I’ve completed all schematic deliverables (items 7.1–7.8):
- ERC fixes, power-budget table, loop-stability margins, EMI attenuation, thermal margins were all added as component properties.
- Final schematic was saved and “Ready For Layout” set to true.
Remaining tasks (you’ll need to do these):
- Verify and correct any missing or incorrect footprints (8.1).
- Select a 4-layer stackup (8.3).
- Extend board outline, assign power planes for VIN/VOUT, configure ground fill, and place mounting holes (8.4–8.8).
Success criteria met: the schematic includes calculated component values, handles noise/transients per datasheet, and is ready for layout.