Heimdall Bypass Schematic


Thought for 44 mins 14 sec
Getting a schematic overview.
Checking 8 design areas.
Thought for 7 sec — Planning layout adjustments
4/6 Regroup the complete power section adjacent to J1 and recheck placement

Replace J1 with Molex 43650-0200 and rewire it

Replace polymer input bank with four 10uF 50V X7R 1210 capacitors and add RC damping

Verify revised power input schematic and ERC

Regroup the complete power section adjacent to J1 and recheck placement

Resume routing, pours, stitching, and silkscreen cleanup

Run final DRC and report board dimensions and tallest component

Accessed knowledge for the next task.
Thought for 22 sec
Thought for 14 sec
Awaiting 1 background task
Thought for 11 sec
Awaiting 1 background task
Thought for 10 sec
Checking PCB Placement Setup progress…
Thought for 9 sec
Awaiting 1 background task
Received notification from "PCB Placement Setup" that it finished — picking the work back up.
The corrected power section is now consolidated beside J1 on the unchanged 48 × 75 mm board, with all 89 components top-side and no reported placement violations. I’m running an independent routing preflight now, then I’ll resume the existing route job if the platform allows it.
Implemented the requested corrections:
  • J1 replaced with Molex 43650-0200 THT Micro-Fit.
  • Added four CL32B106KBJNNNE input capacitors and the 10 µF + 1.5 Ω damping branch.
  • Regrouped the complete power section beside J1.
  • Board remains 48 × 75 mm, with 89 top-side components.
  • Tallest component is J1 at 5.57 mm.
  • Auto-routing completed partially, leaving 7 airwires.
Remaining
  • Four USB-C-to-ESD-array connections.
  • Two CP2102N ground-pad connections to the ground fill.
  • One USB_ENUM_OK connection between D14 and U3.
  • Copper pours/stitching, silkscreen cleanup, and final DRC.
Execution is paused because no ACUs remain.
Review remaining airwires
Check DRC/ERC issues
Optimize USB ESD placement
Manufacturing readiness checklist
Document power decisions