V to 3.3 V (analog/digital domains) Input Voltage Range: Dependent on configuration Resolution: Up to 16-bit or higher (device dependent) Sampling Rate: Up to several MSPS (depending on mode) Power Consumption: Optimized for performance/power balance Functional Blocks Low-noise input buffer Programmable gain amplifier (PGA) Anti-aliasing filter High-speed ADC core Digital control interface (SPI) Clock management circuitry Package Information Package Type: QFN / VQFN (exact variant per TI RRU package code) Mounting Type: Surface Mount Pin Count: Typically 40+ pins (refer to datasheet for exact count) Applications Medical imaging and instrumentation Industrial data acquisition systems Oscilloscopes and test equipment Communication systems Precision sensor interfaces Advantages High integration reduces external components Improved signal integrity due to low-noise design Flexible configuration via programmable gain Compact footprint for dense PCB layouts Notes Exact electrical parameters, pin configuration, and performance metrics must be verified in the official Texas Instruments datasheet. Proper PCB layout (grounding, shielding, and decoupling) is critical for optimal performance. #commonpartslibrary #integratedcircuit