Electrical Verification


do not place just route
Routing requires Agent mode to inspect the updated PCB, check routing feasibility, route all nets, and verify remaining airwires/DRC.
Understood: routing only—no component placement or movement. Switch to Agent mode to route the existing placement and verify all airwires and routing DRC.
Continue in Agent Mode
I’ll preserve the current placement, run a routing feasibility check, route the board, then verify remaining airwires and routing DRC.
Auto-routing converged with the existing placement: all nets are routed. I’m running the final airwire and DRC verification now; no components were moved.
Board routing completed without moving components.
  • 0 airwires
  • 0 dangling traces
  • No routing-related DRC errors or warnings
  • Auto-router noted one skipped decoupling-routing preference on GND, but the net is fully routed and DRC-clean.
Review route quality
Clean up decoupling
Manufacturing readiness
Export fabrication files

Schematic Verification Report
Completion Status
  • Completed: full electrical schematic, all specified connectors, passives, active devices, test points, M3 NPTH holes, functional groups, and unused ESP32 no-connect markings.
  • Completed: electrical rule review with no open ERC errors or warnings.
  • Completed: explicit isolation inspection for L12V and R12V.
  • Completed: DC simulation of the mirrored throttle channels.
  • Not attempted: PCB layout, placement, routing, or board outline.
Sourced Parts

Table


FunctionSelected partEvidence / sourcing note
Controller moduleCustom published DOIT ESP32 DEVKIT V1 30-PIN, part UID 4cfa3351-8811-41ed-8053-a7a91193dcecCreated from public 30-pin pinout and nominal geometry; independently verified in its part project.
Dual op ampMicrochip MCP6002-I/P, PDIP-8Flux library exact match; Microchip datasheet confirms pins 1-8 and 1.8-6.0 V operation.
Isolated contactsPanasonic AQY212EH, DIP-4, LCSC C2894775Flux/LCSC library; Panasonic GE DIP4 datasheet confirms 1-Form-A, LED pins 1-2 and contact pins 3-4.
Zenersonsemi 1N5231BTR, DO-355.1 V nominal, 500 mW; cathodes connected to LAMP/RAMP.
J1KEFA KF128-5.08-2P-AA, LCSC C4749522-position 5.08 mm through-hole screw terminal.
J2Phoenix Contact 17291606-position 5.08 mm through-hole screw terminal; distributor metadata includes LCSC availability.
J4/J5Phoenix Contact 17025585-position 5.08 mm through-hole screw terminal, 20 A/400 V family.
Test pointsKeystone 4952, LCSC C238118Through-hole probe loop.
Mounting3.2 mm NPTH / 7.4 mm no-copper mounting-hole partFour instances H1-H4.
C1HRK CD110 10 uF / 50 V radial electrolytic, LCSC C2960373Higher than requested preferred 25 V rating.
Connectivity Evidence
  • 61 schematic components and 33 named nets.
  • J1/J2/J4/J5 pin memberships match the requested order.
  • MCP6002 pin mapping verified: VOUTA=1, VINA-=2, VINA+=3, VSS=4, VINB+=5, VINB-=6, VOUTB=7, VDD=8.
  • Both ESP32 GND pins connect to logic GND; VIN connects only to +5V; 3V3 connects to J2 and R5.
  • All 19 test points are connected to their named requested nets.
Isolation Boundary Evidence
  • L12V has exactly J4 pin 3, U2 pin 4, U3 pin 4, TP14.
  • R12V has exactly J5 pin 3, U4 pin 4, U5 pin 4, TP17.
  • Neither L12V nor R12V contains a GND, +5V, or +3V3 pin.
  • L12V and R12V are distinct nets and do not share any component pin.
  • Contact outputs are limited to their own PhotoMOS contact, connector pin, and test point.
ERC / Review
  • Electrical review returned no checks in ERROR, WARNING, OPEN, or UNCERTAIN state.
  • All unused ESP32 pins and mechanical mounting-hole schematic terminals are intentionally marked no-connect.
  • Manufacturing review still flags 25 generic passives for missing manufacturer MPNs; this is a BOM finalization item, not an electrical/ERC defect.
Analog Simulation
  • Simulated both MCP6002 channels from 0-3.3 V input on a 5 V supply.
  • LAMP/RAMP linear gain: 1.30000 V/V.
  • Connector-side LTHR/RTHR gain: 1.28712 V/V due to the 1 kOhm / 100 kOhm divider.
  • At 3.3 V input: LAMP/RAMP approximately 4.290 V and LTHR/RTHR approximately 4.248 V.
  • No clipping occurs over 0-3.3 V; high-rail compression begins around 3.81 V input.
Footprint Risk
  • Public sources agree on 30 pins and 2.54 mm pitch, but clone body dimensions vary. The created footprint uses 25.4 mm row spacing, 1.0 mm drill, and 1.8 mm pads.
  • Before PCB fabrication, physically measure the delivered module's row spacing, body width/length, USB protrusion, button envelope, and antenna end. This is the only material unresolved fit risk.
Exact Blockers
  • No electrical blocker remains.
  • Final procurement-grade BOM is blocked only by selection of exact manufacturer MPNs for generic R1-R23 and C2-C3.
  • PCB layout must not begin until the user's actual DevKit dimensions are checked against the nominal footprint.
  • Completion Status

  • Sourced Parts

  • Connectivity Evidence

  • Isolation Boundary Evidence

  • ERC / Review

  • Analog Simulation

  • Footprint Risk

  • Exact Blockers